Saw Training.ppt

1 WafersawtechnologiesintroductionsbasicknowledgePartOne WarmWelcomes Jun 25 2005 芯片切割技术及应用基础知识 2 AutomaticDicing CuttingSawMachineKnowledgeIntroductions 日本Disco公司自动芯片切割机系列基础培训 DAD341 321 320 3350 2H6T Disco KS EHWA 3 TRAININGGOAL培训的目标 1 Toknoweachtypesofsawmachinesinlps toknowthecomponentparts了解LPS芯片切割机的类型 了解芯片切割机的组成部分 2 Tolearntherelatedknowledgeofsawblades thestepsofchangingbladesandtheprinciplesofdicing cuttingsaw学习刀片相关知识及更换刀片的步骤 学习芯片切割原理 4 Tostudyrelatedsolutionsintroubleshootingandrejects andbeyond学习相关设备的故障处理方法和废品控制等等方面的知识 3 Toknowhowtosawawaferonmachinebyasawoperator 实地了解一片WAFER到底是怎样切割出来的 4 INTRODUCTIONSOFCONTENTS内容介绍 EACHTYPESOFSAWMACHINESINLPSLPS芯片切割机的类型 2 COMPONENTPARTSOFSAWMACHINE芯片切割机的组成部分 4 PRINCIPLEOFDICING CUTTINGSAW芯片切割原理 3 SAWBLADESTYPES STEPSOFCHANGINGBLADES刀片相关知识及更换刀片的步骤 5 OTHERSINFORMATIONS其它方面 5 设备和工艺流程 Wafermount Wafersaw Waferwash Diebond SawthemountedWaferinsawmachine MountthewaferbyblueMylar CleanthesawnwaferbyusinghighpressureD I waterinwaferwashM C Bondthesawnwaferinleadframebyusingdiebond Equipmentdescription Processflowdescription 6 DAD321 DAD320 DAD341 EACHTYPESOFSAWMACHINESINLPS菲尼克斯所采用的切割机类型 AutomaticDicingSaw300Series 一 芯片切割机的类型 7 DAD2H 6T DAD3350 AutomaticDicingSaw3000Series 一 芯片切割机的类型 EACHTYPESOFSAWMACHINESINLPS菲尼克斯所采用的切割机类型 8 1 喷水盖2 流量计3 静电手腕4 报警灯5 状态牌6 标签牌7 1电源灯7 2钥匙开关7 3灯光亮度7 4显示屏幕7 5紧急停止开关8 摄像头9 切割工作盘10 控制键盘11 压缩空气管12 TCM盒子 二 COMPONENTPARTSOFSAWMACHINE芯片切割机的组成部分 以 为例外部各部分示意图 EXTERNALVIEW 9 INTERNALPARTS 二 COMPONENTPARTSOFSAWMACHINE芯片切割机的组成部分 内部各部分示意图 X axisMovesthechucktabletorightandleft Y axisMovesthespindleshaftforwardandrearward Z axisMovesthespindleupanddown SupportthewholeBodyofmachine axisMovesthechucktable SpindleshaftsectionRotatesthebladeatHighspeed CircuitsystemsectionProvidesupportandcontrolToeachaxissectionandcomponents 10 InputVoltage输入电压 200VAC 10 50 60Hz Powerconsumption功耗 2 5KVAmax Pressure压缩空气压力值 0 49Mpa 5 0kgf cmsq c DIwaterresistance去离子水电阻 14Mohms ENVIRONMENT PARAMETERSOFSAWM C 芯片切割机的运行条件设定 二 COMPONENTPARTSOFSAWMACHINE芯片切割机的组成部分 11 DIAMONDBLADEBASICALSTRUCTURE金刚石刀片的基本结构 三 SAWBLADESTYPES STEPSOFCHANGINGBLADES刀片相关知识及更换刀片的步骤 12 Hubflangenut Wheelmountlocknut Hubtypewheelmount spindlesection Blade 2 DIAMONDBLADEINSTALLATIONSTRUCTURE刀片的装配图 三 SAWBLADESTYPES STEPSOFCHANGINGBLADES刀片相关知识及更换刀片的步骤 Adoptairbearingtosupportspindleaxis