封装考核评估资料汇编(doc 27页)

1、 Purpose目的This document provides templates for recording package qualification data for RFMD product and instructions for complying with Materials Declaration.提供记录RFMD产品考核认证所需信息资料的模板,及遵从物质申明的说明2、 Scope范围Apply to RFMD package qualification适用于RFMD考核认证产品3、 Instruction说明3.1 Materials Declaration: The Subcontractor Assembly house is required to submit Materials Declaration forms listing the required banned, banned with acceptable threshold level, reportable or other materials required by RFMD QAL-21-1028 for assemblies manufactured for RFMD. These are required for current and new assemblies and must be updated whenever material changes occur or whenever a new substrate process development or assembly qualification begins. The supplier will be required to provide proof of compliancy with a chemical analysis. See QAL-21-1028 for details on requirements, reporting structure, and reporting format.物质申明: 外包封装厂需要提交物质声明书，列明禁用材料，禁用但可接受门限的材料、需告知的或其他由RFMD QAL-21-1028文件规定的用于RFMD封装制造产品的材料. 这些规定适用于现有及未来新的封装产品,当材料变更,新基板工艺流程的开发或开始封装考核认证时都要提交该声明书. 供应商还需要提供化学分析作为依据. 参考QAL-21-1028文件中的详细要求,报告的结构和格式。3.2 Add lines, insert tables, embed objects at each applicable process step to capture pertinent process data.各工序可根据需收集的相关信息资料增加表格的行数, 插入新的表格和对象3.3 Compress pictures once all applicable process information has been inserted. Go to view toolbars, select pictures. Go to pictures toolbar and compress pictures, OK.完成相应的所有工序的信息资料后压缩图片. 在视图工具栏中选择图片后压缩或在图片工具栏栏中压缩图片4、 Reference参考CSR-CM012（PKG-21-1013） Subcontractor Assembly Specification for ModulesCSR-CM029（QAL-21-1028） Banned Substances List and RFMD Green Definition5、 Qualification Data考核评估资料拟制：审核：批准：Qualification DataPart Number Qual Lot NumberTrace CodePackage TypePackage Size ThicknessWafer Size Thickness (list all die)Lead CountPO NumberMSL Target LevelAssembly LocationBonding Diagram Part NumberBOM Part NumberBranding Diagram Part NumberPrepared ByExecutive SummaryYield SummaryLot #1 Lot #2 Lot #3 Total YieldSMT YieldLot #1 Lot #2 Lot #3 Total YieldAssy YieldLot #1 Lot #2 Lot #3 Total YieldFinal YieldData Summary All Lots combined ProcessTestCriteriaSSMaxMinAvgStdCpkSMTPaste ThicknessSMTComponent Shear (gram force per each SMD size)SMTFlux ThicknessDie AttachPlacement XDie AttachPlacement YDie AttachShear (each die)Die AttachRotation Flip Chip AttachShear (each die size)Flip Chip AttachPlacementFlip Chip AttachStand offWire BondPulls Die to SubWire BondPulls Die to DieWire BondPulls Sub to SubWire BondPulls RSSBWire BondLoop HeightWire BondSpanWire BondPlacement XWire BondPlacement YWire BondBall Shear 71um BPOWire BondBall Shear 60 52 71um BPOWire BondSSB Shear 60 52 71um Pad Opening, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Ball Shear, Measure 10 balls 60um 52um 71um Pad Opening, (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Stitch Stud Bump (SSB) Shear, Measure 10 balls 60um 52um 52um 65um =80um Pad Opening, Minimum 10 units (repeat for lot 2 and 3) 1 2 3 4 5 6 7 8 9 10 Min Max Avg D1D2D3D4D5Plasma or UV (Use if Applicable)Make and Model numberPowerTimeGas MixtureLid Attach B-stage or Solder (if applicable)Make and Model numberCure TimeCure Temperature & Tolerance Transfer SpeedStage 1 Start Position mm/s Stage 1 Start Position mm/s Mold Cure TimeFlange Packages (if applicable)Post Flange Flatness Measurement Data per ten flanges Measure five locations per flange, center and four corners.Flange Flatness, (repeat for lot 2 and 3) 1 2 3 4 5 Min Max Avg F1F2F3F4F5F6F7F8F9F10MoldMake and Model of machine:Mold Compound Transfer Program:Position of plunger at start (mm Pellet Height, PS (PS = Position Start):mm: Speed of plunger (mm/sec from start to next position, PS to P1):mm/sec:Position of plunger for next position (mm P1):mm: Speed of plunger (mm/sec from P1 to P2):mm/sec:Position of plunger for next position (mm P2):mm: Speed of plunger (mm/sec from P2 to P3):mm/sec:Position of plunger for next position (mm P3):mm: Speed of plunger (mm/sec from P3 to P4):mm/sec:Position of plunger at final end position (PE = Position End):mm:*Cull Height setting & actual mm (actual is measured with micrometer):mm:mm:Positive cull value (distance above bottom mold die):mm:Transfer Pressure setting & actual PSI:PSI Setting: PSI Actual:Transfer Time (time from PS to PE):Sec:*Mold Temperature setting & range (Max/Min):C Setting:C Max/Min:*Pellet Preheat setting and actual:C Setting:C Actual:*Laminate or Leadframe in mold preheat time, setting and actualSec Setti