线路板PCB专业英语词汇(制造、测试、缺陷名等).doc

PCB英语词汇(一）1. 综合词汇 Printed circuit印制电路 Printed wiring印制线路 Printed circuit board印制电路板 Printed wiring board印制线路板 Printed component印制元件 Printed contact印制接点 Single-sided printed circuit board (SSB)单面印制电路板 double-sided printedcircuit board (SSB)双面印制电路板 Multilayer printed circuit board (MLB)多层印制电路板 Rigid printed circuit board刚性印制电路板 Flexible printed circuit board挠性印制电路板 Flex-rigid printed circuit board挠性印制电路板 Build-up printed board积层印制板 Surface laminar circuit (SLC)表面层合电路板 B2it printd board埋入凸块互连 印制板 ALIVH Multilayer printd board层间全内导通 多层印制板 Chip on board (COB)载芯片板 Backplane背板 Bare board裸板 Break-away board可断拼板 Interconnection互连 Conductor race line导线 Substrate基底 Real estate基板面 Conductor side导线面 Component side元件面 Solder side焊接面 Printing印制 grid网格 pattern图形 Conductive pattern导电图形 Non- conductive pattern非导电图形 Legend字符 Mark标志 2 基材 2.1 基材的种类和结构Base material基材 Laminate层压板 Copper-clad laminate (CCL)覆铜箔层压板 Prepreg预浸材料 Bonding sheet/bonding layer粘结片 Epoxy glass substrate环氧玻璃基板 Copper-clad surface铜箔面 Foil removal surface去铜箔面 Length wise direction纵向 cross wise direction横向 Core material内层芯材 2.2 基材的材料 A-stage resinA 阶树脂 B-stage resinB 阶树脂 C -stage resinC 阶树脂 epoxy resin环氧树脂 Polymer聚合物 Photosensitive resin感光性树脂 Thermosetting resin热固性树脂 Thermoplastic resin热塑性树脂 Adhensive胶粘剂 Curing agent固化剂 Flame retardant阻燃剂 opaquer遮光剂 Polyester film (PET)聚酯薄膜 Polyimide film (PI)聚酰亚胺薄膜 Polytetrafluoetylene (PTFE)聚四氟乙烯 Non-woven fabric非织布/无纺布 Glass fiber玻璃纤维 Glass fabric玻璃布 Warp-wise经向 Weft-wise纬向 Copper foil铜箔 Eletrodeposited copper foil电解铜箔 Rolled copper foil压延铜箔 Resin coated copper foil (RCC)涂树脂铜箔 2.3 基材的制造 Polymerize聚合 Thermoplastic热塑性 Thermoset热固性 Clad覆箔 Layup叠层 laminating层压 Postcure后固化 Curing time固化时间 Resinflow树脂流动度 Resin content树脂含量 PCB英语词汇（二）3 设计 3.1 通用术语 Computer-aided design (CAD)计算机辅助设计 Computer-aided manufacturing (CAM)计算机辅助制造 Routing布线 Layout布图设计 Component density元件密度 Arry阵列 3.2 形状与尺寸 Conductor导线 Conductor width导线宽度 Conductor spacing导线间距 Conductor width/space导线宽度/间距 Conductor layer导线层 Component hole元件孔 Mounting hole安装孔 Supported hole支撑孔 Unsupported hole非支撑孔 Via导通孔 Plated through hole镀通孔 Blind via (hole)盲孔 Buried via (hole)埋孔 Buried/ blind via埋/盲孔 Any layer inner via hole (ALIVH)任意层内部导通孔 Tooling/ pilot hole定位孔 Landless hole无连接盘导通孔 Via-in-pad在连接盘中导通孔 Pitch节距 Fine pitch精细节距 3.3 电气互连 Interfacial connection表面间连接 Interlayer connection层间连接 Innerlayer connection内层连接 Pad, land连接盘 Component lead3.4其他 Primary side主面 Secondary side辅面 Signal layer信号层 Crosstalk串扰 Capacitance电容 Electromagnetic interference(EMT)电磁干扰 Electromagnetic shielding电磁屏蔽 Impedance特性阻抗 Inductance电感 Coplanarity共面性（度） Core material 芯板 Thin type multilayer board薄型多层板 Buried and blind via hole mutilayer board埋/盲孔多层板 Buried bump interconnection technology (B2it)嵌入凸块互连技术 Multichip module (MCM)多芯片模块 Alignment mark对准标记 Registration mark对位标记 Layer to layer registration层间重合度 PCB英语词汇（三）4. 