华硕电脑SMT外观允收标准

1-1,PCBA半成品握持方法-1-3PCBAWIPHandingSMT零件組裝工藝標準-晶片狀(Chip)零件之對準度(組件X方向)-1-4SMDAssemblyworkmanshipcriteria-Chipcomponentalignment(XAxis)SMT零件組裝工藝標準-晶片狀(Chip)零件之對準度(組件Y方向)-1-5SMDAssemblyworkmanshipcriteria-Chipcomponentalignment(YAxis)SMT零件組裝工藝標準-圓筒形（Cylinder）零件之對準度-1-6SMDAssemblyworkmanshipcriteria-CylindercomponentalignmentSMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳面之對準度-1-7SMDAssemblyworkmanshipcriteria-Gull-WingfootprintalignmentSMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳趾之對準度-1-8SMDAssemblyworkmanshipcriteria-Gull-WingtoealingnmentSMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳跟之對準度-1-9SMDAssemblyworkmanshipcriteria-Gull-WingheelalingnmentSMT零件組裝工藝標準-零件腳面(LatchofCN2302)之對準度-1-10SMDAssemblyworkmanshipcriteria-Componentfootprint(LatchofCN2302)alignmentSMT零件組裝工藝標準-J型腳零件對準度-1-11SMDAssemblyworkmanshipcriteria-JtypeleadalignmentSMT焊點性工藝標準-鷗翼(Gull-Wing)腳面焊點最小量-1-12SMDsolderjointworkmanshipcriteria-MinimumsolderofGullWingfootprintSMT焊點性工藝標準-鷗翼(Gull-Wing)腳面焊點最大量-1-13SMDsolderjointworkmanshipcriteria-MaximumsolderofGullWingfootprintSMT焊點性工藝標準-鷗翼(Gull-Wing)腳跟焊點最大量-1-14SMDsolderjointworkmanshipcriteria-MinimumsolderofGullWingHeelSMT焊點性工藝標準-J型接腳零件之焊點最小量-1-15SMDsolderjointworkmanshipcriteria-MinimumsolderofJtypeleadSMT焊點性工藝標準-J型接腳零件之焊點最大量工藝水準點-1-16SMDsolderjointworkmanshipcriteria-MaximumsolderofJtypeleadSMT焊點性工藝標準-晶片狀(Chip)零件之最小焊點(三面或五面焊點)-1-17SMDsolderjointworkmanshipcriteria-Minimumsolderfilletofchipcomponent(3or5faceterminations)SMT焊點性工藝標準-晶片狀(Chip)零件之最大焊點(三面或五面焊點)-1-18SMDsolderjointworkmanshipcriteria-Maximumsolderfilletofchipcomponent(3or5faceterminations)SMT焊錫性工藝標準-焊錫性問題(錫珠、錫渣)-1-19SMDsolderjointworkmanshipcriteria-Othersolderissue(solderball,solderdross)DIP零件組裝工藝標準-臥式零件組裝之方向與極性-1-20DIPcomponentAssemblyworkmanshipcriteria-Directionandpolarityofhorizontally,mountedDIP零件組裝工藝標準-立式零件組裝之方向與極性-1-21DIPcomponentAssemblyworkmanshipcriteria-Direction&polarityofverticallymountedDIP零件組裝工藝標準-零件腳長度標準-1-22DIPcomponentAssemblyworkmanshipcriteria-LengthofcomponentleadDIP零件組裝工藝標準-臥式電子零組件(R,C,L)浮件與傾斜(1)-1-23DIPcomponentAssemblyworkmanshipcriteria-Tilt&floatingofhorizontalelectroniccomponent(R,C,L)DIP零件組裝工藝標準-臥式電子零組件(Wire)浮件與傾斜(2)-1-24DIPcomponentAssemblyworkmanshipcriteria-Tilt&floatingofhorizontalelectroniccomponent(Wire)DIP零件組裝工藝標準-立式電子零組件(C,F,L,Buzzer)浮件-1-25DIPcomponentAssemblyworkmanshipcriteria-Floatingofverticalelectroniccomponent(C,F,L,Buzzer)DIP零件組裝工藝標準-立式電子零組件(C,F,L,Buzzer)傾斜-1-26DIPcomponentAssemblyworkmanshipcriteria-Tiltofverticleelectroniccomponent(C,F,L,Buzzer)DIP零件組裝工藝標準-機構零件(Slot,Socket,DIM,Heatsink)浮件-1-27DIPcomponentAssemblyworkmanshipcriteria-Floatingofconstructivecomponent(slot,socket,Dim,Heatssink),目錄,1-2,DIP零件組裝工藝標準-機構零件(Slot,Socket,DIM,Heatsink)傾斜-1-28DIPcomponentAssemblyworkmanshipcriteria-Tiltofconstructivecomponent(slot,socket,Dim,Heatsink)DIP零件組裝工藝標準-機構零件(JumperPins,BoxHeader)浮件-1-29DIPcomponentAssemblyworkmanshipcriteria-Floatingofconstructivecomponent(JumperPins,Boxheader)DIP零件組裝工藝標準-機構零件(JumperPins,BoxHeader)傾斜-1-30DIPcomponentAssemblyworkmanshipcriteria-Tiltofconstructivecomponent(JumperPins,Boxheader)DIP零件組裝工藝標準-機構零件(CPUSocket)浮件與傾斜-1-31DIPcomponentAssemblyworkmanshipcriteria-Tiltandfloatingofconstructivecomponent(CPUSocket)DIP零件組裝工藝標準機構零件(USB,D-SUB,PS/2,K/B&generalcon.Jack)浮件與傾斜-1-32DIPcomponentAssemblyworkmanshipcriteria-Tiltandfloatingofconstructivecomponent(USB,D-sub,PS/2,K/B&generalconnectorJack)DIP零件組裝工藝標準-機構零件(PowerConnector)浮件與傾斜-1-33DIPcomponentAssemblyworkmanshipcriteria-Tiltandfloatingofconstructivecomponent(PowerConnector)DIP零件組裝工藝標準-機構零件(JumperPins,BoxHeader)組裝外觀(1)-1-34DIPcomponentAssemblyworkmanshipcriteria-Workmanship(1)ofconstructivecomponent(JumperPin,Boxheader)DIP零件組裝工藝標準-機構零件(JumperPins,BoxHeader)組裝外觀(2)-1-35DIPcomponentAssemblyworkmanshipcriteria-Workmanship(2)ofconstructivecomponent(JumperPins,Boxheader)DIP零件組裝工藝標準-機構零件(BIOS&Socket)組裝外觀(3）-1-36DIPcomponentAssemblyworkmanshipcriteria-Workmanship(3)ofconstructivecomponent(BIOS&Socket)DIP零件組裝工藝標準-組裝零件腳折腳、未入孔(1)-1-37DIPcomponentAssemblyworkmanshipcriteria-Leadbendandno-insidethehole(1)ofassembleyDIP零件組裝工藝標準-零件腳折腳、未入孔、未出孔(2)-1-38DIPcomponentAssemblyworkmanshipcriteria-Leadbendno-insideno-through(2)oftheholeDIP零件組裝工藝標準-板彎、板翹、板扭(平面度)-1-39DIPcomponentAssemblyworkmanshipcriteria-boardwrapageDIP零件組裝工藝標準-零件腳與線路間距-1-40DIPcomponentAssemblyworkmanshipcriteria-thespacebetweenleadtotraceDIP零件組裝工藝標準-零件破損(1)-1-41DIPcomponentAssemblyworkmanshipcriteria-componentbroken(1)DIP零件組裝工藝標準-零件破損(2)-1-42DIPcomponentAssemblyworkmanshipcriteria-componentbroken(2)DIP零件組裝工藝標準-零件破損(3)-1-43DIPcomponentAssemblyworkmanshipcriteria-componentbroken(3)DIP零件組裝工藝標準-機構零件(USB)偏移率-1-44DIPcomponentAssemblyworkmanshipcriteria-Shiftedrateofconstructivecomponent(USBconnector)DIP零件組裝工藝標準-機構零件(DCJack)對準度-1-45DIPcomponentAssemblyworkmanshipcriteria-Shiftedrateofconstructivecomponent(DC_Inconnector)DIP焊錫性工藝標準-零件面孔填錫與切面焊錫性標準(1)-1-46DIPsolderingworkmanship-thesolderfilletinthePTHbycross-section(1)DIP焊錫性工藝標準-零件面孔填錫與切面焊錫性標準(2)-1-47DIPsolderingworkmanship-thesolderfilletinthePTHbycross-section(2)DIP焊錫性工藝標準-焊錫面焊錫性標準(1)-1-48DIPsolderingworkmanship-solderingstandardonsolderside(1)DIP焊錫性工藝標準-焊錫面焊錫性標準(2)-1-49DIPsolderingworkmanship-solderingstandardonsolderside(2)DIP焊錫性工藝標準-焊錫面焊錫性標準(3)-1-50DIPsolderingworkmanship-solderingstandardonsolderside(3)DIP焊錫性工藝標準-DIP插件孔焊錫性檢驗圖示-1-51DIPsolderingworkmanship-FigureofPTHsolderfilletevaluationDIP焊錫性工藝標準-焊錫性問題(錫橋、短路、錫裂)-1-52DIPsolderingworkmanship-solderingissue(Bridge,short,crack)DIP焊錫性工藝標準-焊錫性問題(空焊、錫珠、錫渣、錫尖)-1-53DIPsolderingworkmanship-solderingissue(missingsolder,solderball,solderdross,solderpeak)金手指工藝標準-沾錫、沾漆、沾膠、刮傷翹起-1-54Goldfingerworkmanship,目錄,1-3,PCBA半成品握持方法:PCBAWIPproducthandling,理想狀況（TargetCondition）：配帶乾淨手套與配合良好靜電防護措施。HandlingwithcleanglovesandfullESDprotection,允收狀況（AcceptCondition）：配帶良好靜電防護措施，握持PCB板邊或板角執行檢驗。HandlingwithcleanhandsbyboardedgesusingfullESDprotection,拒收狀況（RejectCondition）：未有任何靜電防護措施，並直接接觸及導體、金手指與錫點表面(MA)。Handlingwithbarehandstouchingconductors,solderconnectionsandgoldfinger,NoESDprotectionimplemented,1-4,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT零件組裝工藝標準-晶片狀(Chip)零件之對準度(組件X方向)SMDAssemblyworkmanshipcriteria-Chipcomponentalignment(XAxis),1.晶片狀零件恰能座落在焊墊的中央且未發生偏出，所有各金屬封頭都能完全與焊墊接觸。1.Componentiscenteredonbothsidesoftheland.Allthesolderterminationsshallcompletelytouchpad.,1.零件橫向超出焊墊以外，但尚未大於其零件寬度的50%。(X1/2W)1.Thecomponentshiftedoffthepadandshiftlengthshallless1/2chipwidth,1.零件已橫向超出焊墊，大於零件寬度的50%(MI)。(X1/2W)1.Thecomponentshiftedoffthepadandshiftlengthover1/2chipwith,允收狀況(AcceptCondition),X1/2WX1/2W,330,X1/2WX1/2W,註:此標準適用於三面或五面之晶片狀零件Thisstandardonlybeusedfor3or5faceterminationschipcomponent,w,w,330,330,1-5,理想狀況(TargetCondition),拒收狀況(RejectCondition),1.