导光板热压加工技术

1、(Roger Hsu)導導光光板板2010轉熱熱印壓壓技-03術加加-24部工工技技術術許建宏Highly Conf identialOutlineHighly Conf identialHighly Conf identialIntroductionHot Embossing ProcessExam p l e:MattestamperPMMAV-corestamperBoth sides of the work piece can be molded withstructure .Highly Conf identialFlow chart板板材材切切割割保保護護膜膜移移除除壓壓Highl

2、y離離加加縮縮冷冷成成模模熱熱卻卻形形Conf identialPolymersThermosetsThermoplasticsElastomer sThermosetsThermoplasticsElastomer samorphousA m orp h ou sA m orp h ou sCrysta l lin eCrysta l lin eThermoplastics(Semi)Cr ystalline polymers ( e.g. PE, PP, ny lon, etc.Amorphous polymers(e.g. PS,PMMA, PC,ABS, etc.crystalline

3、端端面面機機械械拋拋光光雷雷刀刀沖沖射射具具壓壓加加工工 模模仁仁雙雙/治治面面具具貼貼保保準準護護備備膜膜 HotHot EmbossingHighlyEmbossingConfidentialHighly Conf identialGlass Transition Temperature ()Tg : glassy amorphous polymers become flexible as a result of theonset of segmental motion.Melting Point ()Tm : Temperature at which total chain mobili

4、ty occurs (TmTg)At Tg, the amorphous region changes from a hard and glass-like stateto a rubbery state.The amorphous regions : respond to Tg.The crystalline regions: usually in the form of spherulites melt at a specific temperature, the melting point (Tm)高分子材料特性Highly Conf identialT g熔化溫度T fTg玻璃轉換溫度

5、Tf T gTg for common amorphouspolymersPS 100 CPC 150 CPMMA 105 CRigid PVC 83 CTgHighly Conf identialPVT Characteristics for Amorphous ResinsI ncreasi ngPressu reAP - Pressure熱機械曲線SpecificVolumeVV - SpecificVolumeBT - TemperatureTem peratu reA: Polymer melt into themold high temp and high pressureB: P

6、art solidifies at lower temp and lower pressure specific volume decreasesV :volume shrinkageHighly Conf identialHot Embossing Machine CategoriesHighly Conf identialHE TechnologyHot EmbossingTechnology/10Highly Conf identialHE TechnologyHeat Co n d uct io nSt r engt h T em p erat ureDurabilit yHE M o

7、ldAccuracy St amp erVa cuu mHighly Conf idential (,)Highly Conf idential (,)板材品質 厚度均勻性 異物刮傷要求高加熱及冷卻之效率和耗能問題需要前處理及後處理,程序高壓力下有高轉寫率但模具模仁壽命縮短良率問題 : Cycle time of heating and cooling plus 產material能 handling熱壓製程之顧慮點Highly Conf identialOutlineHighly Conf idential/目的建評暸立估解產熱品壓之製開發程展全及打性貌樣能力HighlyConf ident

8、ial Optimized parameters in manufacturing process關鍵技術 Factors affect yieldYield rat e Cycle time or tact time Pre-treatment and after process Tool life關鍵技術HighlyConf idential平面熱壓計劃之目的HE Development WorkSponsored by BBG, the goalsof HE TechnologyDevelopment Work are to:Identify optimized parameters i

9、n manufacturing process Identify factors affect yieldInvest igate achievable yield rateDesign optimized HE equipment and production layout for future operationInvest igate achievable cycle time or tact time Develop pre-treatment and after process Provide proto type manufacturing capacityDefi ne tool

10、 life and overall process economicsMold (Stamper)Highly Conf identialHE Technology Development WorkTarg et123Size7.5”15”15”24”32”Thickne ss0.4mm,0.60.9mm;23mmPatte rn onDouble-sided(V-groove, dots, .)LGPMicrostructure with a few 10m mrange MILEPRISMSANDBLASTINGETCHINGROTICULARENSSUFACEHighly Conf id