制造 4.1 通用术语 Subtractive process减成法 Additive process加成法 Semi-additive process半加成法 Full-additive process全加成法 Build up process积层法 Solder mask on bare copper(SMOBC)裸铜覆阻焊工艺 Tenting掩蔽法 Sequential lamination顺序层压法 Wet process湿处理 Panel plating process板面电镀法 Pattern plating process图形电镀法 Finishing最终修饰 Reworking返工 Tooling feature工艺标识 Panel在制板，拼板 First article首板 Prototype试样板 End product最终产品 Process flow工艺流程 Process window工艺范围 Lot size/ batch批量 Job traveller工作流程单 4.2 照相底版制作 Artwork照相底图 Phototool照相底版 Artwork master照相原版 Working master工作原版 Production master生产底版 Photographic film照相底片 Silver film银盐底片 Diazo film重氮底片 Positive正像 Positive pattern正像图形 Negative负像 Negative pattern负像图形 Photo plotting光绘图 Laser platting激光绘图 Gerber fileGerber文件 Photoplotter光绘机 Laser plotter激光绘图机 Registration mark定位标记 4.3 图形转移 Printing ink印料 Etching resist ink抗蚀印料 Plating resist ink耐电镀印料 Resist抗蚀剂 Photo resist光致抗蚀剂 Dry film photoresist干膜光致抗蚀剂 Liquid photoresist液体光致抗蚀剂 Positive-acting resist正性抗蚀剂 Negative-acting resist负性抗蚀剂 Plating resist耐电镀抗蚀剂 Plated resist抗蚀镀层 Permanent resist永久性保护层 Electro-deposited photoresist电沉积光致抗蚀剂 Mask掩膜 Solder resist、solder mask阻焊剂 Solder mask ink阻焊印料 Dry film solder mask阻焊干膜 Liquid photosensitive solder resist液体光致阻焊剂 Marking ink、legend ink标记印料 Conductive paste导电膏 Hole filing ink堵孔油墨 Peelable solder mask ink 可剥性防焊油墨 Thermally curable、heat cured热固化 Ultraviolet curable (UV cured)紫外线固化 Screen printing网版印刷 Silk screen丝印网版 Stencil网版 Screenability网印能力 Chase、frame网框 Fabric、cloth丝网 Mesh count网目数 Squeegee刮板 PCB英语词汇（四）（续上一页）Skip printing漏印 Thinner、diluent稀释剂 Viscosity粘度 Imaging成像 Imaging transfer图像转移 Dry film imaging干膜制图形 Lamination贴膜 Wet lamination湿法贴膜 Exposure曝光 holding time停留时间 developing 显影 developer显影液 anti-foamer/ anti-foaming agent消泡剂 resolution分辨率 definition逼真度 ghost image 重影 halation晕环 air inclusion夹杂气泡 tackiness粘着性 post cure后固化 shelf life保存期 pot life/ working life适用期 dip coating 浸涂法 roller coating辊涂法 spray coating喷涂法 curtain coating帘幕法 laser direct imaging激光直接成像 4.4清洗与蚀刻 rinsing / rinse水洗 electrolytic cleaning电解清洗 alkaline degreasing化学除油 electrolytic degreasing电解除油 overflow溢流 deionized water去离子水 surface active agent /surfactant表面活性剂 surface tension表面张力 wetting润湿 wetting agent / wetter润湿剂 tarnish污化 drag in/ drag out带进/带出 brushing / scrubbing磨刷 abrasive磨料 scrubber磨刷机 mechanical cleaning机械清洗 chemical clearing化学清洗 pumice power浮石粉/火山灰 