工厂英文经典知识缩写.doc

英文经典知识缩写AF Acceleration factor ALT Accelerated life testANOVA Analysis of VarianceAOQL Average Outgoing Quality Level APO Auto Power OffAPQP Advanced Product Quality Planning and Control PlanARE Area OptionsASIC Application Specific Integrated CircuitASSP Application Specific Standard PartATE Automatic test equipment ATO Assembly To OrderAVL RFQ IMPUT CHECKLIST里面用到BAC BackupBCI Bulk current injection BD Business DeveloperBFR Batch Failure Ratebo BochumBOM Bill of MaterialBU Business Unitc acceptance level (= number of failed components accepted)CBD Cost Break DownCDM Contract Design ManufacturerCDM Charge Device Model discharge typeCDM Original Design done by Partner specifically to support Nokia CDN Coupling and Decoupling Network. CE Concurrent EngineeringCE Concurrent Engineering (used for product development) CE. E0.E5 Concurrent Engineering (CE) Product Program Milestones CEM Contract Electronic ManufacturerCER. FILTERS,MONOBL. DUPLEXERS Powder mixing, Block pressing, FiringCI Capacity ImplementationCIM Custom In MouldCLUSTER Group of companies, head by one Cluster leader CM Cost ManagementCMO Customer & Market Operationsco CopenhagenCOC Certificate of complianceCOO Country of Origin Cp, Cpk Process Capability indicesCpk Capability IndexCPL Cost Part listCQE Component Quality EngineerCQP Component Quality PlanningCQS Component Quality SpecialistCR Change Request CRR Component review reportCRYSTALS Crystal wafer manufacturing CSA Current State AnalysisCSM C-TPAT Customs-Trade Partners Against Terrorism CTS Cost Target SettingD Draft, first version of the documentda DallasDC Direct DC Direct Current DCN Design change noticeDES Deselect allDFA Design For AssemblyDFBA Design for Board Assembly DFDS Design for Demand Supply DfE Design for EnvironmentDFFA Design for Final AssemblyDFM Design For Manufacturing (includes DFPT, DFBA, DFFA)DFMEA Design Failure Mode and Effects AnalysisDFPT Design for Production Test DG DI-EL. DUPLEXERS Resonator preparing DIR Design Improvement ReportsDocMan Type of Lotus Notes database (for documents) DOE Design Of ExperimentDOE Design Of ExperimentDPM Defects Per Million DSB Demand Supply BalanceDSN Demand Supplier NetworkDUT Device Under Test DV Demand VolumeDVR E0.E5 Concurrent Engineering (CE) MilestonesE0.E5 Concurrent engineering (CE) milestones ECN Engineering Change NoticeEFR Early Failure Rate ELMECH Electro MechanicalEMC Electro Magnetic CompatibilityEMI Electro Magnetic Interference EMS Environmental Management Sys-tem EN European NormEoL End of Life EPA ESD protected areaERP es EspooESD Electrostatic dischargeESDS Electrostatic discharge sensitive deviceESI Early Supplier InvolvementETA Estimate to be arriveEUT Equipment Under TestEV Enclosed volumeEVM Enhancements Version ManagementF Final, document to be archivedFA Failure AnalysisFAC Fully anechoic chamber FAQ Frequently Asked QuestionsFAI First article inspectionFEM Finite Element ModellingFFR Field Failure RateFIL Filter.FIML Fabric Inmold Labeling, same with CIM Custom In MouldFIT Failures in Time FMEA Failure Mode and Effect AnalysisFOR FOT 第一次试模FR Failure RateG.A. General Assembly Gauge R&R Gauge Repeatability and Reproducibility GCPM GD&T Geometrical Dimensioning & Tolerances GRP ground reference planeGRR Gauge Repeatability and ReproducibilityHBM Human Body Model HBM Human Body Model discharge typeHCP horizontal coupling planeHIGH Highlight selectedhk Hong KongHUB Warehousing and Shipping functionality locationICDR Integrated Circuit Design Reviews ICDR IC Design ReviewID Industrial DesignIFR Intrinsic Failure Rate IMD Insert Mold DecorationIME Inject Mold EquipmentIML Insert Mold LabelingIML IN MOLD LABELINGIPQC In Process Quality ControlIPR Intellectual Property Rights ISO International Standardization Organizationjk JyvskylJR&D Joint Research and developmentKCR Key Component ReviewKO Kick OffLA License Agreementla Los AngelesLAB LabelLCL Lower Control LimitLL Lesson Learned LRVP Long Range Volume Plan LSL Lower Specification LimitLSSE Light SW Subcontractor EvaluationM&O Mechanics & OutsourcingM/C