SMT中英文专业术语教程.ppt

SMT中英文专业术语教程,更新日期：2011.09,1.印刷工艺专业英语 2.贴片工艺专业英语 3.回流工艺专业英语,针对新入职或有一定基础的职员,2小时,罗卫龙,使大家对SMT专业英语有所了解，能够看懂一些专业素材,培训目的,培训对象,培训讲师,学习重点,培训课时,Printing Process English/印刷工艺英语,测试OK后 转DIP插件,印刷（Printing）： 目的：借助于钢网把锡膏印刷在PCB之焊盘（PAD）上,贴片（Mount）： 目的：将贴片元件准确的贴装到PCB焊盘上,回流焊（Reflow）： 目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，元件之间形成机械连接,AOI（自动光学检测）： 目的：自动检测PCBA板上各种不同帖装错误及焊接缺陷，确保SMT不良品不会流入下一道工序,SMT：Surface Mount Technology/表面贴装技术,Definition：Process of transferring solder paste onto the pads of a PCB, by forcing it through mating apertures on a stencil, using a squeegee,Board loader/上板机： PCBs to be transported to the screen printer using conveyors,Printer/印刷机： deposits solder paste onto pads on the circuit board,PCB（Printed circuit board）/印制线路板,Solder paste/锡膏： Mixture of solder powders and flux deposited onto pads of circuit board on a controlled volume. After reflow provides electrical, mechanical and thermal connection between component and board,Squeegee/刮刀: Critical tool used to “push” paste through the designated openings,Stencil/钢网：Vehicle by which the volume and placement location of solder paste deposition is controlled,Foil/钢片,Frame/外框,Flex Mask/绷网,Aperture/开孔,Main Elements of the Screen Printer/印刷机要素,Input Conveyor/输入导轨,Solvent tank/容剂曹,Monitor/监控器,Output Conveyor/输出导轨,Light tower/指示灯,Emergency stop buttons/紧急制动开关,Vision system/视觉系统,Clamps/夹子,Board support/支撑块 Or support Pins/支撑顶针,stencil/钢网,Squeegee/刮刀,Print Parameters/印刷参数,Angle of Attack (45 or 60 with stencil)/角度 ：The angle made by the front of squeegee blade in relation to the stencil Snap-Off (Contact or Non-Contact)/印刷间隙 ：The distance from the top surface of the PCB to the bottom surface of the stencil Squeegee Pressure/刮刀压力 ：Controls the shear stress，The total force with which the squeegee is pushing onto the board Squeegee Speed/刮刀速度 ：Controls the shear rate，The velocity at which the squeegee traverses across the stencil Separation Speed/分离速度 ：The velocity at which the PCB release from the stencil,Separation Distance/分离距离 :The distance when the PCB release from the stencil which keep the separation speed Stencil Alignment/钢网对位 :Vision Based:Fully automatic with fiducials or Semi-automatic Manual Cleaning Frequency/清洗频率 Cleaning mode/清洗模式 :Dry/wet/vacuum,Print Defects/印刷缺陷,Misalignment/偏位,Bridge or Short/短路,Icicle/拉尖,Scooping,Incomplete print/少锡,Excessive print/多锡,Paste residue/锡膏脏污,Slump/坍塌,Component placement process english/元件贴装工艺英语,测试OK后 转DIP插件,印刷（Printing）： 目的：借助于钢网把锡膏印刷在PCB之焊盘（PAD）上,贴片（Mount）： 目的：将贴片元件准确的贴装到PCB焊盘上,回流焊（Reflow）： 目的：把完成贴片的PCB经由一定的温度曲线使锡膏与PCB，