PCB专业术语名词解释.ppt

,线路板专业名词解释,Title,印制电路：printedcircuit印制线路：printedwiring印制板：printedboard印制板电路：printedcircuitboard(pcb)印制线路板：printedwiringboard(pwb)印制元件：printedcomponent印制接点：printedcontact印制板装配：printedboardassembly板：board,第一篇：常用术语,10.单面印制板：single-sidedprintedboard(ssb)11.双面印制板：double-sidedprintedboard(dsb)12.多层印制线路板：mulitlayerprintedwiringboard13.刚性印制板：rigidprintedboard14.刚性单面印制板：rigidsingle-sidedprintedboard15.刚性双面印制板：rigiddouble-sidedprintedboard17.刚性多层印制板：rigidmultilayerprintedboard,18.MI:ManufactureInstruction(制作指示)19.ECN:EngineeringChangeNotice(工程更改通知)20.MOR：MarketingOrderReleaseOC:OrderConfirmation(定单)21.IPC-TheInstituteforInterconnectingandpackagingElectronicCircuits(美国电子电路互连与封装协会),22.UL:UnderwritesLaboratories(美国保险商实验所),23.ISO-InternationalStandardsOrganization国际标准化组织,24.OnholdandRelease:暂停和释放,25.SPEC:specification客户规格书,26.WIP:Workinprocess正在生产线上生产的产品,27.Gerberfile:软件包,28.MasterA/W:客户原装菲林,29.Netlist:客户提供的表明开短路的文件,30.HMLV:HighMixedLowVolume,多批少量,31.TCN：TemporaryChangenotice临时更改通知,32.ENIG:ElectrolessNickel/ImmersionGold(IPC-4552),33.OSP:OrganicSurfaceprotection,34.IT:ImmersionTin35.IS:ImmersionSilver36.HAL:Hotairleveling,第二篇：有关材料,1.Copper-cladLaminate:覆铜箔基材,2.Prepreg:聚酯胶片,3.FR-4(FlameRetardant-4):一种用玻璃布和环氧樹脂制造有阻燃性能的材料,4.Soldermask:阻焊剂,5.Peelablesoldermask:蓝胶,7.Dryfilm:干膜,6.CarbonInk:碳油,8.RCC:ResinCoatedCopper(不含玻璃布),9.基材：basematerial10.层压板：laminate11.覆金属箔基材：metal-cladbadematerial12、覆铜箔层压板：copper-cladlaminate(ccl)13、单面覆铜箔层压板：single-sidedcopper-cladlaminate14、双面覆铜箔层压板：double-sidedcopper-cladlaminate15、复合层压板：compositelaminate16、薄层压板：thinlaminate17、金属芯覆铜箔层压板：metalcorecopper-cladlaminate18、金属基覆铜层压板：metalbasecopper-cladlaminate,第三篇：有关工序,PTH,1.PTH:(Platedthroughhole)电镀孔,A.Viahole:通路孔。,作用：,B.IChole:插件孔。,作用：,仅作为导通用（不作插件或焊接），如测试点和一般导通孔。,用于插件或焊接，也可导通内外层。,2.NPTH：,作用：一般是作为装配零件的定位孔或工具孔。,NPTH,(Non-platedthroughhole)非电镀孔,3.SMT/SMD,SurfaceMountingTechnology:表面贴覆技术,SMTPad:,SMT,指在线路板表面帖覆焊接元件的Pad，包括QFP(Quadflatpad)，2-Roll等。,这些也是SMTpad,4.BGA/CSP:BGA-BallGridArrayCSP-ChipScalepackage,要求：一般BGA区域VIA孔要求塞孔,说明：它们都是一种封装技术。在PCB上都表现为一VIA孔联了一个焊接PAD。,BGA/CSP,BGAPad,Line,ViaHole,5.Fiducialmark:作用：装配时作为对位的标记,说明：它是非焊接用的焊盘，通常为圆形或方形，有金属窗和绿油窗。,Fiducialmark,6.Dummypattern(thiefpattern)：,作用：使整块板的线路分布更均匀，从而提高图电质量和减少板的曲度和扭度。,要求：通常以不影响线路为标准，一般为又有三种：圆形/方形-命名为“Dummy”网状-命名为“网状Dummy”铜皮-命名为“铜皮”,Dummy,7.无孔测试Pad：,TextPad/BreakingTab,此类Pad仅供装配完后作为测试点，不装配零件。不包括SMTPAD,BGAPAD,Fiducialmarkpad.,8.BreakingTab：,印制板上无电气性能，在制作过程中用于加工具孔、定位孔或Dummy等的部分。与线路板主体部分相连处有折断孔或V-Cut。,BreakingTab,V-Cut,9.Thermal：,作用：它使在焊接时因截面过分散热而产生虚焊的可能性减少。