杜邦产品介绍(PPT41).ppt

1、Introduction to Flexible Circuit Materials,Presented by: Jonathan C. Li,m,Part II : ( 40 minutes),簡報大綱,軟性電路板基材之介紹 基材的主要Composition Dielectric Substrates (絕緣體) Adhesive (膠質) Conductor (導體),m,簡報大綱 (continue),杜邦產品 壓克力膠系列(Modified WA Acrylic)之基材 環亞樹脂膠系列(Modified Epoxy)之基材 杜邦 料號解說 Pyralux Telcam,m,軟性電路板之

2、主要基材,Copper Clad Laminates (銅箔基材) Single-Sided C.C.L.(單面銅箔基材),Adhesive,Conductor,Dielectric Substrate,m,Double-Sided C.C.L. .(雙面銅箔基材),Conductor,Dielectric Substrate,Adhesive,軟性電路板之主要基材,m,Adhesive-Less C.C.L. .(無膠銅箔基材),Dielectric Substrate,Conductor,軟性電路板之主要基材,m,Coverlay(覆蓋膜),軟性電路板之主要基材,m,Stiffner (補

3、強材),軟性電路板之主要基材,Dielectric Substrate,Adhesive,m,Bondply,Dielectric Substrate,Adhesive,Adhesive,軟性電路板之主要基材,m,Mylar,Adhesive,Kapton,Adhesive,Sheet Adhesive PhotoImageable Coverlay (PIC) Dry Film Fine-Line Application Camera Automotive Others,軟性電路板之主要基材,m,Dielectric Substrates,Definition A base film on

4、which the printed conductors are laid. A film which provides electrical insulation between conductors. A film which provides mechanical strength of the circuit.,m,必備之特性 Mechanical Strength Flexibility Dimensional Stability Dielectric Properties Thermal Properties Chemical Resistance Moisture Absorpt

5、ion Cost,Dielectric Substrates,m,Substrates 之種類 Polyimide Polyester Fluorocarbon Aramid Paper Composite,Dielectric Substrates,m,Polyimide: Popularized by DuPont under “Kapton” Also known as PI First choice of film in most FPC Infusible and flame retardant High Tg (約 260C - 280C) Good dimensional sta

6、bility,Substrates,m,Substrates,Polyester: Popularized by DuPont under “Mylar” Also known as PET Lowest cost dielectric material Mostly used in low-cost consumer application Good mechanical properties Bad thermal properties,m,Substrates,Aramid Paper: Sold under DuPont trade name “Nomex” Used in speci

7、alized application Good thermal insulation material,m,Property Polyester Polyimide Fluorocarbon Aramid Paper Composite,Tensile Strength Excellent Excellent Fair Good Best,Flexibility Excellent Excellent Excellent Good Fair/Good,Dim. Stability Fair/Good Good Fair Good Fair/Good,Dielectric Str. Good G

8、ood Very Good Very Good Good,Solderibility Poor Excellent Fair Excellent Excellent,C.O.T. (C) 105 200-230 150-180 220 105-180,Thermal Exp. Low Low High Moderate Low,Chem. Resist. Good Good Excellent Very Good Fair,Moisture Absorp. Very Low High Very Low Very High Low,Cost Low High High Moderate Mode

9、rate,Trade Name Mylar Kapton Teflon/Tedlar Nomex,Dielectric Substrates,m,Adhesive,Definition Material that bonds layers together Thermosetting Thermoplastic,m,Adhesive,必備之特性 Adhesion Strength Flexibility Chemical Resistance Thermal Resistance Moisture Absorption Electrical Properties Cost,m,Adhesive

10、,Adhesive之種類 Polyester Acrylic Epoxy Polyimide Butyral Phenolic,m,Adhesive,Polyester: Used where the dielectric is also polyester Used where no soldering is needed Typical application: Instant camera film interconnects Instrument cluster connection in automobiles,m,Adhesive,Acrylic: Used in demandin

