制造工程能力评估Checklist.xls

Make engineering capability assessment checklist and assessment report Confidentiality: INTERNAL Document Code: SUP_M_MEC_C100816 V03.00 2019/6/23 Conserved time of the record：permanent Huawei Proprietary - Restricted DistributionPage1 of 23 得得分分Score得得分分说说明明 ScoreScore ExplainExplain NA制程不涉及 The process/system is inapplicability 0未标准化 没有相关文件指导Non-standardization 1标准化 现场操作有指导书指导 Standardization there is SOP to guide the operation 2 可视化 现场操作可视化改进 Visibility there is visibility tool to guide the operation improvement. 3 防错化 工具、方法优化效率提升/防呆 Foolproof there is foolproof tool to guide the efficiency improvement. 4自动化 信息、设备自动执行 Automation The operation is done automatically. 5 趋零化 业务/技术优化取消作业 Elimination The operation is canceled according to technology improvement. Make engineering capability assessment checklist and assessment report Confidentiality: INTERNAL Document Code: SUP_M_MEC_C100816 V03.00 2019/6/23 Conserved time of the record：permanent Huawei Proprietary - Restricted DistributionPage2 of 23 典典型型示示例例 TypicalTypical ExampleExample 无操作指导文件或规范文件（需要规范情况下只有专用指导书不得分）。No WI or regulation (need regulation only WI) 现场操作指导书或规范文件、操作保养记录表（无checklist内容）。Has WI or regulation、maintenance records(no checklist) 指导书图片说明、点检checklist表、报警、颜色标识、箭头标识、状态标识、 管控标签、量测工装工具。WI has picture instruction、checklist、warning、color label、arrowhead symbol、status marker、label control、measure tools. 有起到防呆作用的工装工具或方法，如IT扫描系统扫描比对、有异常自动中止运 行，效率提升不考虑。Has preventive tools or method, such as IT system automatic compare through scan barcode,automatic stop when exception happen,efficiency improvement dont adopt temporarily.) 如EC自动解析、自动打螺钉、自动点胶、自动加锡等(EC automatic parsing、 automatic screw、automatic glue dispensing、automatic welding etc. ） 如针对手工焊相关内容，实现完全取消手工焊。Cancel manual operating about hand soldering operation completely. Make engineering capability assessment checklist and assessment report Confidentiality: INTERNAL Document Code: SUP_M_MEC_C100816 V03.00 2019/6/23 Conserved time of the record：permanent Huawei Proprietary - Restricted DistributionPage3 of 23 工工程程能能力力评评估估总总结结ProcessProcess AuditAudit ResultsResults 稽稽核核明明细细Audit Details 稽核组人员Audit Team Member:日期Date: Scoring Summary No 工工序序 Procedure 分分数数 Score 备备注注Remarks 1印刷Paste Printing#DIV/0!适用单板环节PCBA 2贴片 Component Placement0%适用单板环节PCBA 3回流Reflow Soldering0%适用单板环节PCBA 4检测Inspection0%适用单板环节PCBA 5补焊Manual soldering#DIV/0!适用单板环节PCBA 6单板装配Board assembly#DIV/0!适用单板环节PCBA 7返修Rework0%适用单板环节PCBA 平平均均分分数数Overall Average#DIV/0! 结结果果Overall Results:#DIV/0! 改改进进区区Area of ImprovementsMandatory Common No工工序序 Procedure发发现现问问题题Findings 问问题题类类别别 Category 改改善善对对策策 Corrective Action 完完成成日日期期 Due Date 状状态态 StatusStatus Prepared By： Reviewed By： Approved By： 印 刷P aste P rinting 贴 片 Co m p o nent P lacem ent 回 流Ref lo w S o ld ering 检 测Insp ectio n补 焊M a nual so ld ering 单 板 装 配B o ard assem b ly 返 修R e wo rk Make engineering capability assessment checklist and assessment report Confidentiality: INTERNAL Document Code: SUP_M_MEC_C100816 