Template+of+EQ.doc

Template of Engineering QueryI . Document items 1. Netlist file2. Cant open file3. Missing file4. What the files are used for?5. Rev. 6. Which spec will be used? 7. One film, but different requirement in another placeII. Cost & special Material 1. laminate material2. laminate core for single side board3. Solder mask ink material4. Other special materialIII. Board Thk & Tol1. No specified Board Thk 2. Unclear meaning on board Thk3. Lay-up order4. Lay-up structureIV. Drill layer & hole1. Hole type2. Mismatched hole chart information3. Special hole with strange conductor pad4. Hole Diameter Tol5. Press fit hole6. Overlapped hole7. Too close between hole to board edge8. Hole quantity9. Hole location Tol10. Position of stamp holeV. Drawing, dimension & Tolerance 1. Outline tolerance2. Mismatched dimensions3. Missing dimensions4. Inner corner size5. Asymmetry Tol6. Data of hole to edge7. Quality & side for Fiducial mark?8. Direction to arrange unit in array DWGVI. Impedance items1. Which kind of line?2. Impedance value3. Coupon line width4. Distance between holes in coupon 5. Test point issueVII. Cu Thk 1. PTH hole2. Buried hole & blind hole 3. Surface copper ThkVIII. Conductor design1. Delete non-functional isolated pads in inner layer2. Annular ring3. Clearance issue4. Isolated line to separate different area in inner layers5. Tenting hole issue6. Line width/spacing Tol7. Strange design8. Exposed copper along board edge9. Plating Gold finger guide line10. Isolated fiducial mark11. Dummy pattern at breakaway area12. Dummy pattern at blank area in board13. Fill in the narrow spacing 14. Similar issue on “Made in USA”15. LOGO position & typeIVIII. Solder mask & Legend film & other (Carbon ink & peel able mask)1. Solder mask Thk2. Plugged hole items3. Solder mask bridge 4. Exposed line/pad5. Solder mask bridge between Gold Finger6. Distance between the S/M opening edge of via hole/pad and S/M opening of the top of Gold Finger7. Extra S/M opening 8. Missing S/M opening for SMT pad/round pad9. Component mark bridge10. C/M width11. Reverse legend12. LOGO increase costIX. Surface final1. No call surface treatment2. Rohs requirement3. Tighter Thk4. Feasibility of processXI. Fabrication for profile1. Rout or Punch2. V-cut3. G/F bevel4. ChamferXII. Bow & TwistXIII. X-out Common Query For Your ReferenceI . Document items 1. Netlist fileQuestion 1: After comparing the customer netlist file with CAD film inputted by our CAD/CAM. Some short/open was found. see figxx.Suggestion: a)Ingore the netlist file and just follow the CAD data to do. b)Please resend the right Gerber file to us.2. Cant open fileQuestion 2: We cant open the file in the package (see figxx).Suggestion: a)Ingore it. b)Please resend it to us with other format.3. Missing fileQuestion 3: Missing files called in the Gerber file (see figxx).Suggestion: a)Ingore them. b)Please send them to us ASAP.4.What the files are used for?Question 4: we dont know what the files called in package used for? (see figxx).Suggestion: a)Ingore them. b) Please advise.5. Rev. Question 5: The Rev of customer P/N is different between Rev A in Gerber file and Rev B in mail information? (see figxx).Suggestion: a)Follow Rev A in Gerber file to do. b)Please advise.6. Which spec will be used?Question 6: Customer dont call fabrication spec for the project.Suggestion: a)Well use IPC-A-600G Class 2 & IPC-6012 Class 2 to do. b) Please advise.7. One film, but different requirement in another placeQuestion 7: Customer requires print solder mask on both sides, but there is Top side solder mask film in the Gerber. .Suggestion: a)Please confirm the one S/M film will be applied to both sides.b) Just apply to Top side.II. Cost & special Material 1. laminate materialQuestion 1: Customer requires to use xxx laminate core, but we have no this kind of material in store, itll take long time to order the special material and increase production cycle. Suggestion: To shorten lead-time, we propose to use xxx laminate core from xxx vendor instead of it. Question 2: Customer requires to use xxx laminate core with high Tg (=170 degree), but we have no this kind of material on