wire bonding 详细学习资料.ppt

WIREBONDPROCESSINTRODUCTION CONTENTS ASSEMBLYFLOWOFPLASTICICWireBond原理M CIntroductionWireBondProcessMaterialSPECCalculatorDEFECT 封裝簡介 晶片Die 金線GoldWire 導線架Leadfram WaferGrinding DieBonding WaferSaw toaster WireBonding DieSurfaceCoating Molding LaserMark SolderBallPlacement Singulation Packing 封裝流程 DejunkTRIM SolderPlating SolderPlating DejunkTRIM TRIM FORMING BGA SURFACEMOUNTPKG THROUGHHOLEPKG WireBond原理 pad lead Goldwire BallBond 1stBond WedgeBond 2ndBond Al B PRINCIPLE 銲接條件 HARDWELDINGPressure Force Amplify FrequecyWeldingTime BondTime WeldingTempature Heater THERMALBONINGThermalCompressureUltrasonicEnergy Power BondHeadASSY LowimpactforceRealtimeBondingForcemonitoringHighresolutionz axispositionwith2 5micronperstepresolutionFastcontactdetectionSuppressedForcevibrationFastForceresponseFastresponsevoicecoilwireclamp XYTable Linear3phaseACServomotorHighpowerACCurrentAmplifierDSPbasedcontrolplatformHighX Ypositioningaccuracyof 1mmResolutionof0 2mm W HASSY changeover Fullyprogrammableindexer tracks Motorizedwindowclampwithsoftclosefeature OutputindexerwithleadframejamprotectionfeatureToollessconversionwindowclampsandtopplateenablesfastdevice Eagle BondingSystemBondingMethod Thermosonic TS BQMMode ConstantCurrent Voltage PowerandNormal Programmable LoopType Normal Low Square JXYResolution 0 2umZResolution capillarytravellingmotion 2 5umFinePitchCapability 35mmpitch 0 6milwireNo ofBondingWires upto1000ProgramStorage 1000programsonHardDiskMultimodeTransducerSystem Programmableprofile controlandvibrationmodes MACHINESPECIFICATIONS I Eagle VisionSystemPatternRecognitionTime 70ms pointPatternRecognitionAccuracy 0 37umLeadLocatorDetection 12ms lead 3leads frame LeadLocatorAccuracy 2 4umPostBondInspection FirstBond SecondBondWireTracingMax DieLevelDifferent 400 500umFacilitiesVoltage110VAC optional100 120 200 210 220 230 240VAC MACHINESPECIFICATIONS II Eagle MaterialHandlingSystemIndexingSpeed 200 250ms 0 5 pitchIndexerResolution 1umLeadframePositionAccuracy 2milApplicableLeadframe W 17 75mm bondingareainY 65mm 17 90mm bondingareainY 54mmL 280mm Maximum T 0 075 0 8mmApplicableMagazine W 100mm Maximum L 140 300mmH 180mm Maximum MagazinePitch 2 4 10mm 0 09 0 39 DeviceChangeover 4minutesPackageChangeover 5minutesNumberofBufferMagazine 3 max 435mm MACHINESPECIFICATIONS III BondingProcess TheWireBondTemp PREHEATBONDSITECUL F200 10200 10ALL F210 10230 10BGA150 10160 10TFBGA150 10160 10LBGA150 10160 10NOTINCLUDEDEDICATELINE pad lead Freeairballiscapturedinthechamfer pad lead Freeairballiscapturedinthechamfer SEARCHHEIGHT pad lead Freeairballiscapturedinthechamfer SEARCHSPEED1 SEARCHTOL1 Freeairballiscapturedinthechamfer pad lead SEARCHSPEED1 SEARCHTOL1 Freeairballiscapturedinthechamfer pad lead SEARCHTOL1 SEARCHSPEED1 Freeairballiscapturedinthechamfer pad lead SEARCHTOL1 SEARCHSPEED1 Freeairballiscapturedinthechamfer pad lead SEARCHTOL1 SEARCHSPEED1 Formationofafirstbond pad lead SEARCHSPEED1 SEARCHTOL1 Formationofafirstbond pad lead SEARCHSPEED1 SEARCHTOL1 IMPACTFORCE FormationofafirstbondContact pad lead heat PRESSURE UltraSonicVibration FormationofafirstbondBase pad lead UltraSonicVibration heat PRESSURE Capillaryrisestoloopheightposition pad lead Capillaryrisestoloopheightposition pad lead Capillaryrisestoloopheightposition pad lead Capillaryrisestoloopheightposition pad lead Capillaryrisestoloopheightposition pad lead Capillaryrisestoloopheightposition pad lead RH Formationofaloop pad lead RD ReverseDistance Formationofaloop pad lead pad lead pad lead CalculatedWireLength WIRECLAMP CLOSE pad lead CalculatedWireLength pad lead