V03.00 2019/6/23 Conserved time of the record：permanent Huawei Proprietary - Restricted DistributionPage4 of 23 6090 满分 60%80%100% 60%80%100% 60%80%100% 60%80%100% 60%80%100% 60%80%100% 60%80%100% 印 刷P aste P rinting 贴 片 Co m p o nent P lacem ent 回 流Ref lo w S o ld ering 检 测Insp ectio n补 焊M a nual so ld ering 单 板 装 配B o ard assem b ly 返 修R e wo rk Make engineering capability assessment checklist and assessment report Confidentiality: INTERNAL Document Code: SUP_M_MEC_C100816 V03.00 2019/6/23 Conserved time of the record：permanent Huawei Proprietary - Restricted DistributionPage5 of 23 NoClassChecklistComments maximum score Actual score (NA-0-1-2-3-4-5) 实实际际情情况况（是是否否有有指指导导文文件件或或标标准准或或标标准准可可 视视化化或或防防呆呆措措施施等等） 1 印刷参数 Printing parameters 产品信息是否有标准明确的输入来源 Is product information defined input sources. 环保属性、CAD文件（单板长宽厚、MARK点坐标、封装信息 ），从什么渠道获取。Key message : ROHS、CAD file(board size/mark point coordinate/packing information) 2 有明确规定生产使用的刮刀的型号和技术规格。 Is there clearly defined the scraper technical specifications. 设备认证需求是否有明确的刮刀规格和技术认证checklist ，包括材质、角度、硬度、表面光洁度。Spec:material quality, angle, hardness ,surface finishment. 3 如何保证不同尺寸单板或者设备选择的刮刀长度是合适的 刮刀选用规格 How to ensure that the scraper specifications is suitable. 不同的开口范围刮刀选择不一样 不同设备的刮刀选择 Scraper select according open scope,equipments type . 4 是否有印刷参数设置规范 Is there specification to set printing parameters 刮刀长度、印刷速度、有指导书做成解析文件。WI printing parameter include scraper length, printing speed etc. 5 如何保证制定的印刷参数是符合工艺规范 How to ensure that the printing parameters meet to the technical specifications 设置印刷参数时有没有产品封装信息识别、钢网设计信息识 别。 Identify package information and stencil information when setting the printing parameters. 6 钢网及支撑方式和印刷参数验证的标准是否对偏位、转移率、形 状有要求。 Do the stencil and support and printing parameters has verification standards. Is the standards include deviation, transfer rate, and shape requirements 有无验证标准，体积转移率(偏位等）的Cp,Cpk,不良DPPM. CP, CPK and fault DPPM. 7 是否有擦拭频率的规定及其合理性 Is there the wipe frequency requirements. 8 如何保证印刷机的设备能力满足不同产品工艺要求 How to ensure the printing equipment capacity to meet the technological requirements of different products 可加工PCB最小/最大尺寸 印刷精度，Cmk PCB max/min size, Printing accuracy, Cmk 9 有无选择钢网擦拭剂的规则 Is there options stencil cleaning rules 10 是否有钢网纸的选择规则 Is there the stencil wiping paper selection rules. 纸张的长度大小等。 The stencil wiping paper size. 11 是否有刮刀压力的规定 Is there rules about the scraper pressure. 指导书有说明。 WI has content about this rules. 12 是否有印刷速度的规定 Is there rules about the print speed. 指导书有说明。 WI has content about this rules. 13 是否有脱模速度的规定 Is there rules about the stripping speed. 指导书有说明。 WI has content about this rules. 14 是否有脱模距离的规定 Is there rules about the stripping distance. 指导书有说明。 WI has content about this rules. 15 是否有擦拭方式的规定 Is there rules about the wipe mode. 指导书有说明。 WI has content about this rules. 16 如何保证板厚设置和实际一致 How to ensure that the plate thickness is set accord with the actual. 夹片容易损坏，确保钢网和PCB无间隙。 There has no gap between the stencil and PCB. 17 换线时如何保证钢网和PCB对准 How to ensure the location precision of the stencil and PCB. 