11、entialOutlineIntroduction of HE TechnologyPrecisiScope of HE Technology Development at NanoHE ExamplesRelevan IssuesHighly Conf idential產1品.平種類板型NB導光板熱壓實驗機適用開發產品Highly Conf identialExperimExperim entent ObjeObje ctct()2 TV擴SizeThicknessCycle散板:time1532“:0115.3約-818-10minute2Highly Conf identialThe T

12、hin est Work Piece1 3 0.4 tMatte stamperP MM APMMAV-Cut StamperV -cutDepth(um)Trans ferWidth(um )Trans ferRat eRat eStamper12.1439.73Center of plate11.4294.1%38.3596.50%Edge of plate11. 2092.3%39. 1898.6%Matte ( da)LGPMat teTrans ferRat eLight enter2.4362.353103.5%Center of plate2.0061.837109.2%En d

13、 of plate1.5681.457107.6%Highly Conf idential吋The Largest Work PieceMatte stamperPSV-Cut StamperHighly Conf identialThe Largest Work PieceV- cutDepth(um)Trans ferWidth(um)Trans ferRat eRat eStamper48.76101.07Center of plate51.00104.60%100.5799.50%32吋擴1.5t散板Edge of plate47. 1396. 66%100.5799. 50%High

14、ly Conf identialCMO 10 81:2 2 8mm1 3 5mm0.1 5mmLG PRe flector4. 7 mm15mmLED6.17mm9.2mmp attern()()Highly Conf idential228*135*0.15mm10mmStamper238*145*0.5mmMachinedmaster248*155*12mm15mm()即金使字加塔高深溫度高應壓達讓厚度變，薄實做轉最寫深深僅度依然有限白反做微結構10mm38um18um,.PET(Tg:100 )(Tg:800),38um白反射片微結構熱壓反射片Highly Conf idential()

15、,Re flectorPE T,5 0%Ho t sp o t:0.4PMMA()雷鋸沖射片裁切壓對於可定以上位唯後續必須做端面拋光修整並不適用崩裂問題 目前選擇:,()對幾種可能方式加保護膜以後對位困難Highly Conf idential小片裁切技與實術驗選結果擇P試MM模機A-器0為.4t自動沖床,Press Mold T2 (PMMA-LI0001)圓型弧及成有型些較毛上邊次沖差切,且截有面些圓圓弧弧成沒型有不成良0.046mm有微結構有情撕端形裂有撕裂的情形0.321mmP i tch 0.3 9 5mm De p th 0 .0 1 2mm-CMO 0.4t/13” LGP Pr

16、ojecteiki:誤位差321置 0.0075Ra138420.0737da2559 率轉Highly124%Ra寫52Conf111%da05identialda熱壓轉寫率分使用01.012575.01日期M試模打樣atte析第一次、版第二維次與持第三第次二da分布次比熱較壓的轉寫率 完成EB2ndCBe5b141AABDA1st2nd3rd(2008)7/14 - 7/168/11 - 8/139/15 9/17光學結果: EB()光學量測b1 4b1 4南科湖口54000369780%79%13輝度39373396R 304612 DA4版 分布比3較45 1.0025 位置 Matt

17、LGPdaRa點均勻度51%51%Highly Conf identialCMFProjectPattern6(230mmx140mm) +CMF Hot EmbossingDepth (m)CenterEdgeStamperPMMACMF 2.0t PMMA 熱轉印58.0659.95邊緣轉寫率中心中心1036020.7%95717.4%邊緣離CMF模不深良度的59情m形。，成型後容易發生O KD.離模()S tamp e rP MM A離模不良P MM AS tamp e r37Highly Conf idential轉寫率平均99.5%。Highly Conf identialOutli

18、neIntroduction of HE TechnologyPrecisiScope of HE Technology Development at Nano RelevantHEExamplesHighly Conf idential IssuesHighly Conf idential預成品估外模機翹部仁台不曲因及溫素板度良:材控環厚制項境度目不均及可能mura原因Highly Conf idential表面瓦斯及氣痕材質特性造成畫面Highly Conf idential製程平參整數度不適當Relevant IssuesThickness uniformity of blank materialHeating/cooling system performance/Energy consumption Vacuum & vacuum in transfer boxMaterial handling methodPre-treatment & post-process requirementMold/work piece stack requiremen