11、g temperature requirement application Most popular acrylic system is Pyralux by DuPont Excellent adhesion,m,Adhesive,Epoxy: Widely used adhesive system Generally lower cost than acrylic Able to stand wave soldering Good in high temperature for long period of time (400 to 450 F),m,Adhesive,Polyimide:

12、 Used in adhesiveless ccl and coverlay Used where dimension stability is critical Used in high temperature application High moisture absorption,m,Adhesive,Polyester,Acrylic,Epoxy,Polyimide,Butyral Phenolic,Temp.Resist.,Chem.Resit.,Elec.Prop.,Adhesion,Flexibility,Cost,Moisture,Fair,Good,Excellent,Exc

13、ellent,Excellent,Low,Fair,Very Good,Good,Good,Excellent,Very Good,Good,Good,Good,Good,Good,Excellent,Excellent,Excellent,Good,Good,Good,Good,Good,Good,Moderate,Fair,Fair,Very High,Poor,Fair,Fair,High,Moderate,Poor,m,Conductors/Foil,Major types of conductors Metals Metal alloys conductive inks Copper

14、 (the most commonly used conductor in FPC) Electrolytically deposited copper (ED) Rolled Annealed copper (RA),m,Conductors/Foil,必備之特性 Current-carrying capacity Flexibility Service temperature Chemical resistance Mechanical strength Cost,m,Conductors/Foil,Electrical Properties,Thermal Properties,Mech

15、anical Properties,Relative Cost,Aluminum,Copper,Gold,Nickel,Silver,Excellent,Good,Excellent,Excellent,Excellent,Excellent,Excellent,Excellent,Good,Good,Good,Good,Good,Fair,Fair/Good,Fair,Fair,Very Good,Very Good,Best,m,軟板基材製造過程,Copper Roll,Kapton Roll,Copper Clad Laminate,Heater 1,Heater 2,Liquid Ad

16、hesive,Aging,m,Introduction to DuPont Products,m,Part III: ( 15 minutes),DuPont Product Family,Pyralux Pyralux FR Pyralux LF Pyralux AP Pyralux PC,Teclam Teclam FNC Teclam DNC,Pyralux ,FR - series (Acrylic Based) Copper-Clad Laminates Panel Form Packaging. (24” x 36”) UL Approved. (File# E124294) Ve

17、ry Good Flexure Endurance Ex. FR9111, FR9110, FR8510, FR8515 Coverlay Roll Form Packaging. (24” x 250) UL Approved. (File# E124294) Excellent Dimensional Stability Ex. FR0110, FR0210,m,Pyralux ,FR continue. Sheet Adhesive Roll Form Packaging. (24” x 250) UL Approved Ex. FR0100, FR0200 Bond Ply Roll

18、Form Packaging. (24” x 250) UL Approved Ex. FR0111, FR0212,m,Pyralux ,LF - series (Acrylic Based) Military Specifications Excellent Flexure Endurance Very Good for High-Density Circuitry Same Product Offerings as FR - series PC - series (Acrylic, urethane, & imide-based) Dry Film Photoimageable Cove

19、rlay Cameras & Automotive Applications,m,Pyralux P/Ns,FR 9 111,CuPICu,7 - Special construction 8 - 1/2oz. C.C.L. 9 - 1oz or more C.C.L.,5 - 1/2 oz. Cu 1 - 1 oz. Cu 2 - 2 oz. Cu,1 - 1 mil PI 2 - 2 mil PI 3 - 3 mil PI,FR LF AP,Copper-Clad Laminates,m,Pyralux P/Ns,FR 0 111,Adh.PIAdh.,FR LF AP,7 - Special construction 0 - Coverlay or Sheet Adhesive,1 - 1 mil adhesive 2 - 2 mil adhesive 3 - 3 mil adhesive,1 - 1 mil PI 2 - 2 mil PI 3 - 3 mil PI,Coverlay & Sheet Adhesive,m,Teclam ,FNC - series Copper-Clad Lamina