晶片狀零件恰能座落在焊墊的中央且未發生偏出，所有各金屬封頭都能完全與焊墊接觸。1.Componentiscenteredonbothsidesoftheland.Allthesolderterminationsshallcompletelytouchpad.,1.零件縱向偏移，但零件端電極仍蓋住焊墊為其零件寬度的25%以上。(Y11/4W)Componentisshiftedtowardslongestpartofthechip,butthetermiuadendofchipstillontheland1.1/4widthofthelandforsolderfillettoform.,1.零件縱向偏移，但零件端電極蓋住焊墊小於其零件寬度的25%。(Y11/4W)Y11/4Wisrejected.,允收狀況(AcceptCondition),WW,330,330,Y11/4W,330,Y11/4W,SMT零件組裝工藝標準-晶片狀(Chip)零件之對準度(組件Y方向)SMDAssemblyworkmanshipcriteria-Chipcomponentalignment(YAxis),1-6,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT零件組裝工藝標準-圓筒形（Cylinder）零件之對準度SMDAssemblyworkmanshipcriteria-Cylindercomponentalignment,1.組件的接觸點在焊墊中心1.Thepointofcontactiscenteredonthelands,1.組件端寬(短邊)突出焊墊端部份是組件端直徑33%以下。(X1/3D)2.零件縱向偏移，但金屬封頭仍在焊墊上。(Y10mil),(Y20mil)1.Thelengthofcomponentshiftedoffthepad(X)shalllessthe1/3Diameterofcomponent2.Shiftedtowardthelongestpartofthecomponent,thesolderterminationsstillontheland,1.組件端寬(短邊)突出焊墊端部份是組件端直徑33%以上(MI)。(X1/3D)2.零件縱向偏移，但金屬封頭未在焊墊上。(Y10mil),(Y20mil)3.Whicheverisrejected.,允收狀況(AcceptCondition),X1/3DX1/3DY20milY10mil,X1/3DX1/3DY20milY10mil,註：為明瞭起見,焊點上的錫已省去。Note:Inordertoclarifythefigure,thesolderjointbeeliminated,D,1-7,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳面之對準度SMDAssemblyworkmanshipcriteria-Gull-Wingfootprintalignment,1.各接腳都能座落在各焊墊的中央，而未發生偏滑。1.Alltheleadsfootprintiscenteredonthelands,1.各接腳已發生偏滑，所偏出焊墊以外的接腳，尚未超過接腳本身寬度的1/4W。(X1/4W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)。(S5mil(0.13mm)1.Thelengthoftheleadfootprintshiftedofftheland(X)shallless1/4widthoflead2.Theclearance(S)betweenleadshiftedoffandlandshallover5mil(0.13mm),允收狀況(AcceptCondition),WS,X1/4WS5mil(0.13mm),X,X1/4WS5mil(0.13mm),1.各接腳已發生偏滑，所偏出焊墊以外的接腳，已超過接腳本身寬度的1/4W(MI)。(X1/4W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)(MI)。(S5mil(0.13mm)3.Whicheverisrejected.,1-8,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳趾之對準度SMDAssemblyworkmanshipcriteria-Gull-Wingtoealingnment,1.各接腳都能座落在各焊墊的中央，而未發生偏滑。1.Alltheleadsfootprintiscenteredonthelands,1.各接腳已發生偏滑，所偏出焊墊以外的接腳，尚未超過焊墊側端外緣。1.Theleadhadshiftedandfootprintnotovertheendofland,1.各接腳側端外緣，已超過焊墊側端外緣(MI)。