PEC电子工程英语证书考试复习资料.doc

PEC电子工程英语证书考试-电子工程术语AASymbol for ampere.abstractTo simplify.ABTAcronym for Advanced BiCMOS Technology, as in 74ABT245.ABTEAcronym for Advanced BiCMOS Technology/Enhanced logic, as in 74ABTE245.ABTHAcronym for Advanced BiCMOS Technology logic with bus-Hold, as in 74ABTH245.ACAcronym for Alternating Current.ACAcronym for Advanced CMOS logic, as in 74AC245.accuracy1. The extent to which a given measurement, or the average of a set of measurements, agrees with the true value for that measurement. 2. Agreement between simulation results and lab measurements.ACLAcronym for Advanced CMOS Logic, as in 74ACL245.ACTAcronym for Advanced CMOS logic with TTL compatible inputs.AEAAcronym for American Electronic Association.AEAAcronym for American Engineering Association.AHDLAcronym for Analog Hardware Description Language.AMSAcronym for Analog Mixed-Signal (hardware description language).analogInformation represented as continuously varying voltage or current rather than in discrete levels as opposed to digital data varying between two discrete levels.ANOVAAcronym for Analysis Of VarianceANSIAcronym for American National Standards Institute.AQLAcronym for Acceptable Quality Level.ASCIIAcronym for American Standard Code for Information Interchange.ASICAcronym for Application Specific Integrated Circuit.ASTMAcronym for American Society for Testing and Materials.AWEAcronym for Asymptotic Waveform Evaluation. Model order reduction. Such as reducing a large RC network to a smaller RC network for faster simulation. This modeling method has known frequency limits for accuracy.Bbehavioral modelProvides data on behavior at the input and output ports of a device. What the device consists of internally remains ablack (opaque) box. Usually used when scanning a large design for the first time. At that point speed is desired over detail.behavioral modelingSystem-level modeling consisting of a functional specification plus modeling of the timing of an implementation. A behavioral model consists of an HDL description of a device or component, which is expressed at a relatively high level of abstraction (higher than the register-transfer level or gate level). It uses underlying mathematical equations to represent the functional behavior of the component. See alsofunctionalmodeling.BEMAcronym for older Boundary Element Method. Method of numerical computational electromagnetics. Dates from before the 1980s. Requires ground plane.BERAcronym for Bit Error Rate.BGAAcronym for Ball Grid Array.BiCMOSAcronym for Bipolar Complementary Metal Oxide Semiconductor.BIRDAcronym for Buffer Issue Resolution Document IBIS Committee.BJTAcronym for Bipolar Junction Transistor.BNCAcronym for Bayonet Neill Concelman Connector.BOMAcronym for Bill Of Materials.BSIMAcronym forBerkeley Short-channel IGFET Model.BTLAcronym for Backplane Transceiver Logic, as in 74BTL245.CC1. Symbol for capacitance. 2. Abbreviation for degrees Celsius/Centigrade.CADAcronym for Computer Aided Design.CAEAcronym for Computer Aided Engineering.CAMAcronym for Computer Aided Manufacturing.CBAcronym for Complementary Bipolar, as in 74CB245.CEMAcronym for Computational Electromagnetics.characteriza-tion modelAnother term for a devices data sheet. Displays the behavior of various properties over current, frequency, temperature, population spread, etc. Characterize means to describe and depict.circuitInterconnection of components to provide an electrical path between two or more components.CISPRAcronym for Comit Internationale Spcial des Perturbations Radioelectrotechnique.CMCAcronym for Compact Model Council.CMLAcronym for Current Mode Logic.CMOSAcronym for Complimentary Metal Oxide Semiconductor.CMRRAcronym for Common Mode Rejection Ratio.Confidence intervalA statistical range with a specified probability that a given parameter lies within the range.Confidence levelExample: Suppose an opinion poll predicted that, if the election were held today, the Conservative party would win 60% of the vote. The pollster might attach a 95% confidence level to the interval 60% plus or minus 3%. That is, he thinks it very likely that the Conservative party would get between 57% and 63% of the total vote.Confidence limitEither of the two numbers that specify the endpoints of a confidence interval.correlation1. How well a set of measurements agrees with a separate set of measurements on the same group of units. One or more attributes may be used. 2. Process of making a quantitative comparison between two sets of data. Also, from the word roots co: together and relation.correlation metricA means of quantifying agreement between two sets of data.COTSAcronym for Commercial Off-The-Shelf apparatus.CPDAcronym for Cumulative Probability Distribution (function).crosstalkThe amount of signal from one conductor that gets coupled onto an adjacent conductor through the mutual capacitance and inductance between them. The magnitude of the effect is always a fraction of the active, or aggressor, net upon the passive, or victim, net. The amount of coupling depends on the proximity of the nets, the proximity of any ground/power plane, the length of any parallel runs, the risetime of the driving signal and the dielectric medium between them.current carrierA current carrier is either a conduction band electron or a conduction band hole.DDARPAAcronym for Defense Advanced Research Projects Agency.data sheetDocumentation created after the properties and behavior of a population of devices, from a statisticallyin-controlprocess, are characterized.dBAcronym for decibel. The number of decibels denoting the ratio of the two amounts of power being ten times the logarithm to the base 10 of this ratio. With P1 and P2 designating two amounts of power and n the number of decibels denoting their ratio.(ANSI C63.14 1992) N = 10log10 (P1/P2) dBdBmV/mSymbol for decibels-micro-Volts per meter. where dBmv = 20 log Signal (mV)/1mV Decibels relative to one microvolt across same resistance.DCAcronym for Direct Current.detailed physical modelA device model wherein its internal detail is described as closely as possible. There is usually a close correlation with the physical construction of the device.deviceA component or part.DFMAcronym for Design For Manufacturability.DFTAcronym for Design For Test.DIEAcronym for Die Information Exchange.dielectricDielectric materials arepoor conductors of electricity, andare insulators that are used to provide separation between conductors. Dielectric materials can be made to hold an electrostatic charge while dissipating minimal energy in the form of heat. Glass, porcelain, mica, rubber, plastics dry air, vacuums and some liquids and gases are dielectric.For example: air, FR4, and GETEK.dielectric constant (relative)An inherent property of dielectric materials that determines the amount of electric charge that can be stored. The higher the constant,E, the higher the energy stored in the materials capacitance.Eis usually measured and reported in formulas relative to air (Er). Air then gets anEr, = 1. FR4 often has a low frequencyEr= 4.3 depending on starting materials and processing. In solid dielectricsErwill fall off starting with high frequencies while signal attenuation increases.Eraffects transmission line behavior, particularly characteristic impedance (Zo) and propagation delay (td). The changes in tdwith frequency cause decreased delay leading to dispersion, or spreading distortion, of a time domain pulse that is composed of many frequencies.digitalData varying between two discrete levels. Electronic signals or switches based on discrete, binary electrical levels (ones and zeros) found in such products as touch-tone telephones and audio compact disk players. These signals are either ON or OFF, HIGH or LOW, YES or NO. The mathematical description in digital products is simple, since it is either ON or OFF.DIPAcronym for Dual InLine Package.discreteAs in discrete component. Package containing only a single component as opposed to an integrated circuit containing many components in a single package.dispersion1. The scattering of values of a measurement around the mean or median of the measurement.2. A distribution.dispersion, dielectricA high frequency effect in dielectric materials. At high frequencies the dielectric constant decreases causing an increase in propagation velocity and a dispersion in arrival times of wave frequency components.DMLAcronym for Device Modeling Language (Cadence) and associated .dml files.documentationReports such as data sheets, process control, product characterization, process characterization, and models. May be produced by either the supplier or customer to describe or depict the semiconductor process.DOEAcronym for Design Of Experiments.dopingThe process of adding impurity atoms to intrinsic (pure) silicon or germanium to improve the conductivity of the semiconductor material.DSPAcronym for Digital Signal Processing.DTLAcronym for Diode-Transistor Logic.DUTAcronym for Device Under Test.EEarly effectA behavior in narrow base BJT transistors named for Dr. J. Early who explained it. The effect is an increase in b due to base narrowing caused by increasing base-collector bias voltage.EBDAcronym for Electronic Board Description (IBIS) and the associated .ebd files.ECLAcronym for Emitter Coupled Logic.EDAAcronym for Electronic Design Automation. EDA software tools or tool suites may display simulator output for analysis (as in waveform analyzers) or which may analyze the reliability, electromagnetic interference, metal migration, signal integrity, or thermal characteristics of a design. The tools in this category may work at any level of abstraction behavioral, register-transfer-level (RTL), gate-level, or with the