hand, itll take long time to order the special material and increase high cost. Suggestion: To reduce cost and shorten lead-time, we propose to use xxx laminate core with normal Tg (nominal 140 degree)from xxx vendor instead of it.2. laminate core for single side boardQuestion 3: Customer call FR-4 material for the single-side board.Suggestion: To reduce cost, we propose to use CEM-1/CEM-3 instead of it, please confirm.3. Solder mask ink material Question 4: XXX solder mask ink is required in customer DWG, but we have no the material in stock, and itll take long time to order it and increase high cost? Suggestion: a) To reduce cost and shorten lead-time, we propose to use Green xxx ink from xxx vendor instead of it. b) Please advise. 4. Other special material Question 5:.For other special material, refer to above EQ to inquire customer to use common cheap material instead of it.III. Board Thk & Tol 1. No specified Board ThkQuestion 1: Not specified board Thk & Tol in customer DWG & Spec.Suggestion: a)Well build the finished board Thk & tol as 1.6+/-0.16mm. b) Please advise.Question 2: The tolerance of board thk +/-xxx mil is called in customer DWG/Spec, but its very tight. If meet it, we have to order special material and increase high cost.Suggestion: a)To reduce cost, please kindly relax it to +/-10% of board Thk. b) If customer insist on it, please MKT reconsider the cost. 2. Unclear meaning on board ThkQuestion 3: We cant know whether the board Thickness xxx mil called by customer is finished or excluding soldermask?.Suggestion: a) Board Thk Xxx mil means total finished board thk. b) It just means Thk before plating (or suggest excluding solder mask).3. Lay-up orderQuestion 4: Customer doesnt define the lay-up order. Suggestion: a)Well build board per the order of Art1/Art2/Art3/Art4. b) Please advise. 4. Lay-up structureQuestion 5: Based on customer lay-up structure, finished board Thk will be aaa mil, but bbb mil is required in DWG/spec, we cant meet them at the same time. Suggestion: a) Follow customer lay-up to do, but finished board Thk will be aaa mil. b) Build finished board Thk bbb mil, but allow us to adjust lay-up as shown in attached figxx.IV. Drill layer & hole1. Hole type Question 1: Customer doesnt define the hole type (PTH or NPTH). Suggestion: a)Well build holes type as our suggested in Figxx. b) Please advise.2. Mismatched hole chart informationQuestion 2: Mismatched hole size between Diaxxx mil in customer hole chart and Diaxxx mil in customer DWG (see figxx & xx). Suggestion: a) Follow customer hole chart to do. b) Follow data marked in customer DWG to do.3. Special hole with strange conductor padQuestion 3: In customer hole chart, the Dia xxx mil hole is PTH hole, but there is no conductor pad at the corresponding position (see figxx) Suggestion: a)Just follow hole chart & CAD to do it PTH without annular ring. b) Do it as NPTH hole. 4. Hole Diameter TolQuestion 4: Not specified the tolerance of hole diameter/slot in customer spec and DWG. Suggestion: a) Well build them as below: For Via holes(less than Dia 18mil): +3/-8mil; For PTH (except Via): +/-3mil; For NPTH: +/-2mil.For slot width +/-3 mil, slot length +/-4mil.b) Please advise.5. Press fit holeQuestion 5: Customer requires Press fit hole finished Diaxxx +/-xxx mil and drill bit size Diaxxx+/-xxx mil, but due to the uneven conductor design, and generally we need to compensate about xxx mil for HAL surface final (see figxx), so we cant meet them at the same time. Suggestion: a) Just control finished hole diameter & tol, and ignore the requirement of drill bit size & Tol. b) If customer insist on it, we have to order special drill bit, please reconsider cost (Only under the condition that customer strongly require it and its feasible, usually we dont raise the suggestion).6. Overlapped holeQuestion 6: Dia xxx mil hole is overlapped with another small Dia xxx mil hole. Suggestion: a)Well delete the small hole. b) Please advise. 7. Too close between hole to board edgeQuestion 7: The distance from hole edge to board edge is very close (only xxx mil). Suggestion: a) Follow CAD to do, but after building profile, the hole will broken. b) Well move the hole toward unit about xxx mil to avoid broken.