1.Theleadhadshiftedandfootprinthadovertheendofland(MI),允收狀況(AcceptCondition),WW,已超過焊墊側端外緣,1-9,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳跟之對準度SMDAssemblyworkmanshipcriteria-Gull-Wingheelalingnment,1.各接腳都能座落在各焊墊的中央，而未發生偏滑。1.Alltheleadsfootprintiscenteredonthelands,1.各接腳已發生偏滑，腳跟剩餘焊墊的寬度，最少保有一個接腳厚度(XT)。1.Theleadhadshiftedthelengthfromleadheeltoendofland(X)shallbeoverthethicknessoflead(T),1.各接腳己發生偏滑，腳跟剩餘焊墊的寬度，已小於接腳厚度(X0mm(MI)。1.TheleadhadshiftedandfootprinthadovertheendoflandA0mmorB0mm(MI),A0,B0,Latch,Pad,1-11,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT零件組裝工藝標準-J型腳零件對準度SMDAssemblyworkmanshipcriteria-Jtypeleadalignment,1.各接腳都能座落在焊墊的中央，未發生偏滑。1.Alltheleadsfootprintiscenteredonthelands,允收狀況(AcceptCondition),SW,S5milX1/4W,S1/4W,1.各接腳已發生偏滑，所偏出焊墊以外的接腳，已超過接腳本身寬度的1/4W(MI)。(X1/4W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)以下(MI)。(S5mil)3.Whicheverisrejected.,1.各接腳已發生偏滑，所偏出焊墊以外的接腳，尚未超過接腳本身寬度的1/4W。(X1/4W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)以上。(S5mil)Theleadhadshiftedofftheland1.Thelengthofleadshiftedofftheland(X)shallless1/4widthoflead(W)2.Theclearancedistancebetweenshiftedleadandlandedgeshallover5mil,1-12,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT焊點性工藝標準-鷗翼(Gull-Wing)腳面與腳跟焊點最小量SMDsolderjointworkmanshipcriteria-MinimumsolderofGullWingfootprint,1.引線腳的側面,腳跟吃錫良好2.引線腳與板子焊墊間呈現凹面焊錫帶。3.引線腳的輪廓清楚可見。1.sidefaceandfootprinthavegoodsolderfillet2.concavefilletbetweenlandandlead3.theshape(profile)ofleadbeclearlyvisible,1.引線腳的底邊與板子焊墊間的銲錫帶週長(U)至少涵蓋引線腳周長(2L+2W)的1/2以上(U(L+W)。2.引線腳的底邊與焊墊間需有焊錫附著。3.腳跟(Heel)焊錫帶涵蓋高度h大於零件腳1/2厚度(h1/2T)。4.腳跟(Heel)沾錫角需90onheel,允收狀況(AcceptCondition),L,L,h1/2T,T,h1/2T,T,w,Edgeoffootprint,1-13,理想狀況(TargetCondition),SMT焊點性工藝標準-鷗翼(Gull-Wing)腳面焊點最大量SMDsolderjointworkmanshipcriteria-MaximumsolderofGullWingfootprint,1.引線腳的側面,腳跟吃錫良好。2.引線腳與板子焊墊間呈現凹面焊錫帶。3.引線腳的輪廓清楚可見。1.sidefaceandfootprinthavegoodsolderfillet2.concavefilletbetweenlandandlead3.theshape(profile)ofleadbeclearlyvisible,1.引線腳與板子焊墊間的焊錫連接很好且呈一凹面焊錫帶。2.引線腳的側端與焊墊間呈現稍凸的焊錫帶。3.引線腳的輪廓可見。1.Goodsolderflowupandconcavefilletbetweenlandandlead2.Concavesolderfilletbetweensidefaceofleadandland3.Theshape(profile)oflead(footprint)beclearlyvisible,1.焊錫帶延伸過引線腳的頂部(MI)。2.引線腳的輪廓模糊不清(MI)。