对位精度要求、检查标准、确认方法 Location precision control、checking standard、confirm method. Make engineering capability assessment checklist and assessment report Confidentiality: INTERNAL Document Code: SUP_M_MEC_C100816 V03.00 2019/6/23 Conserved time of the record：permanent Huawei Proprietary - Restricted DistributionPage6 of 23 18 钢网及刮刀 搅拌刀等工 装工具 stencil and the other tools 是否有钢网设计规范和规则 Is there the stencil design norms. IPC标准 1.5。 2/3 包括最小宽度可以容5粒球 钢网设计规范里面对张力、开口尺寸设计和厚度选择是否有 明确依据和合理逻辑。 包含哪些必须的内容 IPC standard 1.5。2/3 There has the stardard about tension, thickness in the design standard. 19 是否有专门针对拼板或者大尺寸单板的钢网设计规则 Is there a specific stencil design rules for large- size board or flatten board. 拼板及大尺寸会有膨胀缩放。Panelized boards and big size boards have expansion and scaling. 20 如何保证钢网设计能满足宽厚比、面积比等工艺需求。 .How to ensure the stencil design to meet the technology needs,such as the width to thickness ratio, area ratio 通用要求对宽厚比、面积比有标准，如何实现,0.5pitch的 QFN作为稽核对象。width to thickness ratio, area ratio has spec(refer to 0.5picth QFN) 21 钢网生命周期（合格、报废、待验证、使用次数)如何被识别和记 录 How to identify and record the life cycle of the stencil (qualified, scrapped, to be verified, the use times) 22 如何保证钢网是验证OK后才正常使用 How to ensure that the stencil is verified. 验证前后状态区分，Distinguish stencil verify status (waiting verify or veified) 有没有验证的过程流程。Verify process. 23 如何保证钢网张力合格。 How to ensure that the steel tension qualified 张力测试 tension test 测试点的设置。Test point setting. 测试点间张力值的极差控制.tension value and range control. 张力计的量程选择是否合理.tensonmeter range. 有无试验钢网清洗剂和钢网粘胶的反应。Stencil clear solvent and stencil viscose verify. 张力计的存放是否满足需求，不能受力。Tensonmeter dont support pressure in storage location. 张力时间要求.Tension times. 24 如何保证上线前钢网没有破损（满足要求） How to ensure that the using stencil is not damaged (to meet the requirements) 破损、压痕、划痕，是否有限度样本。 Has limit sample about breakage、indentation、sratch. 25 如何保证上线前钢网的清洗效果 How to ensure the cleaning effect of the stencil 钢网清洗状态（未清洗,清洗中,已清洗)如何管理的 .stencil status managment(unclear/clearing/cleared) 如何对钢网清洗后的锡膏残留情况进行检查（放大镜倍数 100x)Inspection : magnifier(magnification factor100X）. 如何保证清洗后的钢网不被污染。Cleared stencil protection. 如何保证钢网使用后，4小时内清洗完毕.finish stencil clear in 4 hours after used. 钢网清洗方法是如何规定清洗溶剂种类清洗次数干燥时 间.Clear method control:solvent type、times、dry time. 钢网清洗机保养作业如何规定更换过滤芯及检查溶剂水位的 频率的(多久检查清洗液).Clearing machine PM:solvent height check and filter change. 人工洗钢网和自动清洗钢网是如何规定的.Manual and automated clear definition. 如何对钢网清洗后的损伤，变形进行检查.check stencil damage/deformation. 如何例行检查钢网的张力.Stencil tension checking routine. 如何管控钢网清洗机清洗前钢网不允许堆积状锡膏残留.No solder paste remain on the stencil before clear. 26 钢网是否有版本管理 Is there the stencil version management 钢网设计的版本管理，设计文件继承性、实物标识。Design version,document inherit,identifier. Make engineering capability assessment checklist and assessment report Confidentiality: INTERNAL Document Code: SUP_M_MEC_C100816 V03.00 2019/6/23 Conserved time of the record：permanent Huawei Proprietary - Restricted DistributionPage7 of 23 27 设置支撑方式时是否有明确的规则和规范文件支持（是否有支撑 工装设计规则，如顶针模板、一体化顶块等） Is there clear rules for setting supporting way. 