sand blasting喷砂 deburring去披峰/去毛刺 mechanical polishing机械抛光 chemical polishing化学抛光 electropolishing电抛光 etchant蚀刻剂/蚀刻液 under etch侧蚀 microetch微蚀 over etching过腐蚀 stripper剥离液 bright dip浸亮 4.5 电镀和涂覆 Plating镀覆 electrochemistry电化学 electrolyte电解质 electrolytic solution电解液 electrochemical corrosion电化学腐蚀 chemical corrosion化学腐蚀 ionization电离 migration迁移 solubility溶解度 addition agent/additive添加剂 brightening agent/brightener光亮剂 levelling agent整平剂 catalyst/catalyzer催化剂 activator/activating agent活化剂 acceleration agent/accelerator增速剂 chelating agent/chelant螯合剂 complex络和物 swelling agent/sweller膨松剂 plasma等离子体 electroplating电镀 metal electroplating金属电沉积 bright plating光亮电镀 PCB英语词汇（五）（续上一页）alloy plating合金电镀 strike plating冲击镀 flash/flash plating闪镀 pulse plating脉冲电镀 rack plating挂镀 barrel plating滚镀 brush plating刷镀 selective plating选择性电镀 Auxiliary anode辅助阳极 Auxiliary cathode辅助阴极 Preplating镀前处理 Postplating镀后处理 Plating up电镀加厚 Pattern plating图形电镀 Panel plating整板电镀 Copper (electro) plating电镀铜 Tin-lead plating电镀锡铅 Plating line电镀线 Electroless plating,electroless deposition无电电镀 Immersion plate浸镀 Plated through hole孔金属化 Electroless copper plating化学沉铜 Direct plating直接电镀 Roughening粗化 Activating敏化 Catalyzing催化 Mentallization金属化 Acceleration增速 Chemisorption化学吸附 Swelling溶胀 Hole conditioning整孔 Hole cleaning洗孔 Desmear, smear removal去钻污 Etchback凹蚀 Plasma desmear等离子去钻污 passivation钝化 acid dipping弱浸蚀 pickling强浸蚀 hot melting热熔 fusing fluid热熔液 solder levelling焊料整平 tin immersion浸锡 solder焊锡 solder coat焊锡涂层 flux助焊剂 preflux预焊剂 organic solderabilitypreservatives (OSP)有机保护剂 black oxidation 黑氧化 brown oxidation棕氧化 Pink ring粉红圈（环） pits麻点 peeling起皮 blister起泡 orange peel 桔皮 pores针孔 porosity孔隙率 hardness硬度 tarnish 金属变色 4.6机械加工和压制 drilling钻孔 numerical control (NC)数控 back-up垫板 entry material盖板 spindle主轴 ring / collar钻套 feed rate 进给速率 off set 钻面不匀 resin smear树脂钻污 foil burr铜箔毛刺 break-out破出 hole counter数孔机 laser via hole激光钻孔 photo via hole光致穿孔 plasma via hole 等离子穿孔 counterboring 沉头孔（埋头孔） countersinking锥形孔 platen热压板 opening/daylight开档 press plate压模板 bonding layer / bonding sheet粘结层 kraft paper牛皮纸 lamination void 层间空洞 dent凹蚀 crease 皱褶 punching冲切 bugle hole冷冲 die 冲模 shearing / cutting喇叭孔 routing 铣切 bevelling 倒斜边 chamfer倒角 scoring刻槽 V cut 槽切割 Sewing hole缝纫孔 Fixture夹具 Indexing hole基准孔 Tooling feature 定位特征 PCB英语词汇（六）（续上一页）5检测 5.1 通用术语 inspection检验 test试验 as received 验收态 production board成品板 test board测试板 coupon 附连板 qualification testing鉴定试验 acceptance tests验收试验 accelerated test加速试验 aging老化 quality conformance testing质量一致性试验 storage life贮存期 specification规范 standard标准 tolerance容差/公差 nonconformity不合格 nonconforming item (unit) 不合格品 defect缺陷 sampling