6SMT生产常用英文.ppt

SMT生产常用英文,一、部门组织类二、系统文件类三、生产工站类四、零件认识类五、质量管理类六、不良类型类,目录,DC(DocumentCenter)资料中心DCC(documentcontrolcenter)文件管理中心DesignCenter设计中心PCC(Productcontrolcenter)生产管制中心PMC(Production&MaterialControl)生产和物料控制PPC(ProductionPlanControl)生产计划控制,一、部门组织类,SCM(supplychainmanagement)供应链MCMaterialControl物料控制QCC(QualityControlCircle)品质圈QIT(QualityImprovementTeam)质量改善小组MFG(manufacturing)制造单位ManufacturingDept=MD制造部,PD(ProductDepartment)生产部LogisticalDept物流部PurchasingDept采购部CostManagementDept经管MaterialControlDept物管PersonnelDept人事部EngineeringStandardDept工标部QualityAssuranceDept品保部R&D(Research&Design)设计开发部,DeliveryControlCenter交管PlanningDept企划部Administration/GeneralAffairsDept总务部PM(projectmanagement)专案管控LAB(Laboratory)实验室QE(QualityEngineering)质量工程(部)QA(QualityAssurance)质量保证(处),QC(QualityControl)质量管理(课)IE(IndustrialEngineering)工业工程ME(manufactureengineering)制造工程PE(PRODUCTSENGINEERING)产品工程TE(TESTENGINEERING)测试工程EE(ELECTRONICSENGINEERING)电子工程,ISO(InternationalStandardOrganization)国际标准化组织ES(EngineeringStandard)工程标准IWS(InternationalWorkmanStandard)工艺标准GS(GeneralSpecification)一般规格SIP(StandardInspectionProcedure)标准检验规范SOP(StandardOperationProcedure)制造作业规范,二、系统文件类,IS(InspectionSpecification)成品检验规范POP(packingoperationprocedure)包装操作规范BOM(BillOfMaterial)物料清单PS(PackageSpecification)包装规范SPEC(Specification)规格DWG(Drawing)图面SWR(SpecialWorkRequest)特殊工作需求APP(Approve)核准,认可,承认CHK(Check)确认,ECO(EngineeringChangeOrder)工程改动要求PCN(ProcessChangeNotice)工序改动通知PMP(ProductManagementPlan)生产管制计划CAR(CorrectionActionReport)改善报告TPM(TotalProductionMaintenance)全面生产保养MRP(MaterialRequirementPlanning)物料需计划OS(OperationSystem)操作系统SSQA(standardizedsupplierqualityaudit)合格供货商质量评估,AVL(acceptablevendorlist)允许的供货商清单PDCS(processdefectcontactsheet)制程异常联络单E(D)CN(Engineering(Design)changenotice)工程(设计)变更通知KPI(Keyperformanceindex)主要绩效指标,Computer计算机ConsumerElectronics消费性电子产品Communication通讯类电子产品OEM(OriginalEquipmentManufacture)原设备制造PCPersonalComputer个人计算机5W1H(When,Where,Who,What,Why,Howto),三、生产工站类,6MMan,Machine,Material,Method,Measurement,Message4MTH(Man,Material,Money,Method,Time,How)人力,物力,财务,技术,时间(资源)CP(capabilityindex)能力指数CPK(capabilityprocessindex)制程能力参数FMEA(failuremodeleffectivenessanalysis)失效模式分析,SMT(surfacemounttechnology)表面贴装技朮PTH(PlateThroughhole)镀层穿孔(手插件)PCBA(PrintingcircuitboardAssembly)组装印刷电路板PO(PurchasingOrder)采购订单MO(ManufactureOrder)生产单,PC#(productcode)产品编码MM#(materialmasternumber)主件料号AA#(alteredassemblynumber)成品料号PBA#(printedboardassemblynumber)半成品料号PPID(ProductpartIdentification)产品料号识别码L/N(LotNumber)批号P/N(PartNumber)料号N/A(NotApplicable)不适用,S/N(serialnumber)序列号CHK(check)检查SEPC(specification)规格ID:(Identify)鉴别号码Barcode条形码barcodescanner条形码扫描仪WDR(WeeklyDeliveryRequirement)周出货要求PPM(PercentPerMillion)百万分之一,PCs(Pieces)个(根,块等)PRS(Pairs)双(对等)CTN(Carton)卡通箱PAL(Pallet/skid)栈板D/C(DateCode)生产日期码ID/C(IdentificationCode)(供货商)识别码QTY(Quantity)数量I/O(input/output)输入/输出Flux助焊剂Cleaningsolvent清洁剂Cleaningpaper擦拭纸Handsolder烙铁,SolderPaste锡膏Feeder供料器Stencil钢网Nozzle吸嘴PAD焊垫Squeegee刮刀PinterMachine锡膏印刷机器BufferLoader收板机Material物料MountingMachine贴片机器REFLOWMachine回流焊炉Profile回焊温度曲线图,AOI(automaticopticalinspection)自动光学检测W/S(wavesolder)波峰焊ICT(incircuittest)线路测试IFT(integratefunctiontest)功能测试FCT(FunctioncheckTest)功能测试SMD(SurfaceMountingDevice)贴装设备BGAReworkStationBGA维修站,MSD(moisturesensitivedevice)湿度敏感组件SMC(SurfaceMountComponent)表面贴装组件SMD(SurfaceMountDevice)表面帖装元器件Leads组件脚Terminations端头脚件PassiveComponent无源器件ActiveComponent有源器件,四、零件认识类,BIOS:(BasicInputOutputSystem)基本输入输出系统CMOS:(ComplementaryMetal-Oxide-SemiconductorTransistor)互补型金属氧化物半导体Core铁芯CPU:(CentralProcessingUnit)中央处理器DMA:(DirectMemoryAccess)直接内存存取IC:(IntegratedCircuit)集成电路,SPS(Switchingpowersupply)电源箱AGP(AcceleratedGraphicPort)加速图形端口FDD(FloppyDiskDrive)软式磁盘机HDD(HardDiskDrive)硬盘驱动器NorthBridge北桥SouthBridge南桥,IDE:(IntegratedDriveElectronics)集成电路设备,智能磁盘设备LAN:(LocalAreaNetwork)网络,局域网,本地网MOSFET:(Metal-OxideSemiconductorFieldEffectTransistor)金属氧化物半导体场效应晶体管PCI:(PeripheralComponentExtendedInterface)周边组件扩展接口SCSI:(SmallComputerSystemInterface)小计算机系统的界面,USB:(UniversalSerialBus)通用串行总线SDRAM:(SynchronousDynamicRandomAccessMemory)同步动态随机存取存储器KEYBOARD键盘CABLELINE排线HEADER头/排针JACK插头CABLE电缆/排线TUNER调频器,Pin=I/O(Input/Output)输入/输出,PCBPrintedCircuitBoard印刷电路板,Networkresistor排阻,Resistor电阻,Capacitor电容,Networkcapacitor排容,TANTALUMCAPACITOR钽质电容器,INDUCTOR电感,Fuse保险丝,Light-emittingdiode发光二极管,晶体管transistor,Crystal(石英晶体),Diode(二极管),Switch(开关),MELF(金属电极表面连接组件),QuadflatpackageQFP四方扁平封装,SmalloutlinePackageSop小轮廓封装,PLCCPlasticLeadedchipcarrier塑料芯片载体,BGABallgridarray球形陈列封装,QC(qualitycontrol)品质管理人员FQC(finalqualitycontrol)终点质量管理人员IPQC(inprocessqualitycontrol)制程中的质量管理人员OQC(outputqualitycontrol)最终出货质量管理人员IQC(incomingqualitycontrol)进料质量管理人员TQC(totalqualitycontrol)全面质量管理PQC(passagequalitycontrol)段检人员,五、质量管理类,QA(qualityassurance)质量保证人员OQA(outputqualityassurance)出货质量保证人员QE(qualityengineering)质量工程人员QPA(QualityProcessAudit)制程品质稽核OQM(outputqualitymeasure)出货质量检验SQA(StrategyQualityAssurance)策略质量保证,DQA(DesignQualityAssurance)设计质量保证MQA(ManufactureQualityAssurance)制造质量保证SSQA(SalesandserviceQualityAssurance)销售及服务质量保证SPC(StatisticalProcessControl)统计制程管制SQC(StatisticalQualityControl)统计质量管理GRR(GaugeReproductiveness&Repeatability)量具之再制性及重测性判断量可靠与否,8SClassification整理(sorting,organization)-seiriRegulation整顿(arrangement,tidiness)-seitonCleanliness清扫(sweeping,purity)-seisoConservation清洁(cleaning,cleanliness)-seiktsuCulture教养(discipline)-shitsukeSave节约Safety安全Security保密,PDCA(PlanDoCheckAction)计划执行检查总结FAI(firstarticleinspection)新品首件检查FAA(firstarticleassurance)首件确认AQL(AcceptableQualityLevel)允收质量水平S/S(Samplesize)抽样检验样本大小FPIR(FirstPieceInspectionReport)首件检查报告,ACC(Accept)允收REJ(Reject)拒收CR(Critical)极严重的MAJ(Major)主要的MIN(Mi