(or propose to change hole size; if the hole is PTH, need to consider annular ring)8. Hole quantityQuestion 8: Mismatched hole quality between xxx in customer hole chart and xxx in CAD drill layer (see fig xx). Suggestion: Follow CAD drill layer to do. 9. Hole location TolQuestion 9: The position tolerance +/-xxx mil of hole position is required in customer DWG, but due to regristration deviation during drilling & D/F process, its very tight. (see fig xx). Suggestion: To smooth production, please kindly relax it to +/-xxx mil. 10. Position of stamp holeQuestion 10: According to customer design stamp holes, its very close to conductor pattern, itll cause exposed GND copper/line (see fig xx). Suggestion: a) Well shave GND copper about xxx mil/move line about xxx mil to avoid exposed GND copper/line. b) Follow CAD to do, but exposed GND copper/line is acceptable (Note: itll increase cost - to use second drill; generally, dont use it)V. Drawing, dimension & Tolerance 1. Outline tolerance Question 1: Not specified outline tolerance in customer spec/DWG. Suggestion: Do it +/-5 mil.2. Mismatched dimensions Question 2: Mismatched dimensions between data xxx mm marked in DWG and data XXX mm measured from CAD drill layer/ CAD outline frame. (see figxx & xx). Suggestion: a) Follow data marked in DWG to do. b) Follow data measured from CAD drill layer/CAD outline frame. 3. Missing dimensionsQuestion 3: Missing some dimensions in customer DWG (see figxx). Suggestion: Follow CAD 1:1 outline DWG to do.4. Inner corner sizeQuestion 4: Not specified inner corner. (see figxx) Suggestion: a) Max R0.6mm for the inner corner in those small slots is acceptable, and R1.2mm for other inner corner. b)Well rout the slot to be into breakaway area half-rout bit to ensure sharp corner in unit outline. (see figxx). 5. Asymmetry Tol Question 5: Customer call the dimension with asymmetry tolerance in the unit DWG, and marked unspecified tolerance +/-xxx mil for thosedimensions in array DWG. but it cant be met at the same tiem.Suggestion: Well ensure the dimension with asymmetry tolerance in the unit DWG, but regard the dimensions (see figxx) as reference only.6. Data of hole to edgeQuestion 6: No call the data from hole center to board edge. (see figxx) Suggestion: Well do it xxx mil measured from CAD drill layer and outline frame.7. Quality & side for Fiducial mark?Question 7: We dont know which side the fiducial marks should be add? (see figxx) Suggestion: a) Add them on both sides. b) Just on Top side.8. Direction to arrange unit in array DWGQuestion 8: The related direction of unit to array DWG doesnt defined. Suggestion: Well build them as the same direction as shown in figxx.VI. Impedance items1. Which kind of line?Question 1: Customer dont specify which kind of line is impedance line. Suggestion: Control 5 mil lines on layer #.Question2: Customer requires to control impedance value xxx Ohm for xxx mil line on layer, but there is no such kind of line in CAD gerber. Suggestion: a) Well control impedance xxx Ohm for xxx mil line. b) Ignore the requirement of impedance, and follow CAD gerber to do, and ensure lay-up structure & line width/spacing process allowance tolerance specified by customer. 2. Impedance valueQuestion 3: Based on the Lay-up structure specified by customer, after calculating the impedance value with the polar software, the impedance value will be xxx Ohms, but xxx Ohms is required in customer DWG/spec. Suggestion: a) Follow customer lay-up, but control impedance value as xxx Ohms. b) To meet impedance value xxx Ohms called by customer, but please allow us to adjust lay-up as shown in figxx. c)To meet the requirement of xxx Ohms, we have to adjust finished conductor width from xxx mil to xxx mil. Question 4: Customer call xxx ohm (aaa mil line), XXXohm (bbb mil line) and AAA ohm(ccc mil line) on layerA, after base on the calculating value from polar software, we cant meet them at the same time.Suggestion : Just control xxx, for other line, ignore impedance requirement, but ensure the requirement of lay-up & line