,(heatshield）热隔离盘（大面积导电图形上，元件周围被蚀刻掉的部分）,Thermal/Clearance,10.Clearance：,无铜空间（通常指铜皮上为孔开的无铜区域）,11.S/MBridge：,作用：防止焊接时Pad间被焊锡短路。,阻焊桥（装配Pad间的阻焊条）,S/Mbridge,S/MBridgeSoldermaskintheseareas,S/Mbridge,12.Goldfinger：金手指,说明：电镀金耐磨。一般金指的S/MOPENING均为整体开窗。,13.Keyslot：键槽,作用：使印制板（金手指）只能插入与之配合的连接器中，防止插入其他连接器中的槽口。,要求：一般公差要求较紧。,14.Beveling：金指斜边,Goldfinger/Keyslot/Beveling,15.VIP：,要求：一般为S面塞孔，C面作为SMTPAD。,16.VOP：,(ViaInPad)Via孔位于SMTPad上。,说明：(ViaOnPad)Via孔先被树脂塞满，其表面（一面或两面）经过打磨、沉铜、板电镀等工序后，要求作为装配Pad。,VIP/VOP,S面塞孔,SMTPad,Viahole,树脂塞孔,SMTPad,Blind/Buriedhole,17.Blind/Buriedhole：,盲/埋孔,盲孔：从一个表面开始，在内层结束，未贯穿整板的孔。,埋孔：不经过两外表面，只在某些内层中贯穿的孔。,19.LDI,HighDensityInterconnection:高密度互联,-特点：直接用激光在干膜上曝光，不必用菲林，能保证完成线宽更细。,18.HDI,LaserDirectImage-镭射直接曝光,-特点：一般线宽/线间小于3mil/3mil导通孔小于8mil,microvia一般要求用激光钻孔。,20.Heatsink:,Sideface,BottomSide,TopSide,PCB,Pallet大铜块,Prepreg,PCB+Prepreg+Pallet,Aspectratio,21.AspectRatio：,纵横比（板厚孔径比）-影响电镀和喷锡,说明：一般采用板厚最大值与最小孔径之比。,AspectRatio=d/H,22.AGP:,显卡,主显示芯片,AGP,23.Motherboard:,内存插孔,PCI插槽,CPU插座,AGP插槽,主(机)板,Motherboard,24.Memorybank:,Memorybank,内存条,内存芯片组,第四篇：检查与测试,欧盟RoHS&WEEE指令对无铅PCB要求无铅PCB必须满足欧盟RoHS（RestrictionoftheuseofcertainHazardousSubstancesinelectricalandelectronicequipment）2002/95/EC指令和电子信息产品生产污染防治管理办法的规定，从2006年7月开始禁用六种物质（铅、镉、六价铬、水银、PBB（多溴化联苯）、PBDE（多溴联苯醚）。其中PCB板主要检测项目包括：PCB基材、阻焊、丝印、铜皮等。,Ifthisspecificationconflictswithanyotherdocumentsthefollowingorderofprecedenceshallapply:a)Purchaseorderb)Printedwiringboarddrawingsanddrillandtrimdocumentationc)Thisspecificationd)Documentsreferredtointhisspeciation.SuppliershalluseapplicablefabricationpanelcouponasdefinedinIPC-2221.Micro-sectionscoupon,andsoldersamplesshallbeprovidedwitheachshipmentforvalidationrequirement.,1.Maximum3repairoperationsareallowedoneachboardandthenumberofrepairedPCBScannotexceedthe10percentoftheentirelotpopulation.2.Unlessotherwisespecifiedontheengineeringdrawing,platedthroughviaholeswithanominalsizeof0.020inchorlessmaybepartiallyorcompletelypluggedwithsolder.3.Asapreventiveprecaution.beforethelayingdownofthesolder,thePCBSwillhavetobewashedtoremovetheresidualsduetotheproductionprocess,theclearingdegreeofthePCBSbeforethecoatinghastobethefollowingoneMAX1ug/squarecm.,1.Soldermask(SMOBC)-ApplyLPIsoldermasksperIPC-SM-840typeB.class3.colorgreenandminimumsoldermasksthicknessovertheedgesshallbe0.001”.LPIsoldermaskandsoldershallmeettheUL94v-orequirements.ThereshallbenosoldermasksovertheSMTpads,thereshallbenoexposedtracesonoutsidelayersandsoldermaskopeningshouldbe0.002”sidelargerthanpad.2.PCB“Stack-Up”constructionrequirementsaretobedet