SOP封装工艺流程介绍课件

1、SOP ASSEMBLY PROCESS FLOW & QUALITY CONTROL INSTRUCTION,1,PPT学习交流,Contents,Package Instruction Process Flow Quality Control,2,PPT学习交流,Package Instruction,SOP,SSOP,3. TSSOP,4. MFP,ASE,ASE,3,PPT学习交流,Package Instruction,4,PPT学习交流,ASY process flow,Wafer Saw,Die Attach,Wire Bond,Wafer Mount,Wafer Grindin

2、g,Epoxy Cure,Molding,Post Mold Cure,Plating,Trim/Form,Packing & Shipping,De-junk,Laser Marking,前段制程,后段制程,Wafer,Die (chip),Die on Lead frame,Before,After,Laser Marking,Laser Marking,Laser Marking,5,PPT学习交流,Wafer Grinding,LOAD,UNLOAD,GRINGING,Purpose: Grinding the wafer to Customer required thickness,

3、Wafer Grinding,晶圓 (未研磨),研磨機,晶圓 (研磨後),6,PPT学习交流,晶元背面Wafer backside,Frame,Mount Tape,Purpose: Combine the wafer with Dicing tape onto the frame for die sawing,Wafer mount Machine,Wafer Mount,Frame,7,PPT学习交流,Purpose: To separate dies from each other for die attach,Monitor,Load/Unload,Sawing,Cleaning,Ma

4、chine,Wafer Saw,8,PPT学习交流,Before wafer saw:,After wafer saw:,Wafer Saw,9,PPT学习交流,Purpose: Attach the dies with epoxy on substrate for the following process,Die Attach,Output,Die bond,Substrate load bond,10,PPT学习交流,Working flow:,Die Attach,Robber tip,Lead-frame,11,PPT学习交流,Purpose: Solidify the epoxy

5、after D/A,Inside,Oven,Epoxy Cure,12,PPT学习交流,Purpose: Connecting the chip and the exterior circuit,input,Theory: Use ultrasonic, thermal, force to form the intermetallic between golden wire and joint metal (Al, Au, Ag),Wire Bond,13,PPT学习交流,Mold Machine,Molding,Purpose: Seal the product with EMC to pr

6、event die, gold wire from being damaged, contaminated and oxygenic.,14,PPT学习交流,Molding,Molding,Top chase,Air vent,Bottom chase,Cavity,Leadframe,Plunger,Pot,Gate insert,Runner,Compound,Bottom cull block,Top cull block,15,PPT学习交流,Molding,Molding,Top chase,Air vent,Bottom chase,Cavity,Leadframe,Pot,Gat

7、e insert,Runner,Compound,Bottom cull block,Top cull block,Plunger,16,PPT学习交流,Molding,Molding,Top chase,Air vent,Bottom chase,Cavity,Leadframe,Pot,Gate insert,Runner,Compound,Bottom cull block,Top cull block,Plunger,17,PPT学习交流,Molding,After Mold,Molding,Top chase,Air vent,Bottom chase,Cavity,Leadfram

8、e,Pot,Gate insert,Runner,Compound,Bottom cull block,Top cull block,Plunger,18,PPT学习交流,Purpose： Use laser light irradiated by CO2 or YAG to vapour the EMC to show content on the package，such as date, schedule, place of production and so on.,Laser Marking,laser,EMC vapoured,Before,After,Laser marking,

9、19,PPT学习交流,Oven,Inside,Purpose: To let EMC react completely so that products can be protected more effectively.,Post mold cure,20,PPT学习交流,De-junk,Purpose： Remove the dem-bar of leadframe.,Working area,Before,After,Laser Marking,Laser Marking,21,PPT学习交流,Plating,Purpose: To plating Sn on the lead whic

10、h will mount on board pad.,load,unload,Plating line,22,PPT学习交流,Plating,After,Before,23,PPT学习交流,Purpose: Remove the tie-bar and lead-frame and form products to units from strips, fill them into tubes and then pass to next process.,Trim Form,Saw work area,unload,Working area,unload,Laser marking,24,PP

11、T学习交流,Trim Form,Working area,Laser marking,Lead Cut,Forming,25,PPT学习交流,Quality Control,Die Saw,切偏,Chipping,外观检查,划片宽度量测,Rej,Rej,26,PPT学习交流,Quality Control,Die Shear,Epoxy Void Check,Die Attach,27,PPT学习交流,Quality Control,Epoxy Thickness & Fillet Height,Die Attach,Die Location,Rej,28,PPT学习交流,Quality Co

12、ntrol,Wire Bond,外观检查,第二焊点重叠,Rej,Rej,Rej,Rej,第二焊点偏移,线弧不良,Rej,Rej,29,PPT学习交流,Quality Control,推球测试,拉力测试,Wire Bond,30,PPT学习交流,Quality Control,Wire Bond,验证级工程确认,IMC Coverage,IMC Thickness,Crater Test,1st bond,1st bond,2nd bond,Looping,31,PPT学习交流,Quality Control,Mold,Looping,外观检查,上下错位,孔洞,缺角,溢胶,内部气泡,冲线值量测,Rej,Rej,Rej,Rej,Rej,32,PPT学习交流,Plating,外观检查,Solder