SpindleSection spindle wheelmount Spindlebracket 13 主轴背后管道排线连接图 Spindlerearpipingconnectiondiagrams 14 USEDTYPE NBC ZH2040 SE27HDDC BNBC ZH203L SE27HDCB B27HCBB B 27HCAA BK SBlade DEFINITIONSFORBLADECODENAME刀片型号注解1 DENSITYSEHUBtype27HOUTSIDEDIAMETER55 56mmINSIDEDIAMETER19 05mm D PARTICLEDENSITYA 7000B 4500for 0 5 3um C 4000 2 14um D 2000 4 6um E 1300 4 8um F D BLADEEXPOSUREA 0 38 0 51mmB 0 51 0 64mmC 0 64 0 76mmD 0 76 0 89mm C BLADETHICKNESSB 0 020mmC 0 025mm NBC ZH Standardsawbladeofdiamondmaterial NBC ZH2040 SE27HDDC B DENSITY密度 BLADEEXPOSURE BLADETHICKNESS 倒角的 三 SAWBLADESTYPES STEPSOFCHANGINGBLADES刀片相关知识及更换刀片的步骤 15 NBC ZH Standardsawbladeofdiamondmaterial 倒角的 ABCDEFG BONDCONDITIONOSTANDARDBONDJSOFTBONDFFORBACKSIDECHIPPINGREDUCTION BLADEEXPOSURE GRITSIZE GRITSIZECODE 04 NBC ZH 2 O SE 27H D KERFWIDTH C B A0 380 0 510B0 510 0 640C0 640 0 760D0 760 0 890E0 890 1 020F1 020 1 150 B A0 015 0 020B0 020 0 025C0 025 0 030D0 035 0 040E0 040 0 045F0 045 0 050G0 050 0 060 HUBTYPESESHARPHUBEDGETYPE BLADEDIAMETER27HO D55 56mmI D19 05mm35HO D76 20mmI D31 75mm DEFINITIONSFORBLADECODENAME刀片型号注解2UPDATE 三 SAWBLADESTYPES STEPSOFCHANGINGBLADES刀片相关知识及更换刀片的步骤 16 PARAMETERSOFSAWMACHINE 实际机器里刀片参数设定值 备注 1 刀片中间采用铝架 避免硬对硬而将spindle轴损坏2 刀刃由金刚石 人造 金刚石颗粒由黏合剂粘合而成金刚石颗粒大 寿命长 但切割不规则金刚石颗粒小 寿命短 但切割较规则3 刀片有 a 硬刀片 有刀架b 软刀片 无刀架4 刀刃伸出量大 切割磨损余量大 寿命长刀刃伸出量小 切割磨损余量小 寿命短 PARAMETERSOFSAWBLADE 三 SAWBLADESTYPES STEPSOFCHANGINGBLADES刀片相关知识及更换刀片的步骤 17 1 SawkerfswidthinSPC 27HDDC B 28 36um27HDCB B23 31um27HCBB B KS 23 31um 2 Tablespeed DAD320 321 50mm s DAD341 80mmSpindlerotationspeed DAD320 32130000rpm DAD34150000rpm 3 Z index 2 0 0 1mils 4 Bladecooler 1 0 1 5l mShower 0 5 0 7l m 5 CDAPressure 4 5 6 5kgf cmsq 6 Sawbladelifelimited Max60kfor27HDDC B 27HDCB BMax30kfor27HCBB BMax45kforKSbladeMax10kfor27CAA B PARAMETERSOFSAWMACHINE Sawcontrolplan 三 SAWBLADESTYPES STEPSOFCHANGINGBLADES刀片相关知识及更换刀片的步骤 18 Wafersawprocess 1 GENERALCUTTINGMODE一般的切割模式 AMODE 四 PRINCIPLEOFDICING CUTTINGSAW芯片切割原理 Dicingsaw Adicingsawemploysahigh speedspindlefittedwithanextremelythindiamondbladetodiceorgroovesemiconductorwafersandotherworkpieces Theprincipleofwafersaw 19 2 DIAMONDBLADEBASICALDIMENSIONSTRUCTUREDURINGWAFERCUTTING切割过程中各高度的组成示意图 四 PRINCIPLEOFDICING CUTTINGSAW芯片切割原理 1 3Mylarthickness 20 AMODE GENERALMODE Single spindledicer