设计顶针模版或者印刷托盘时针对拼板和产品禁布区有无明 确。Restricted area is clare for support design. 28 如何保证印刷托盘被验证 How to ensure that the printing tray to be verified 29 如何保证支撑方式的效果且不会撞件（是否有支撑工装应用规则 ，如顶针模板、一体化顶块等） How to ensure that the effect of the support. 实际使用时候的对位要求和规则 需要和不需要支撑？软硬支撑？整体？是否考虑拼板？禁布 区.Supporting requirement,hard supporting,whole,Panelized board，restricted area. 30 如何保证刮刀没有变形、破损。 How to ensure that the scraper no deformation, breakage. 测试标准、测试工具、测试频度、 check standard/tools/frequency. 31 如何保证上线前刮刀的清洗效果 How to ensure that the cleaning effect of the blade. 刮刀清洗状态（未清洗,清洗中,已清洗)如何管理的 .Status managment(unclear/clearing/cleared) 如何对刮刀清洗后的锡膏残留情况进行检查（放大镜倍数 =100x).Inspection : magnifier(magnification factor100X） 如何保证清洗后的刮刀不被污染.Cleared blade protection. 刮刀清洗方法是如何规定清洗溶剂种类清洗次数干燥时 间.Clear method control:solvent type、times、dry time. 刮刀清洗机保养作业如何规定更换过滤芯及检查溶剂水位的 频率的(多久检查清洗液)。Clearing machine PM:solvent heigh check and filter change. 人工洗刮刀和自动清洗刮刀是如何规定的。Manual and automated clear definition. 如何保证刮刀使用后，4小时内清洗完毕。finish blade clear in 4 hours after used. 如何对刮刀清洗后的损伤，变形进行检查。check blade damage/deformation. 如何管控刮刀清洗机清洗前刮刀不允许堆积状锡膏残留。No solder paste remain on the blade before clear. 如何保证刮刀夹缝位置清洗后无锡膏粉屑残留。Blade crack check whether have solder paste powder. 如何对刮刀清洗后的锡膏残留情况进行检查(包括表面及夹 缝)Solder paste remain check after clear. 32 是否使用一体化塑胶搅拌刀 Whether to use the integrated plastic mixing knife 必须使用塑胶才能打分。Plastic mixing knife is essential condition. 33 PCB及锡膏等 物料管控 PCB and solder paste material control 清洗PCB是怎么操作（溶剂，次数，辅助工具，检查确认），如 何保证ENIG、I-Ag、I-Sn、ENEPIG、HASL/LFHASL板在印刷过 程中，锡膏重新印刷的次数不可超过2次。 How to cleaning the PCB (solvent, times, auxiliary tools, check) How to ensure that the print times of ENIG, I-Ag, I- Sn, ENEPIG, HASL / LFHASL PCB is not exceed 2 in the printing process, 溶剂，次数，辅助工具，检查确认. Solvent、times、auxiliary tools、checking。 34 有无规定OSP单板误印时处理方法 Is there the approach regulations when the OSP misprinted 方法，溶剂和烘干？次数 method、solvent、baking ,clear times。 35 如何确保车间环境温度和相对湿度符合锡膏规格 How to ensure that the workshop temperature and relative humidity to meet the solder paste specifications 车间环境温度在2028，环境相对湿度在30%75%。 Workshp enviroment:temperature 2028。relative humidity 30%75%. 36 上线前如何确保锡膏是在使用时间范围内 How to ensure that the solder paste is in the use time range 开封48小时。Open time 48 hours . 钢网及刮刀 搅拌刀等工 装工具 stencil and the other tools Make engineering capability assessment checklist and assessment report Confidentiality: INTERNAL Document Code: SUP_M_MEC_C100816 V03.00 2019/6/23 Conserved time of the record：permanent Huawei Proprietary - Restricted DistributionPage8 of 23 37 如何保证锡膏的回温时间在4小时以上 How to ensure that the warming time of the solder paste in more than four hours 38 如何确保锡膏型号使用正确 How to ensure to use the correct solder paste. 