半导体集成电路概述.ppt

半导体集成电路,IC常用术语,园片：硅片 芯片(Chip, Die)： 6、8 ：硅（园）片直径：1 25.4mm 6150mm; 8200mm; 12300mm; 亚微米1m的设计规范 深亚微米=0.5 m的设计规范 0.5 m 、 0.35 m 设计规范（最小特征尺寸） 布线层数：金属（掺杂多晶硅）连线的层数。 集成度：每个芯片上集成的晶体管数,IC工艺常用术语,净化级别：Class 1, Class 10, Class 10,000 每立方米空气中含灰尘的个数 去离子水 氧化 扩散 注入 光刻 .,最小线宽变化,生产工厂简介,PSI,Fab Two was completed January 2, 1996 and is a “State of the Art“ facility. This 2,200 square foot facility was constructed using all the latest materials and technologies. In this set of cleanrooms we change the air 390 times per hour, if you do the math with ULPA filtration this is a Class One facility. We have had it tested and it does meet Class One parameters (without any people working in it). Since we are not making microprocessors here and we dont want to wear “space suits“, we run it as a class 10 fab. Even though it consistently runs well below Class Ten.,Here in the Fab Two Photolithography area we see one of our 200mm .35 micron I-Line Steppers. this stepper can image and align both 6 & 8 inch wafers.,Another view of one of the Fab Two Photolithography areas.,Here we see a technician loading 300mm wafers into the SemiTool. The wafers are in a 13 wafer Teflon cassette co-designed by Process Specialties and SemiTool in 1995. Again these are the worlds first 300mm wet process cassettes (that can be spin rinse dried).,As we look in this window we see the Worlds First true 300mm production furnace. Our development and design of this tool began in 1992, it was installed in December of 1995 and became fully operational in January of 1996.,Here we can see the loading of 300mm wafers onto the Paddle.,Process Specialties has developed the worlds first production 300mm Nitride system! We began processing 300mm LPCVD Silicon Nitride in May of 1997.,2,500 additional square feet of “State of the Art“ Class One Cleanroom is currently processing wafers! With increased 300mm & 200mm processing capabilities including more PVD Metalization, 300mm Wet processing / Cleaning capabilities and full wafer 300mm .35um Photolithography, all in a Class One enviroment.,Currently our PS300A and PS300B diffusion tools are capable of running both 200mm & 300mm wafers. We can even process the two sizes in the same furnace load without suffering any uniformity problems! (Thermal Oxide Only),Accuracy in metrology is never an issue at Process Specialties. We use the most advanced robotic laser ellipsometers and other calibrated tools for precision thin film, resistivity, CD and step height measurement. Including our new Nanometrics 8300 full wafer 300mm thin film measurement and mapping tool. We also use outside laboratories and our excellent working relationships with our Metrology tool customers, for additional correlation and calibration.,One of two SEM Labs located in our facility. In this one we are using a field emission tool for everything from looking at photoresist profiles and measuring CDs to double checking metal deposition thicknesses. At the helm, another one of our process engineers you may have spoken with Mark Hinkle.,Here we are looking at the Incoming material disposition racks,Above you are looking at a couple of views of the facilities on the west side of Fab One. Here you can see one of our 18.5 Meg/Ohm DI water systems and one of four 10,000 CFM air systems feeding this fab (left picture), as well as one of our waste air scrubber units (right picture). Both are inside the building for easier maintenance, longer life and better control.,集成电路（Integrated Circuit, IC）：半导体IC，膜IC，混合IC 半导体IC：指用半导体工艺把电路中的有源器件、无源元件及互联布线等以相互不可分离的状态制作在半导体上，最后封装在一个管壳内，构成一个完整的、具有特定功能的电路。,半导体IC,双极IC,MOSIC,BiCMOS,PMOS IC,CMOS IC,NMOS IC,摩尔定律,集成电路工业发展的一个重要规律即所谓摩尔定律。Intel公司的创始人之一戈登摩尔先生在1965年4月19日发表于电子学杂志上的文章中提出，集成电路的能力将每年翻一番。1975年，他对此提法做了修正，称集成电路的能力将每两年翻一番。摩尔定律现在的表达：在价格不变的情况下，集成电路芯片上的晶体管数量每18个月翻一番，即每3年乘以4。,集成电路工业发展的另一些规律建立一个芯片厂的造价也是每3年乘以4；线条宽度每6年下降一半；芯片上每个器件的价格每年下30% 40%。 晶片直径的变化： 60年：0.5英寸 65年：1英寸 70年：2英寸 75年：3英寸 80年：4英寸 90年：6英寸 95年：8英寸（200mm） 2000年：12英寸（300mm）,2007年十大半导体厂商排行,2007年全球半导体营收额为2703亿美元，同比增长2.9%。 英特尔营收仍然高居榜首，市场份额从去年的11.6%增至12.2%。三星排名第二，市场份额为7.7%。东芝第三，市场份额为4.6%。德州仪器第四，市场份额为4.2%。以下为Gartner评出的2007年10大半导体厂商： 1. 英特尔（06年第1） 2. 三星（06年第2） 3. 东芝（06年第6） 4. 德州仪器（06年第3） 5. 意法半导体（06年第5） 6. 英飞凌（06年第4） 7. Hynix半导体（06年第7） 8. Renesas科技（06年第8） 9. NXP半导体（06年未进前10） 10. NEC电子（06年未进前10）,Transistor Counts,1,000,000,100,000,10,000,1,000,10,100,1,1975,1980,1985,1990,1995,2000,2005,2010,8086,80286,i386,i486,Pentium,Pentium Pro,K,1 Billion Transistors,Source: Intel,Projected,Pentium II,Pentium III,Courtesy, Intel,Moores law in Microprocessors,4004,8008,8080,8085,8086,286,386,486,Pentium proc,P6,0.001,0.01,0.1,1,10,100,1000,1970,1980,1990,2000,2010,Year,Transistors (MT),2X growth in 1.96 years!,Transistors on Lead Microprocessors double every 2 years,Courtesy, Intel,Die Size Growth,4004,8008,8080,8085,8086,286,386,486,Pentium proc,P6,1,10,100,1970,1980,1990,2000,2010,Year,Die size (mm),7% growth per year,2X growth in 10 years,Die size grows by 14% to satisfy Moores Law,Courtesy, Intel,Frequency,P6,Pentium proc,486,386,286,8086,8085,8080,8008,4004,0.1,1,10,100,1000,10000,1970,1980,1990,2000,2010,Year,Frequency (Mhz),Lead Microprocessors frequency doubles every 2 years,Doubles every 2 years,Courtesy, Intel,Power Dissipation,P6,Pentium proc,486,386,286,8086,8085,8080,8008,4004,0.1,1,10,100,1971,1974,1978,1985,1992,2000,Year,Power (Watts),Lead Microprocessors power continues to increase,Courtesy, Intel,2006年度中国集成电路设计前十大企业,炬力集成电路设计有限公司 中国华大集成电路设计集团有限公司(包含北京中电华大电子设计公司等) 北京中星微电子有限公司 大唐微电子技术有限公司 深圳海思半导体有限公司 无锡华润矽科微电子有限公司 杭州士兰微电子股份有限公司 上海华虹集成电路有限公司 北京清华同方微电子有限公司 展讯通信(上海)有限公司,2006年度中国集成电路与分立器件制造前十大企业,中芯国际集成电路制造有限公司 上海华虹(集团)