SPINDLEAXIS主轴ApplytoinstallbladeandRotatethebladeathighspeed用于安装刀片 高速旋转刀片 DIE MYLAR CUTTINGLANE STREET SAWBLADE 四 PRINCIPLEOFDICING CUTTINGSAW芯片切割原理 21 ASMODE SPECIALMODE Single spindledicer SPINDLE CUTTINGLANE STREET SAWBLADE DIE MYLAR 四 PRINCIPLEOFDICING CUTTINGSAW芯片切割原理 22 AMODE ASMODE MYLAR MYLAR WAFER WAFER AMODE与ASMODE的区别 四 PRINCIPLEOFDICING CUTTINGSAW芯片切割原理 ACuttingModeisforone directioncutting DOWNCUT 一个方向上切割wafer 每次都从左边开始切割 到右边刀片抬起返回到左边 然后又开始切割下一沟道 ASCuttingModeDowncut Max6 同一沟道分最多可以分6次切割完 仍然只在一个方向上切割 23 CUTTINGMODE切割方式 A cuttingmodeisprescribedtousetosawwaferinproductlinescurrently当前所有sawmachine均规定使用A切割方式 V1 V2 V3 V4 w w Bladedown starttocut Bladereturn moveup chucktableMovespeed Chucktablereturnspeed wafer Chucktable V5 1 刀片的进刀切点速度V5与wafer移动速度V3方向一致 能有效的减少topchip的产生 即所说的downcut 但易产生backchip2 若其方向相反 必将增加topchip产生 这种方式即所说的upcut 容易产生topchip 可以避免backchip Remark Cuttype Downcut Upcut 3 主要产生backchip 而可以减少topchip 主要产生topchip 而可以减少backchip 24 CUTTINGMODEINTRODUCTION 1 ACuttingModeTheAmodeisforone directioncutting DOWNCUT 一个方向上切割wafer2 BCuttingModeTheBModeisforreciprocatingcutting DOWNCUT UPCUT 来回两个方向上都切割wafer3 ASCuttingMode Downcut Max6 同一沟道分6次切割完 仍然只在一个方向上切割4 BSCuttingMode DOWNCUT UPCUT 同一沟道分6次切割完 来回两个方向上都切割5 B ZKEEPCuttingModeTheZ directionescapeoperationisnotperformedintheindexingsequence 刀片在来回切割中不升起6 BS ZKEEPCuttingMode TheZ directionescapeoperationisnotperformedintheindexingsequence 刀片在来回切割中不升起7 AUPCuttingModeOntheotherhand themachineconductscuttingwhilethechucktablemovesfromlefttoright起始空一刀过来 然后再开始切割8 ASUPCuttingMode Ontheotherhand themachineconductscuttingwhilethechucktablemovesfromlefttoright 起始空一刀过来 然后再开始切割 CUTTINGMODE切割方式 25 DUALCUTTING SPINDLE 1 2 2 1 Dual spindledicer 1 知识拓展在增加OUTPUT方面的运用方案 J1 四 PRINCIPLEOFDICING CUTTINGSAW芯片切割原理 CUTTINGLANE STREET SAWBLADE Solutionsforincreasingoutputduringcuttingwafer 平行双轴双刀切割 DIE MYLAR 26 2 1 Facingdual spindledicer 1 2 SPINDLE J2 CUTTINGLANE STREET SAWBLADE Solutionsforincreasingoutputduringcuttingwafer 知识拓展在增加OUTPUT方面的运用方案 对立双轴双刀切割 DIE MYLAR 27 DUALCUTTING 2 1 dual spindledicer 3 J3 知识拓展在CD PDREJECT控制方面的运用方案 CUTTINGLANE STREET SAWBLADE SolutionsforCrackeddie Chippeddieduringcuttingwafer 平行双轴双刀切割 Laserdicer 1 laser 包括激光切割 DIE MYLAR 28 DUALCUTTING 1 2 2 1 dual spindledicer 4 Laserdicer 1 laser 包括激光切割 SPINDLE J4 CUTTINGLANE STREET SAWBLADE SolutionsforCrackeddie