39 如何保证室温条件下未开封锡膏回温次数不得超过两次 How to ensure that the warming times of the unopened solder paste is no more than two. 40 如何保证锡膏是搅拌充分的 How to ensure that the solder paste is stirred fully 锡膏量 solder paste quantity 搅拌黏度 stirred viscosity 不能挤压 No extrude 41 如何确保锡膏滚动在合理的范围内 How to ensure that the solder pastes roll height is in the reasonable range. 1525mm范围内 Spec:15-25mm. 42 印刷过程中超出刮刀印刷范围的锡膏是如何管控的 How to control the solder paste beyond the scope of the scraper during the printing process 43 如何保证锡膏的滚动时间没有超出8H How to ensure the solder pastes rolling time is not exceed 8H 锡膏跟踪，solder paste trace. 44 锡膏批次或贴片胶批次是否可追溯 Are the batchs of solder paste and the gule be traceability 45 如何保证选择正确的钢网在线清洗剂 How to ensure to select the correct stencil online cleaners 清洗剂和锡膏的兼容性有没有做过试验 如存在兼容性问题则需要管控。Has compatibility test in detergent remover and solder paste. 46 设备一些关 键部件状态 Equipment and some key components 如何确保擦拭机构是有效的 How to ensure that the wiper mechanism is effective 如何确保印刷机的胶条没有变形.printer block gine checking ,no deformation 真空度是合格的（靠听）.vacuum degeree is qualified. 喷擦拭剂的量合适.Spray and clear reagents quantity is suitable. 卷纸机构是否有效.Lap mechanism whether effective. 喷射系统是否通畅有效 Spray system whether unobstructed. 47 如何确保印刷机的夹片是没有变形和破损的 How to ensure that the clip have no deformation and breakage. 有限度图片或塞规标准.has restrict degree picture and feeler gauge spec. 48 如何保证gap 为零 How to ensure that the gap is zero. 印刷高度、轨道平行度、table平面度等是否有校验。 Check:Printing height、track parallelism、table plate . PCB及锡膏等 物料管控 PCB and solder paste material control Make engineering capability assessment checklist and assessment report Confidentiality: INTERNAL Document Code: SUP_M_MEC_C100816 V03.00 2019/6/23 Conserved time of the record：permanent Huawei Proprietary - Restricted DistributionPage9 of 23 49 如何保证实际刮刀压力与设置要求一致 How to ensure that the actual scraper pressure is agree to its set requirements. 压力校正要求、频率，Pressure adjustment and frequency. 50 如何保证实际脱模速度和距离与设置要求一致 How to ensure that the actual stripping speed and distence are agree to their set requirements. 是否有校准要求，Has adjustment requirement. 51 如何保证实际刮刀速度与设置要求一致 How to ensure that the actual print speed is agree to its set requirements. 是否有校准要求，Has adjustment requirement. 52 如何保证印刷参数能得到验证 How to ensure the printing parameters has been verified. 针对印刷的参数设置是否有一套标准的验证方法和测试方法 .Parameter setting has a set of verify and test method. 印刷机的参数是如何制定.How to set printing parameter. 参数制定过验证过程是否合理.Parameter is reasonable through process verify. 针对印刷参数制定后有没有验证和归档过程。Printing parameter filed after verify, 53 过程控制 Process control 如何确保PCB进板方向与钢网装载进板方向是一致的 How to ensure that the direction of the PCB is consistent with the stencil direction. 54 如何保证印刷后的单板在2小时内完成回流 How to ensure that printed boards to be completed reflow within 2 hours. 印刷后条码扫描预警.System have alarming control through scan barcode . 55 如何避免拿取PCB时表面或焊盘不被汗渍污染及划伤 How to avoid the perspiration pollution and scratches PCB surface or pad while picking up the PCB 56 是否有印刷测试设备MSA定期分析 Are there the regular MSA analysis of the printed test equipment 重复印刷测试和Cmk测试.Repeat printing test and Cmk test. 57 如何保证在线检测设备(SPI或2D)测出的不良品的不流入下工序 How to ensure that defective products does not flow into the next process 报错确认防呆.Has mistake-proof measures for false fault confirming. 