新产品导入品质计划的重要性(推荐ppt210).ppt

1-1,NewProductIntroduction,andtheImportanceofAdvancedQualityPlanning,1-2,新產品導入,先期品質計劃的重要性,2-1,WorkshopObjectives,RevisittheNewProductIntroductionstageasakeystepinyourQualityStrategyandthetypicalpitfallsduringthisstageRevisittheconceptofConcurrentEngineering(CE)successesandlessonsareseldomcapturedandsharedbetweenbusinessunitsordepartments:mistakesrepeat,andsuccessdont.nomeasuresareavailabletoallprojectmanagerstoassesstheperformanceoftheirprojectsagainstotherprojects;nobodyknowsifhehasdonebetterorworsethanhiscompetitors.,16-2,RseparatedesignandmanufacturingdocumentationIndividualcontributionhighlyvaluedandrewardedOver-the-walldesigntransferandserialdesignandmanufacturingactivitiesconsiderednormalmodeofoperation,21-2,獨立階段,於新產品開發階段，相互之間很少或沒有互動。設計由開發人員獨佔；設計文件與制造文件分開。過高看重個人貢獻並給與獎勵。“隔牆”設計轉移，串行設計及制造活動被視為正常的運作模式。,22-1,EvaluationmeetingwithmanufacturingwereconductedafterthedesignworkwascompleteDesignswerefrequentlyreworkedtoaccommodatemanufacturingissues,resultinginlongerdevelopmentintervalsRelationshipbetweenmanufacturinganddesignchangedfromlittleinteractiontoanantagonistic,emotionallychargedandtenserelationship,22-2,評價設計工作完成之後，與制造部門進行溝通。設計需頻繁修改以兼顧制造問題，而導致開發時間延長。制造及設計間的關系由很少互動轉為一種對抗的，互相指責的且緊張的關系。,23-1,EducationreviewsandreworkwerereducedDesignersbecamemoreknowledgeableandsensitivetomanufacturingandotherdownstreamprocessesaffectedbythedesign;productdesignsbegantoreflectmanufacturingissuesupfrontinthedesignprocess,andsomefull-streamoptimizationoccurredManufacturingengineersremainedisolatedfromdesignprocess,withtheexceptionofmanufacturabilityreviewsDesignersbegantorealizethatitisdifficulttokeepupwithandhandleallthemanufacturinginformation;awarenessincreasedthatdesignerscannotdoDFXbythemselves,23-2,訓練評估及重工減少。設計人員變得更博學，對制造問題及其它受設計影響的下序制程更敏感；產品設計開始提前於設計階段就反映制造問題，整個流程實現某種程度的優化。除了進行制造可行性評估外,制造工程師依然被隔離於設計制程之外。設計人員開始意識到難於做到與所有制造資訊保持同步及適時處理，更強烈地意識到並非設計人員能夠獨自進行DFX。,24-1,PartTimeParticipationStage,Manufacturingbecameinvolvedearlyinthedesignprocessasanactiveparticipant(stillpart-time);reviewsandreworkeliminatedFrequentinteractionsoccurredbetweendesignandmanufacturing;communicationpathswereopenedConcurrentdesignofproductandtheassociateddownstreamprocessestookplaceonalimitedbasis,withsomeshareddecisionmakingbetweendesignandmanufacturing;manufacturingreadinessintervals(finaldesigntoproductionship)begantodecreaseSuccessfactorsforconcurrentengineeringbegantosurface,includingsharedobjectives,communicationtools,shareddesigntools,commonvaluesandrewardsystems,andcommonprocessesDesignerscontinuedto“own”theproductdesign,24-2,部分時間參與階段,制造作為一個積極參與者（仍然是部分時間)逐漸介入於設計制程早期階段；評估及重工被消除。