3.Whicheverisrejected.1.solderflowcovertheend(TIP)oflead2.Theshape(profile)ofleadnotbevisibleclearly3.Whicheverisrejected,拒收狀況(RejectCondition),允收狀況(AcceptCondition),1-14,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT焊點性工藝標準-鷗翼(Gull-Wing)腳跟焊點最大量SMDsolderjointworkmanshipcriteria-MaximumsolderofGullWingHeel,1.腳跟的焊錫帶延伸到引線上彎曲處底部(B)與下彎曲處頂部(C)間的中心點。註：引線上彎頂部：引線上彎底部：引線下彎頂部：引線下彎底部1.SolderflowuptothecenterbetweenB,Cpointontheheeloflead,1.腳跟的焊錫帶已延伸到引線上彎曲處的底部(B)。1.solderflowuptoBpointontheheel,1.腳跟的焊錫帶延伸到引線上彎曲處的底部(B)，延伸過高，且沾錫角超過90度，才拒收(MI)。1.Solderflowupover(cross)Bpointandthewettingangleover90degree,允收狀況(AcceptCondition),沾錫角超過90度,A,B,D,C,1-15,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT焊點性工藝標準-J型接腳零件之焊點最小量SMDsolderjointworkmanshipcriteria-MinimumsolderofJtypelead,1.凹面焊錫帶存在於引線的四側2.焊錫帶延伸到引線彎曲處兩側的頂部(A,B)。3.引線的輪廓清楚可見。4.所有的錫點表面皆吃錫良好。1.Solderconcavefilletonthe4faceoflead2.solderflowuptotheanglehighpointA,B3.Leadshape(profile)canbeclearlyvisible4.Goodsolderingjointateverysoldercontact,1.焊錫帶存在於引線的三側2.焊錫帶涵蓋引線彎曲處兩側的50%以上(h1/2T)。1.Solderconcavefilletonthe3faceoflead2.Heightofsolderflow-upontheleadangle(h)shallover1/2angleheight(T),1.焊錫帶存在於引線的三側以下(MI)。2.焊錫帶涵蓋引線彎曲處兩側的50%以下(h1/2T)(MI)。3.Whicheverisrejected.1.Solderconcavefilletisless3face2.Heightofsolderflow-upontheleadangle(h)under1/2angleheight(T)3.Whicheverisrejected,允收狀況(AcceptCondition),h1/2T,A,TB,h1/2T,1-16,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT焊點性工藝標準-J型接腳零件之焊點最大量工藝水準點SMDsolderjointworkmanshipcriteria-MaximumsolderofJtypelead,1.凹面焊錫帶存在於引線的四側2.焊錫帶延伸到引線彎曲處兩側的頂部(A,B)。3.引線的輪廓清楚可見。4.所有的錫點表面皆吃錫良好。1.Solderconcavefilletonthe4faceoflead2.solderflowuptotheanglehighpointA,B3.Leadshape(profile)canbeclearlyvisible4.Goodsolderingjointateverysoldercontact,1.凹面焊錫帶延伸到引線彎曲處的上方,但在組件本體的下方。2.引線頂部的輪廓清楚可見。1.Solderflowuptotopofleadangleandnottouchthebody2.Shape(profile)ofleadanglecanbevisibleclearly,1.焊錫帶接觸到組件本體(MI)。2.引線頂部的輪廓不清楚(MI)。3.錫突出焊墊邊(MI)。4.Whicheverisrejected.1.Solderhadtouchedthebody2.Shape(profile)ofleadanglecannotbevisibleclearly3.Excesssolderonthesideofsolderland,允收狀況(AcceptCondition),A,B,1-17,理想狀況(TargetCondition),拒收狀況(RejectCondition),SMT焊點性工藝標準-晶片狀(Chip)零件之最小焊點(三面或五面焊點)SMDsolderjointworkmanshipcriteria-Minimumsolderfilletofchipcomponent(3or5faceterminations),1.焊錫帶延伸到晶片端電極高度的25%以上。(h1/4T)2.焊錫帶從晶片外端向外延伸到焊墊的距離為晶片高度的25%以上。