58 是否有明确的印刷程序命名规则 Are there clear printing process naming rules 板名版本版面线体信息如何区分 Key:model name and version, line. 59 印刷程序是如何分权限管理的 how to management the printing programs permissions. 60 如何确保印刷程序调用正确 How to ensure to call the correct printing procedure 61 印刷程序变更是如何管理的 How to manage the printing process change. Maximum scoreActual Score0 Score %#DIV/0! 设备一些关 键部件状态 Equipment and some key components Make engineering capability assessment checklist and assessment report Confidentiality: INTERNAL Document Code: SUP_M_MEC_C100816 V03.00 2019/6/23 Conserved time of the record：permanent Huawei Proprietary - Restricted DistributionPage10 of 23 NoClassChecklistComments maximum score Actual score (NA-0-1-2-3- 4-5) 实实际际情情况况（是是否否有有指指导导文文件件或或标标准准或或标标准准可可视视化化或或防防呆呆措措施施 等等） 1 数据输入 Data Import 是否有正确途径获取CAD和BOM文件？ Can it get the correct CAD and BOM? 1 2 是否有方法保证获取准确的元件坐标、角度数据？ Can it get the correct coordinate and degree data? 这些数据都应该使用设计原始文件，不应该进行手 动修改（华为内部的器件角度需要手动调整） Parameter obtain from original design file, dont manual modify. 1 3 是否有正确的途径获取器件的尺寸信息？ Can it get the correct component size and package information? 应该使用厂家提供的器件规格书，而不能采用实物 量尺寸的方法。Must using original SPEC,dont measure actual size. 1 4 程序编制 Programme 是否有明确的程序命名规则，以区分管理不同单板、相同单板不 同版本的程序？ Is there clear rule for program nameing, to differentiate item and version? 程序名需要包含板名（或编码）和版本。Name rule:board name(P/N)、Version. 1 5 贴片程序是否有明确的验证机制？ Is there program verifying process 如何保证首件的正确性，包含贴放位置、极性等； 如何保证首件上阻容类元器件的正确性；如何保证 首件检查按照规定的要求执行。First piece inpsection. 3 6 如何保证ECA被正确执行，包括物料编码和位置号的正确性？ How to ensure execute ECA correctly,include part number and def. 原则上对变更点按照新产品的管控规则来管理，不 允许没有任何验证措施;包括物料变更。Has verify measure（include material change）. 3 7 如何保证物料新厂家、供应商下发的变更、新编码等情况得到充 分验证？ How to ensure validate the new supply、EC from supply 、new part enough? 对于新物料是否有明确验证项目和标准，这些要求 是如何保证执行到位的。New material verify process(include verify item and standard). 2 8 验证过程有无验证样本量的要求？ Do it define the sample size in validation? 1 9 验证标准是否包括贴放DPPM、平衡率、抛料率？ Is there DPPM、balance、skip rate in validation specification? 贴放DPPM、平衡率、抛料率的指标分别是多少，是 否合理？KPI target:DPPM、capacity balance 、component skip rate. 1 10 如何保证验证机制被执行？ How to ensure validation process have been executed correctly? 通过报表或流程保证以上指标得到监控，不达标时 采取了哪些措施。KPI supervision. 1 11 拼板的程序编制有无明确规则？ Is there a process defined for matrix board programming? 拼板的程序编制有一定的特殊性，需要有特殊的方 法来保证程序的坐标正确性。Has special method to ensure program Coordinate is right. 1 12 如何保证所有程序按照标准步骤编写？ How to ensure all products programmed with standard process? 可以通过软件的指引防呆。Through software to instruct programming. 3 13 对于配置有不同品牌贴片机的线体程序，如何保证按照规定的方 式编写？ How to ensure programming to different placement machine manufacturer in same line? 文件是否有操作步骤和方法；编程软件是否可以设 置步骤指引进行防呆。Porgramming software automatic check equipment information. 1 14 如何保证单板进板方向正确？ How to ensure the correct transport orientation? WI是否有进板方向说明；程序中的mark点可以实现