Chippeddieduringcuttingwafer 知识拓展在CD PDREJECT控制方面的运用方案 平行双轴双刀切割 DIE MYLAR 29 FullyAutomaticDicingSaw6000Series DFD6240 DFD6340 DFD6450 DFD6361 7000Series FullyAutomaticLasersaw 知识拓展 30 WaferSawMethod Mode Dicingsaw Automaticdicingsaw DADseries Fullyautomaticdicingsaw DFDseries Paralleldual spindledicer Facingdual spindledicer Single spindledicer Single spindledicer 知识拓展 31 Theworkpieceisplacedonandremovedfromthechucktablebyhand andonlythecuttingsequenceisautomatic Dependingonthedicer automaticalignmentissupported Also washinganddryingisperformedexternally Automaticdicingsaw自动切割机 Operatorplacestheworkpieceontothechucktable 3000seriesdicerperformalignmentautomatically Forthe300and500seriesdicers theoperatoralignsthecutlineandbladewithamicroscope Operatorpushesthestartbuttonandthedicercutthelinedetectedduringalignment 知识拓展 32 Fullyautomaticdicingsaw全自动切割机 Thedicingsawautomaticperformsloading alignment dicing washing dryingandthenreloadingoftheworkpiecebackintothecassette Workpieceisremovedfromthecassetteandplacedontothechucktable Cuttinglineisdetected Cutsthelinedetectedduringalignment Whiletheworkpieceisrotatedathighspeed itiswashedwithdistilledwateranddriedwithair 知识拓展 33 STEPSOFCHANGINGBLADE刀片更换 STEP1InitializeSystem系统初始化 STEP2EntranceProgram进入程序5 3 1BLADEMAINTENANCE BLADEINFORMATION BLADEREPLACEMENT刀片参数维护 刀片资料信息 刀片更换 STEP3FirstpressF5BLADESELECTORtochoosetargetblade AndthenpressENTERkeytosaveitsettings按下 键刀片选择 选择所需要的目标刀片并保存设置 STEP6Thenusespecialtorquedrivertotakeouthubtypewheelmount takethebladeOutslowlyandslightly用专用的力矩起子取下 轻轻取下刀片 STEP4PressF10 BladeBreakageDetectorAdjust Thenopenthesplashcover按下 刀片破损检测调整 然后打开喷水盖 STEP5Takeoutwheelcoverfirst ThenloosentheBBDsensorNUTandhangitup接下来先取下轮盖 松开 敏感器螺母并向上抬起 34 STEP7CleanthesurfaceofthebladeinstallationpositionandthehubtypeflangenutEndfaceandBBDsurface清洁刀片安装处的表面及端面 和 表面 STEP8Replaceanewblade Becarefulwhenyoupickupthisnewbladeandinstallitonthespindleaxis DonotinstallitwithpowerfulforceThetorqueDrivermustissetat30kgf 更换上新的刀片 注意力矩力设定为 上刀片时注意不要强行用力去装刀片 STEP9Rotatethebladewhenyoufinishinstallationtoensurethebladeincorrectstatus完成安装时 要旋转刀片以保证刀片状况良好 刀片紧贴端面 STEP10Installthehubtypewheelnutbytorquedriver thenadjustBBDsensitivity about10 BBD敏感度设定在 STEP11Installthewheelcoverandclosethesplashcover关上喷水盖 STEP12PressCounterClearwhenentranceProgram bladeInfo Thensetupandrecor