width/spacing defined by customer.3. Coupon line widthQuestion 5: Customer require to control impedance xxx Ohm for xxx mil line, but the line width is xxx mil in the coupon designed by customer.Suggestion: a) Change the line width in the coupon from xxx mil to xxx mil. b) Follow CAD to do, and well measure impedance value based on coupon designed by ourselves at the production board edge. 4. Distance between holes in couponQuestion 6: Customer design the distance between two holes in impedance coupon is xxx mil, but our normal distance to test in our plant is xxx mil. Suggestion: a) We would like to change the distance as xxx mil used in our plant. b) Follow CAD design, but well just measure the impedance coupon designed by ourselves at the production board edge.5 Test point issueQuestion 7: Customer specified test point for xxx Ohm, but we found there is no impedance line to connect with it.Suggestion: Well just control xxx Ohm for the xxx mil line and measure impedance value from the coupon designed by ourself at production board edge. VII. Cu Thk 1. PTH holeQuestion 1: Min xxx mil copper thickness in hole wall is called in DWG. But its tight for our plant capability.Suggestion: To smooth production, please confirm min xxx mil is acceptable.2. Buried hole & blind hole Question 2: Customer doesnt call the copper thickness for blind or buried hole:Suggestion: We propose to do 0.7mil(min) & 0.8mil(avg) when theblind hole size more than 0.15mm, and 0.4mil(min) & 0.5mil(avg) when the blind hole size equal and lessthan 0.15mm in the blind microvias; 0.5mil(min)&0.6mil(avg) in the buried holes according to IPC-6012 Class 2 spec.3. Surface copper ThkQuestion 3: Customer requires copper Thk xxx mil on surface, its very tight, due to CAD design conductor is uneven, if meet such thicker copper on surface, then the copper Thk in hole wall will be about xxx mil, then cant meet finished hole diameter at the same time.Suggestion: Please kindly accept min xxx mil on surface.VIII. Conductor design1. Delete non-functional isolated pads in inner layerQuestion 1: There are some Non-functional isolated PADs in inner layerXX. It is easy to lead to short in inner layers during production process.Suggestion: In order to smooth production, we propose to delete these Non-fuctional isolated PADs, please confirm.2. Annular ringQuestion 2: For all Dia13mil holes in all layers, CAD design circuit PAD is Dia25mil, when we use small drill-bit dia0.35mm (finished hole Dia Tol will be control as Dia13+0/-13mil), the annular ring is only 5.6mil, and there is no enough space in CAD design to enlarge circuit PAD. And customer spec call finished annular ring 2.0 mil at the same time. Due to the position deviation from drilling process and registration accuracy during dry-film process, if meet such requirement, production film annular ring need 7mil on outer layer.Suggestion: a) well add teardrop at the line to PAD conjunction area and ensure min 2.0 mil annular ring.But for other area, please accept max 90 degree breakout. b) Please allow change hole Diameter from +/-xxx mil to +xxx/-BBBmil, then we can use smaller drill bit (Diaxxxmil) to ensure mininum xxx mil annular ring. (Apply to the case: choose big drill-bit per customer requirement, but cant meet annular ring. If change tolerance, then can use small drill-bit to meet annular ring). 3. Clearance issueQuestion 3: CAD design copper clearance is only xxx mil, its easy to cause short in inner layer, well shave GND copper about xxx mil to get XXX mil copper clearance to avoid short in inner layer.Suggestion: Please confirm.4. Isolated line to separate different area in inner layersQuestion 4: CAD design different GND copper area, but one PTH hole drilled on the separated line, Itll cause the the two isolated GND area short.Suggestion: Well shave GND copper about xxx mil to get 10 mil copper clearance in inner layer. 5. Tenting hole issueQuestion 5: The distance from NPTH hole edge to GND/line edge is only xxx mil on outer layer, To facilitate to tent hole during D/F process, well shave GND copper/move line about xxx mil. (tenting capability is 7 mil in plant) Suggestion: Pleas