inspection抽样检验 acceptable quality level (AQL)可接收质量水平 5.2外观和尺寸 visual examination/visual inspection目检 blister起泡 blow hole气孔 bulge凸起 cracking裂缝 crazing 微裂纹 burr 毛刺 dishdown凹陷 measling白斑 delamination分层 dent / indentation压痕 fiber exposure露纤维 wrinkle 皱褶 haloing晕圈 hole breakout破环 void空洞 hole void孔壁空洞 foreign material（基材内）外来物 lifted land连接盘起翘 nail heading 钉头 nick缺口 nodule结瘤 pin hole针孔 pit麻点 resin recession树脂凹缩 scratch划痕 bump凸瘤 laminate void层压空洞 mealing粉点 shadowing / etch back凹蚀阴影 5.3 电性能 Surface insulation resistance (SIR)表明绝缘电阻 Dielectric constant介电常数 Dielectric strength介电强度 Dielectric breakdown介电击穿 Dielectric withstanding voltage耐电压 Metal migration金属迁移 Electro migration电迁移 Known good board (KGB)已知好板 PCB英语词汇（七）（续上一页）5.4 非电性能 Bond strength粘合强度 Pull-off strength拉脱强度 Pull-out strength拉出强度 Pull strength拉离强度 Peel strength剥离强度 Flexural strength弯曲强度 Tensile strength拉伸强度 Shear strength剪切强度 Torsional strength抗扭强度 Hole pull strength孔拉脱强度 Pull away拉离 Tear strength撕裂强度 Bow 弓曲 Twist 扭曲 Coefficient of thermalexpansion (CTE) 热导率 Dimensional stability 尺寸稳定性 Machinability 机械加工性 Heat resistance 耐热性 Thermal stress 热应力 Thermal shock 热冲击 Substrate bending test 基板弯曲试验 Bendability 弯曲能力 Fatigue life 疲劳寿命 Fatigue limit 疲劳极限 Fatigue strength 疲劳强度 Abrasion resistance 耐磨(擦)性 Wear resistance 耐磨(损)性 Crease褶痕 Solderability 可焊性 Wetting 焊料润湿 Dewetting 半润湿 Nonwetting 不润湿 Microsectioning 显微剖切 Porosity test孔隙率试验 Cleanliness 清洁度 Ionic cleanliness离子清洁度 Ionizable contaminant 离子污染 Nonionic contaminant 非离子污染 Organic contamination 有机污染 Outgassing 排气 Self-extinguishing 自熄性 Chemical resistance 耐化学性 bleeding渗出 6. 组装 surface mount technology (SMT) 表面组装技术 surface mount component(SMC) 表面组装元件 chip scale package (CSP) / chip scale mounting 芯片级组装 flip chip package (FCP) 倒芯片封装 soldering 焊接 reflow soldering 再流焊 wave soldering 波峰焊 assembly density 组装密度 lead引线 lead foot / lead引脚（腿） lead pitch引脚节距 fine pitch devices (FPD)精细节距器件 node连接节点 chip carrier芯片载体 ball grid array (BGA)球栅阵列 chip / die / dice裸芯片 flip chip倒装芯片 active devices (parts)有源器件 passive devices (parts)无源器件 embedded component埋入元件 add-on component附加元件 integrated circuit (IC)集成电路 resin flux树脂（松香）助焊剂 bond焊（连）接 electrical bridging电桥接 dross焊渣 residue 残留物 stress relief消除应力 印制电路技术英语缩略语ALIVH (any layer inner via hole)任意层内部导通孔 AOI (automatic optional inspection)自动光学检验 BGA (ball grill array)球栅阵列 BUM (build-up multilayer)积层式多层板 BUT (build-up technology)积层式技术 CAM (computer aided manufacturing)计算机辅助制造 CCL (copper clad laminate)覆铜箔层压板 CMT (chip mount technology)芯片安装技术 CNC (computer numerical control)计算机数字控制 COB (chip-on-board)载芯片板 CPCA (China Printed Circuit Association)中国印制电路行业协会 CSP (chip s