SEARCHDELAY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead TRAJECTORY pad lead 2ndSearchHeight SearchSpeed2 SearchTol2 pad lead SearchSpeed2 SearchTol2 pad lead SearchSpeed2 SearchTol2 Formationofasecondbond pad lead heat FormationofasecondbondContact pad lead heat heat pad lead heat heat FormationofasecondbondBase pad lead pad lead pad lead pad lead Taillength pad lead pad lead pad lead Disconnectionofthetail pad lead Disconnectionofthetail pad lead Formationofanewfreeairball Material LeadframCapillaryGoldWire Leadfram I Leadfram II CAPILLARY I CapillaryManufacturer SPT GAISER PECO TOTO CapillaryData Tip Hole CD FA OR IC CAPILLARY II CAPILLARY III HowToDesignYourCapillary TIP PadPitchPadpitchx1 3 TIPHole WireDiameterWirediameter 0 3 0 5 HCD Padsize open 1stBallCD 0 4 0 6 1stBondBallsizeFA OR Padpitch um FA 1000 4 90 1004 8 11 9011 15ICtype looptype GoldWire GoldWireManufacturer Nippon SUMTOMO TANAKA GoldWireData WireDiameter Type SPEC PadOpen BondPadPitchBallSizeBallThicknessLoopheightWirePullBallshortCraterTest BPO BPP 單位 umorMilBPO 是指Pad內層X方向及Y方向的size 一般是取最小值為我們的dataBPO 是指Pad如左邊內層至右邊Pad左邊外層邊緣其它依此類推 或著一個Die上出現不同Pad大小那就是以兩個Pad中心距離為BPP 但是一般我們要取一個Die上最小的BPP BondPadPitch BondPadOpen BondPadOpen BallSize BallThickness BallSize BallThickness 單位 um Mil量測倍率 50XBallThickness計算公式60umBPP 1 2WD 50 60umBPP 1 2WD 40 50 BallSize LoopHeigh 單位 um Mil量測倍率 20X LoopHeight 線長 WirePull 1LiftedBond Rejected 2Breakatneck Referwire pullspec 3Breakatwire Referwire pullspec 4Breakatstitch Referstitch pullspec 5Liftedweld Rejected BallShort 單位 gramorg mil BallShear計算公式Intermetallic IMC 有75 的共晶 SHEARSTRENGTH標準為 6 0g mil SHEARSTRENGTH BallShear Area g mil BallShear x BallSize y Area y 2 x y 2 zg mil C Ballbond Testspecimen Specimenclamp Shearingram Wire Bondshoulder Interfacialcontactballbondweldarea Bondingpad h A Unsheared C L C Ballbond C L Testspecimen Specimenclamp Bondingpad Fullballattachedtowire exceptforregionsofintermetallicvoiding Ballseparatedatbondingpad Ballinterface residualintermetallic andsometimesportionofunalloyedballandmetal onpadinbondinteractionarea D Ballbond bondingpadinterfaceseparation typicalAutoAl C Testspecimen Specimenclamp Shearingram Wire Minorfragmentofballattachedtowire Bondingpad C L Ballshearedtoohigh offline etc onlyaportionofshoulderandballtopremoved Interfacialcontactballbondweldarea B Wire balltopand orside shear C Ballbond C L Testspecimen Specimenclamp Bondingpad Majorportionofballattachedtowire Interfacialcontact ballbondweldareaintact C Belowcenterlineshear ballshearedthrough typicallyAutoAu C Ballbond C L Testspecimen Specimenclamp Bondingpad Padmetallizationseparatesfromunderlyingsurface Residualpadonballball padinterfaceremainsintact E Bondpadlifts Testspecimen Specimenclamp C Ballbond C L Bondingpad Bondingpadlifts takingportionofunderlyingsubstratematerialwithit F Cratering Residualpadandsubstrateattachedtoball ball padinterfaceremainsintact ShearFailureModes CraterTest Calculate I UPTime TotalActualProductionTimes TotalRepairTime TotalActualProductionTime DOWNTIMERATE TotalRepairTime TotalActualProductionTimes TotalOperatorActualRepairTime TotalOperatorRepairFrequencyStoppages TotalActualProductionTimes TotalOperatorRepairTime TotalOperatorRepairFrequencyStoppages TotalTechnicalActualRepairTimes TotalTechnicalRepairFrequencyStoppages MTTS MEANTIMETOSTOP MTBS MEANTIMEBETWEENSTOP MTTA MEANTIMETOASSISTANCE Calculate II MTBA MeanTimeBetweenAssistance TotalActualProductionTimes TotalTechnicanRepairTimes TotalTechnicalRepairFrequencyStoppages MTBF MeanTimeBetweenFailure TotalActualProductionTimes TotalTechnicianRepairTime TotalChangePartsRepairFrequencySt