machineM3 Global quality databaseMAR Mechanics Acceptance ReportMARs Mechanical Acceptance Reports MatCoMa MC Measuring CentreMD Mechanics DesginMDF Material Data Form MDFs material data formsME Manufacturing EngineerMECH MechanicsMFI Melt flow indexMIS MM Machine Model discharge typeMOR Monthly Operation ReviewMOSS Visual Quality Criterias procedureMPL Material Project LeaderMPL / M Material Project Leader / ManagerMPL/MPM Material Project Leader/ ManagerMPM Material Project ManagerMR Measurements ReportMRP MS Manufacturing SolutionsMS MilestoneMSA Measurement System AnalysisMSID Moisture-Sensitive Identification MSM Mechnical Supplier ManagementMSM Mechanics Sourcing ManagerMTO Make TO OrderMTS Mechanical Technology SourcingMULTIL.PRODUCTS Ceramic powder manuf, Sheet forming, Cutting, Printing, FiringNC non connect NCT NDA Non Disclosure AgreementNET Nokia NetworksNET NetworksNGP Nokia Global ProcessesNGS Nokia Global StandardsNGSW Nokia Global Supplier WebNMP Nokia Mobile Phones LtdNOSS Nokia Supplier Status database NPI Nokia Product IntegrationNPI New Product IntroductionNPSQS Nokia Part Specific Quality StandardsNRT Nokia Rapid ToolingNSL Nokia Substance List NSM Nokia Supplier ManualNSR Nokia Supplier RequirementNTP Normal temperature and pressure, see laboratory environmentOAP Original Accessory PartnerOCAP Out-of-Control Action PlanOCV Open Circuit Voltage ODM Original Design ManufacturerODM Original Design done by Partner independentlyOEM Original Equipment ManufactureOEM Original Design done by Nokia OPL Operations Project LeaderOQC Outgoing Quality ControlORS Operating Resource SourcingOT Over timeOTD On time deliveryou OuluPA Process Assessment PA ProductAgreementPC Product CreationPC Polycarbonate PCBA PCN Process Change Notice PCNs product change notification cases PCQE Program Component Quality Engineer PCQM Program Component Quality ManagerPD Product DeliveryPDM Product Development ManagerPDM Product Data ManagementPDM Product Data Management System PDT Project Development TeamPE Product Engineering (used for product in mass production)PFMEA Process Failure Mode and Effect AnalysisPGP Pretty Good PrivacyPI Product Implementation PIR PLM Product Line ManagementPLP Product Lifetime ProfitabilityPLRM Program Loading Road mapPM Product ManagerPM Purchasing ManagerPM Project ManagerPM/MP Partner Manufacturing/Manufacturing PartnerPMA Project Manager AssistantPMC PMM Program Portfolio ManagementPMT Project Management TeamPO Purchasing OrderPOKA-YOKE Mistake ProofingPOP Package Operation ProcedurePop-Port System connector in NOKIA mobile devices POWER AMPS MMIC and/or IC manufacturing Pp, Ppk Process Performance IndicesPPA Product Purchase Agreement PPAP Production Part Approval ProcessPPM Product Program Manager ppm Parts per millionPQ Process QualificationPQGFP Package qualification guideline for programsPQM Program Quality ManagerPQP Program Quality PlanPQP Package Qualification ProcedurePR1/2 PTO Package TO OrderPV Product ValidationPVD Physical Vapor DepositionPWB Printed Wire BoardQA quality assurenQBR Quarterly Business ReviewQC quality controlQE Quality EngineerQFD Quality Function DeploymentQM quality managementQSR Quality System RequirementQTE Quality Technician Engineer QTE Quality and Technology EngineerQTE / QTM Quality Technology Engineer / Manager QTE / QTM Quality Technology Engineer / ManagerQTM Quality and Technology Manager QTY QuantityR&D Research and Development R&R Roles and ResponsibilitiesR&T Research and TechnologyRAM Random Access Memory Ramp Up/SA REC ReconsiderREL Related toRFP Request For ProposalRFQ Request For QuotationRIPS Recently Introduced Product SupportRMA Return Material Authorization SA SAC semi anechoic chamber SAW /BAW FILTERS, SAW DUPLEXERS Die wafer manufacturing SCP Service Channel PreparationSEM ScanningElectronMicroscopeSG Save as groupSHO Showsi SingaporeSID SIP Standard Inspection ProcedureSLI Supply Line Implementation processSLM Supply Line Management SLP Supply Line Preparation processSO Solution OfferingSOP Standard Operation ProcedureSOW s