設計及制造部門開始頻繁互動；溝通渠道敞開。產品及相聯系的下序制程的同步設計只發生在有限的基礎上，於設計及制造間一些決策文件共享；制造準備時間（最終設計至生產出貨）開始縮短。同步工程的成功因素開始顯現，包括目標共享，溝通工具，設計工具共享，共享價值及報酬體系，共有制程。設計人員繼續“擁有”產品設計。,25-1,IntegratedDevelopmentTeamsStage,ThisisthefinalstagewhereDesignandManufacturingworkcloselytogethertoachievethecompanysgoals.,25-2,經整合之開發團隊階段,這是最後階段,于此階段,設計及制造部門密切合作，共同達成公司目標。,26-1,PresentationonConcurrentEngineeringActivities,26-2,同步工程活動介紹,27-1,TheConcurrentEngineeringStage,RNPIFMEAEarlyprocessoptimizationEffectiveCLCA,TheFactoryasanInternalCustomer,45-2,影響工廠之問題,問題解決,問題出現,營運利潤,品質之能動作用減少工廠新問題發生之頻率增加問題解決之頻率,新設計供應商元件所需文件NPIFMEA早期制程優化有效之CLCA,視工廠為內部客戶,46-1,MappingR2ndweek75%;3rdweek100%,Done.Directlabouronly.,InitialMassProduction-75%FinalMassProduction-85%,Done.Attachment4,Done.SeeAttachment5(workmanshipStandards第2周75%;第3周100%,Done.僅對直接人員,初步量產-75%最終量產-85%,Done.附件4,Done.見附件5(工藝標準HDDtype:Mode3orMode4orUP,PrimaryIDE,SampleTestPlanAttachment1,75-2,測試項目,功能測試,前置測試,抽樣,功能描述,老化,OQC,自動即時時鐘,自動設置主板即時時鐘CMOS時間/日期檢查RTC功能,如有使用，進行高端內存檢測,高端內存測試,檢查CPU速度,CPU速度測試,1.44MB軟驅磁片執行隨机讀寫測試,軟驅測試,串行口鼠標左右鍵及移動測試,串行鼠標測試,PS/2鼠標左右鍵及移動測試,PS/2鼠標測試,使用回路連接頭測試串行口信號,波特率分別為:1200,2400,4800,9600,19200,38400,57600,115200,串行口測試,外部回路連接頭測試數据線和控制線,并行口測試,IDE以MS-DOS引導并運行所有測試程式;硬盤類型:MODE3或MODE4或更高,主IDE接口,抽樣測試計划附件1,76-1,TestItem,FuncTest,Pretest,Sampling,FunctionDescription,Aging,OQC,SecondaryIDE,PerformsATAPICD-ROMRead/Write/Comparetests.CD-ROMtype:Mode3orMode4orUP.,GeneralArithmeticLogicaltestDMA8237A-1,DMA8237A-2,Pageregisterstest.ProtectModetestInterrupttestADD,SUBTRACT,Multiplication,Divisiontest,Clock,Calendartest.,MainComponents,SystemMemoryTest,ChecksystemmemorysizeTestbasememoryNC=8step;SP=2step,Resistor,712,600,84.27%,NC=107step;NP=5step;SP=0step,Capacitor,559,159,28.44%,Parallel=248step;NC=152step;NP=0step,Inductor,0,0,0%,SP=0step;NC=0step,Diode,66,48,72.73%,NP=0step;NC=18step,Transistor,56,40,71.43%,SP=0step;NC=16step,ClampingDiode,1610,1610,100%,Diode100%tested,TestJet,1670,1253,75.03%,VCCLV=10,Others,0,0,0%,TotalStep,4761,3787,79.54%,NP+NC+TP+SP=449step,ActualCoverage,4312,3787,87.82%,Note:JP=Jumper;NP=NoPin;NC=NoComponent;LV=LowValue;TP=TiePin,ICTComponentTestStepAnalysisResults(SMT),81-2,元件,步驟,可測試,百分比,備注,跳線,88,77,87.5%,NP=1step;NC=8step;SP=2step,電阻,712,600,84.27%,NC=107step;NP=5step;SP=0step,電容,559,159,28.44%,Parallel=248step;NC=152step;NP=0step,電感,0,0,0%,SP=0step;NC=0step,二极管,66,48,72.73%,NP=0step;NC=18step,晶体,56,40,71.43%,SP=0step;NC=16step,箝位二极管,1610,1610,100%,Diode100%tested,TestJet,1670,1253,75.03%,VCCLV=10,其它,0,0,0%,總步驟,4761,3787,79.54%,NP+NC+TP+SP=449step,實際涵蓋率,4312,3787,87.82%,Note:JP=跳線;NP=無PIN;NC=沒元件;LV=低