GB 51037-2014 微组装生产线工艺设备安装工程施工及验收规范.pdf

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( 5 ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 6 ) 3. 5 bt:iJJiAJ=jL-Jgfr . ( 7 ) 4 *:TZi9:*, ift1J iJ- -Li fr . . . . . . c 9 ) 4. 1 -f.B 9 ) 4. 2 jJfE_fil tJl . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 ) 4. 3 -t!J h .fJl . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 10 ) 4. 4 -1:; J,i;, ( 2 2 ). JJ._ f/1 X. “ 1iJt 7J JL 5 . 6 Iii ft tlL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . c 2 3 ) 5. 7 Jfil.J3t1 . ( 24) s. 8 i!JJ1-tll c 28) 6. 3 h:tt:mm c 29) 6. 4 :tt;.J;Fi . ( 29) 6. s 71 :f,g.m c 30 6. 6 1itltJl ( 31 ) 6. 7 -=f 1i!I y)t ti L C 3 1 ) 6. 8 z:f1j!-mm . c 32 ) 6. 9 f 1i g.11 W t1L C 3 2 6 . l o fit tr W tll c 3 3 ) 6. 11 i71fl-Jt.Wt1L c 34 ) 7 _I -z: fN: 1PJ1J 19: 46-1l c 3 s ) 7. 7 x Mf a !It 1t c 4 3 ) m*A mIZNIW45l ic*m c 44) * J frL ffl iPJ i_R. fljj . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 4 9 ) 11 ffl if IF Ii !6 * c so ) m = x i52. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . c s 1 ) 3 Contents 1 General prov1s1ons ( 1 ) 2 Terms ( 2 ) 3 Basic requirements ( 4 3. 1 Construction conditions ( 4 3. 2 Equipment unpacking ( 5 ) 3. 3 Equipment moving 5 ) 3. 4 Equipment installation ( 6 ) 3. 5 Equipment debugging and commissioning ( 7 ) 4 Installation, debugging and comm1ss1onmg of low temperature co-fined ceramic and thick film substrate production process equipment ( 9 ) 4. 1 General requirements ( 9 ) 4. 2 Tape caster 9 ) 4. 3 Blanker ( 10 ) 4. 4 Green tape puncher ( 10 ) 4. 5 l.,aser puncher ( 11 ) 4. 6 Via filling machine ( 12 ) 4. 7 Screen printer ( 13 ) 4. 8 Stacking n1achinc ( 13 ) 4. 9 Isostatic lamina tor ( 15 ) 4. 10 Hot cutter ( 15 ) 4. 11 Low temperature co-fined ceramic box furnace ( 16 ) 4. 12 4. 13 4 Thickfilm belt furnace Laser resistor trimmer ( 1 7 ) ( 1 7 ) 3 Installation, debugging and commissioning of thin film substrate production process equipment ( 18) 5. 1 General requirements ( 18 ) 5. 2 Magnetic sputtering deposition system ( 18) 5 . 3 Vacuum e v a po rat ion cop pc r-coat e d machine ( 1 9 ) 5. 4 Chemical vJt 0 3. 5. 5 fk17ffll0r ,1A911*ft:1ilJllrt:i:i! 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