(X1/4H)1.1/4componentheightbefilletbysolderatleast2.Solderflowspreadonthelandshall1/4widthofcomponentheightatleast,(Countfromtipofcomponent),1.焊錫帶延伸到晶片端電極高度的25%以下(MI)。(h1/4T)2.焊錫帶從晶片外端向外延伸到焊墊端的距離為晶片高度的25%以下(MI)。(X1/4T)3.Whicheverisrejected.,允收狀況(AcceptCondition),T,h1/4TX1/4T,h8mil(0.20mm)2.Whicheverisrejected.,允收狀況(AcceptCondition),可被剝除者D8mil(0.20mm),可被剝除者D8mil(0.20mm),不易被剝除者L8mil(0.20mm),不易被剝除者Lmil(0.20mm),1-20,理想狀況(TargetCondition),拒收狀況(RejectCondition),DIP零件組裝工藝標準-臥式零件組裝之方向與極性DIPcomponentAssemblyworkmanshipcriteria-Directionandpolarityofhorizontally,mounted,1.零件正確組裝於兩錫墊中央。2.零件之文字印刷標示可辨識。3.非極性零件文字印刷的辨識排列方向統一。（由左至右，或由上至下）1.Componentarecenteredbetweentheirlands2.Componentmarkingsarevisible3.Non-polarizedcomponentsneedtobeorientedsothatmarkingallreadthesameway(Left-to-rightortop-tobottom),1.極性零件與多腳零件組裝正確。2.組裝後,能辨識出零件之極性符號3.所有零件按規格標準組裝於正確位置。4.非極性零件組裝位置正確，但文字印刷的辨示排列方向未統一(R1,R2)。1.Polarizedandmulti-leadcomponentsareorientedcorrectly2.Polarizationsymbolsarevisibleafterassembly3.Allcomponentsareasspecifiedandterminatetocorrectlands4.Non-polarizedcomponentsneednotbeoriented,1.使用錯誤零件規格(錯件)(MA)。2.零件插錯孔(MA)。3.極性零件組裝極性錯誤(MA)(極反)4.多腳零件組裝錯誤位置(MA)。5.零件缺組裝(MA)。(缺件)6.Whicheverisrejected。1.Componentisnotasspecified(Wrongparts)2.Componentnotmountedincorrectholes3.Polarizedcomponentmountedbackwards(Wrongoriented)4.Multileadcomponentnotorientedcorrectly5.Componentaremissing(missingparts)6.Whicheverisrejected.,允收狀況(AcceptCondition),+,R1,+C1,Q1,R2,D2,+,R1,+C1,Q1,R2,D2,+,C1+,D2,R2,Q1,1-21,理想狀況(TargetCondition),拒收狀況(RejectCondition),DIP零件組裝工藝標準-立式零件組裝之方向與極性DIPcomponentAssemblyworkmanshipcriteria-Direction&polarityofverticallymounted,1.無極性零件之文字標示辨識由上至下。2.極性文字標示清晰。1.Themarkingofnon-polarizedcomponentcanbeidentified.Fromtoptodown2.Polarizedmarkingbeclearly,1.極性零件組裝於正確位置。2.可辨識出文字標示與極性。1.Polarizedcomponentaremountedwithcorrectorientalatrightlocation2.Markingandpolarizedsymbolareidentifiedcleatly,1.極性零件組裝極性錯誤(MA)。(極反)2.無法辨識零件文字標示(MA)。3.Whicheverisrejected。,允收狀況(AcceptCondition),1000F6.3F,+,-,-,-,+,1000F6.3F,+,+,+,-,-,-,+,1016+,332J,1000F6.3F,+,-,-,-,+,1016+,332J,J233,1-22,理想狀況(TargetCondition),拒收狀況(RejectCondition),DIP零件組裝工藝標準-零件腳長度標準DIPcomponentAssemblyworkmanshipcriteria-Lengthofcomponentlead,1.插件之零件若於焊錫後有浮高或傾斜,須符合零件腳