ic封装形式.doc

各种ic封装形式图片bgaball grid arrayebga 680llbga 160lpbga 217lplastic ball grid arraysbga 192ltsbga 680lclcccnrcommunication and networking riser specification revision 1.2 cpgaceramic pin grid arraydipdual inline package dip-tabdual inline package with metal heatsinkfbgafdipfto220flat packhsop28ito220ito3pjlcclccldcclgalqfppcdippgaplastic pin grid array plcc详细规格pqfppsdiplqfp 100l详细规格 metal quad 100l详细规格pqfp 100l详细规格qfpquad flat packagesot220sot223sot223sot23sot23/sot323sot25/sot353sot26/sot363sot343sot523sot89sot89socket 603fosterlaminate tcsp 20lchip scale packageto252to263/to268so dimmsmall outline dual in-line memory modulesocket 370for intel 370 pin pga pentium iii & celeron cpusocket 423for intel 423 pin pga pentium 4 cpusocket 462/socket afor pga amd athlon & duron cpusocket 7for intel pentium & mmx pentium cpuqfpquad flat packagetqfp 100lsbgasc-70 5lsdipsipsingle inline packagesosmall outline packagesoj 32lsojsop eiaj type ii 14lsot220ssop 16l ssopto18to220to247to264to3to5to52to71to72to78to8to92to93to99tsopthin small outline packagetssop or tsop iithin shrink outline packageubgamicro ball grid arrayubgamicro ball grid arrayzipzig-zag inline packagetepbga 288ltepbga c-bend lead cerquadceramic quad flat pack详细规格ceramic caselaminate csp 112lchip scale package详细规格gull wing leads llp 8la详细规格pci 32bit 5vperipheral component interconnect详细规格pci 64bit 3.3vpcmciapdipplcc详细规格simm30single in-line memory modulesimm72single in-line memory modulesimm72single in-line slot 1for intel pentium ii pentium iii & celeron cpuslot afor amd athlon cpusnaptksnaptksnapzpsoh各种封 装 缩 写 说 明bgabqfp132bgabga bgabga bga clcccnrpgadipdip-tabbgadiptoflat packhsop28totojlcclccclccbgalqfpdippgaplccpqfpdiplqfplqfppqfp qfpqfptqfp bgasc-70 5ldipsipsosohsojsojsop tosopsopcantotototo3cancancancancanto8to92cancantsoptssop or tsop bgabgazippcdip以下封装形式未找到相关图片，仅作简易描述，供参考：dim单列直插式，塑料例如：mh88500 quip蜘蛛脚状四排直插式，塑料例如：nec7810dbgabga系列中陶瓷芯片例如：ep20k400fc672-3cbgabga系列中金属封装芯片例如： ep20k300ebc652-3module方形状金属壳双列直插式例如：lh0084rqfpqfp封装系列中，表