電屏;TP=TiePin,ICT元件測試步驟分析結果(SMT),82-1,Component,Step,Testable,Percentage,Remarks,Jumper,125,89,71.2%,NP=29step;NC=5step;SP=2step,Resistor,712,595,83.57%,NC=112step;NP=5step;SP=0step,Capacitor,559,106,18.86%,Parallel=247step;NC=115step;NP=0step,Inductor,0,0,0%,SP=0step;NC=0step,Diode,66,54,81.82%,NP=0step;NC=12step,Transistor,55,39,79.91%,SP=0step;NC=16step,ClampingDiode,66,66,100%,Diode100%tested,TestJet,354,192,54.24%,VCCLV=0,Others,0,0,0%,TotalStep,1937,1141,58.91%,NP+NC+TP+SP=386step,ActualCoverage,1551,1141,73.57%,Note:JP=Jumper;NP=NoPin;NC=NoComponent;LV=LowValue;TP=TiePin,ICTComponentTestStepAnalysisResults(DIP),82-2,元件,步驟,可測試,百分比,備注,跳線,125,89,71.2%,NP=29step;NC=5step;SP=2step,電阻,712,595,83.57%,NC=112step;NP=5step;SP=0step,電容,559,106,18.86%,Parallel=247step;NC=115step;NP=0step,電感,0,0,0%,SP=0step;NC=0step,二极管,66,54,81.82%,NP=0step;NC=12step,晶体,55,39,79.91%,SP=0step;NC=16step,箝位二极管,66,66,100%,Diode100%tested,TestJet,354,192,54.24%,VCCLV=0,其它,0,0,0%,總步驟,1937,1141,58.91%,NP+NC+TP+SP=386step,實際覆蓋率,1551,1141,73.57%,Note:JP=跳線;NP=無PIN;NC=無元件;LV=低電屏;TP=TiePin,ICT元件測試步驟分析結果(DIP),83-1,PartNumber,Qty,Location,06-006001000,1,U17,07-001000000,1,D1,07-002009000,1,D38,1,Q7,10-002300000,1,L33,10-003400000,1,R13,07-005000010,1,Q11,07-005025200,11-031447502,9,C2450C2458,11-033005000,15,C121,C122,C133,C158C165,C194,C226,C81,CB95,11-003010000,14,C120,C155,C156,C190C192,C195C200,C62,C97,11-033012000,2,C141,C142,11-033015000,10,C110,C111,C147,C152,C153,C166,C167,C180,C230,C231,11-033010100,1,C56A,11-033022100,3,C213,C217,C54,11-033033000,6,C43,C44,C46C49,11-033110200,3,C75,C83,C117,11-033147100,1,CB178,11-033168100,4,C114,C115,C123,C126,LOCATIONSNOTCOVEREDBYICTTEST,83-2,料號,數量,位置,06-006001000,1,U17,07-001000000,1,D1,07-002009000,1,D38,1,Q7,10-002300000,1,L33,10-003400000,1,R13,07-005000010,1,Q11,07-005025200,11-031447502,9,C2450C2458,11-033005000,15,C121,C122,C133,C158C165,C194,C226,C81,CB95,11-003010000,14,C120,C155,C156,C190C192,C195C200,C62,C97,11-033012000,2,C141,C142,11-033015000,10,C110,C111,C147,C152,C153,C166,C167,C180,C230,C231,11-033010100,1,C56A,11-033022100,3,C213,C217,C54,11-033033000,6,C43,C44,C46C49,11-033110200,3,C75,C83,C117,11-033147100,1,CB178,11-033168100,4,C114,C115,C123,C126,ICT測試未涵蓋到的位置,84-1,PartNumber,Qty,Location,11-033410400,211,C106,C107,C118,C125,C140,C150,C151,C154,C157,C168,C174,C193,C203,C228,C237,C3,C50,C51,C52,C56,C60,C61,C64,C66,C68,C70C74,C77C80,C9,CB100CB103,CB106CB119,CB12,CB120CB126,CB129,CB13,CB130,CB132CB135,CB135A,CB135B,CB14,CB141CB149,CB15,CB150CB159,CB16,CB160CB162,CB164CB169,CB17,CB170CB177,CB18,CB180,CB182,CB183,CB185CB189,CB190,CB2,CB20,CB200,CB201,CB203CB209,CB21,CB24,CB25,CB26,CB26A,CB27CB30,CB32CB38,CB38A,CB38B,CB39,CB40CB49,CB5,CB50CB64,CB66CB70,CB72,11-033410500,2,C80A,C80B,LOCATIONSNOTCOVEREDBYICTTEST,84-2,料號,數量,位置,11-033410400,211,C106,C107,C118,C125,C140,C150,C151,C154,C157,C168,C174,C193,C203,C228,C237,C3,C50,C51,C52,C56,C60,C61,C64,C66,C68,C70C74,C77C80,C9,CB100CB103,CB106CB119,CB12,CB120CB126,CB129,CB13,CB130,CB132CB135,CB135A,CB135B,CB14,CB141CB149,CB15,CB150CB159,CB16,CB160CB162,CB164CB169,CB17,CB170CB177,CB18,CB180,CB182,CB183,CB185CB189,CB190,CB2,CB20,CB200,CB201,CB203CB209,CB21,CB24,CB25,CB26,CB26A,CB27CB30,CB32CB38,CB38A,CB38B,CB39,CB40CB49,CB5,CB50CB64,CB66CB70,CB72,11-033410500,2,C80A,C80B,ICT測試未涵蓋到的測試,85-1,PilotRunRelease,ThisisthefinalconfirmationbeforePilotRunstarts.AmeetingiscalledbytheProgramManagerortheBusinessManagertoascertainthattherearenoopenitemsfromengineering,materialandproductionpointofview.Thisisusuallydonethedaybeforepilotrunstartsorwhenpreparationhasbeencompleted.QArepresentativereleasesthe“go-ahead”andtheBusinessManagerapprovesthepilotruntostart(ThecontentsofthePilotRunReleaseformisfilledandsignedbyrelevantparties).Ifthereisaline-downsituationsubsequently,forsomereason,therootcausesareproperlyrecordedforpost-mortemanalysisandcorrectiveactions.,85-2,試產知會核簽,這是試產開始前進行的最後確認.會議由項目經理或業務經理召集召開，以確信在工程，材料及生產方面已沒有未解決的問題。這通常是在試產開始前一天或當準備工作結束時進行。試產開始要經QA同意並經業務經理核準(試產知會核簽單由相關各方填寫並簽署)。因某種原因，隨後有停線情形，應對根本原因作適當記錄以利於事後(post-mortem)分析及採取校正措施。,86-1,CHECKLIST,RESPONSIBLE,RESULTS/REMARKS,1.Aretherelevantdocuments-BOM,Artwork,Gerberfile,TestandMachineprogramsacceptedhelpdeterminethefinalprocessparametersformassproduction;finalizeallprocessproceduresTarget=75.62%(RefertoattachmentforCAdetails),Done.,Done.,101-2,查驗清單,權責部門,結果/備注,1.針對所有新制程，設備已配備完備？,2.產品是否按照規定的方式,機器/工具以及材料來生產?,3.源自不同制程的“制程管制計劃”的結果與規格是否一致?,4.在生產作業指導書中規定的品質標準是否充分?,5.目檢工具,喂料表,BOM,制程流程,測試及機器程式是否經更新並最終確定下來?,6.是否遵循計划表來對每個制程進行培訓？針對新制程的培訓計劃是否已確定下來?,7.針對整個生產制程的ESD管制措施是否充分?,8.於“制程計劃核簽”查驗表中規定的直通率目標是否已達到?,9.就制程FMEA中提到的各項，有否採取措施?,10.SPC體系是否已最終確定?,設備,制程/生產,制程/QA,QA/生產,業務/制程/測試/設備,培訓/生產,制程工程,制程/生產/QA,制程工程,QA,針對投產的制程關卡查驗表實例,Done(除了FVT因應量產，需做修改),Done,Yes.,Yes.,Done,Done.,Done.附件2,直通率=49.89%;目標=75.62%(參閱CA明細附件),Done.,Done.,102-1,CHECKLIST,RESPONSIBLE,RESULTS/REMARKS,11.Hastheheadcountandallocationofoperatorsbeenfinalized?,12.Whatistheyieldtargetedperprocesstobereachedbeforefinalmassproductionramped?,13.Hasthecycletimeforeachprocessbeenfinalized?,Production,QA/Production,Proc/IE/Bus/PC,ExampleofaProcessGateChecklistforReleaseToProduction(Continued),Done.,TSQC-97%;BSQC-98%;ICT-95%;FVT-97%;FQC-98%;Pre-ShipA