physical layout of an IC device or electronic system.EDIFAcronym for Electronic Design Interchange Format.EIAAcronym for Electronic Industries Association.EIAJAcronym for Electronics Industries Association of Japan.EKVAcronym for Enz-Krummenacher-Vittoz model.ElectroMagnetic IntegrityThe technical discipline of designing for ElectroMagnetic Control (EMC) and low ElectroMagnetic Interference (EMI), so that one circuit (or equipment) does not interfere with another circuit (or equipment). The design task begins with designing for good Signal and Power Integrity and adds the concerns of coupling and radiation. The noise energy available to the coupling and radiation mechanisms can be suppressed with good Signal and Power Integrity. The next step is good design control over coupling and radiation mechanisms. These additional actions include controlling: shielding; cabling; leakage; board resonances; enclosure resonances; structural behavior that operates as an antenna.EMAcronym for ElectroMagnetic.EMCAcronym for ElectroMagnetic Compatibility. The capability of Electrical and Electronic Systems, equipment and devices to operate in their intended electromagnetic environment within a defined margin of safety, and at design levels of performance, without suffering or causing unacceptable degradation as a result of electromagnetic interference (ANSI C63.14 1992).EMIAcronym Electromagnetic Interference. The electromagnetic disturbances (electronic noise) in an environment that can affect an electronic device, or that which is being produced by an electronic device, or both. EMI analysis tools are used to verify EMC compliance during the design of high-speed PCBs and IC packages. The traditional EMI remedies involve the addition of extra components, metal shields, metal plans, or even redesigning the entire system. Synonym: radio-frequency interference.EMI/EMCAcronym for Electromagnetic Interference/Electromagnetic Control.equation-based modelA model based on equations that describe the behavior of the device, or circuit, modeled. Most importantly, the output as a function of the input.ESDAcronym for ElectroStatic Discharge. A transfer of electric charge between bodies of different electrostatic potential in close proximity or through direct contact (ANSI C63.14 1992).ESSAcronym for Environmental Stress Screening.eVAbbreviation for electron-volt.FFSymbol for Farad, measure of capacitance.fAbbreviation for frequency.FACTAcronym for Fairchild Advanced Cmos Technology, as in 74FACT245.FASTAcronym for Fairchild Advanced Schottky TTL, as in 74F245.FCTAcronym for Fast Cmos Technology, as in 74FCT245.FDTDAcronym for Finite Difference Time Domain modeling.FEAAcronym for Finite Element Analysis.FEMAcronym for Finite Element Method. Method of numerical computational electromagnetics. Essentially everybody does some form of this for field solvers, such as T-lines.FETAcronym for Field Effect Transistor.FFTAcronym for Fast Fourier Transform.FOMAcronym for Figure Of Merit.FPGAAcronym for field programmable gate array.functional modelingModeling by the use of mathematical functions, algorithms and formulas.GGSymbol for giga, as in10+12GaAsAcronym for Gallium Arsinide.GB or Gbit or GBITAcronym for GigaBit.glue logicSmall ICs that level shift and otherwise perform simple functions that enable large blocks of logic (ASICs, microprocessors, memories) to work together. Thusgluingthem together.GNDAcronym for GrouND. A reference connection commonly connected to Earth, whose electric potential is usually equal to zero.ground bounceThe transient rise or fall in voltage on a ground plane or ground pin from its ideal quiescent value of zero due switching currents on and off through impedance (mostly inductance) in the ground path. A similar effect on the power plane causes power bounce. The result is noise on the signal that can decrease signal to noise ratio in analog circuits or lead to false switching in digital circuits.GTLAcronym for Gunning Transceiver Logic, as in 74GTL245.GTLPAcronym for Gunning Transceiver Logic Plus, as in 74GTLP245.guard-bandingThe practice of adding safety margin, or extra safety margin, to specification limits or population distributions.HHAbbreviation for Henry, the unit of inductance.HALTAcronym for Highly Accelerated Life Test.HASSAcronym for Highly Accelerated Stress Screening.HCAcronym for High speed Cmos, as in 74HC245.HCTAcronym for High speed Cmos with TTL thresholds, as in 74HCT245.HDLAcronym Hardware Description Language. One of several specialized high-level languages used by semiconductor designers to describe the features and functionality of chips and systems prior to handoff to the IC layout process. HDL descriptions are used in both the design implementation and verification flows. Currently, the two standard HDLs in use worldwide are Verilog-HDL and VHDL. Several proprietary HDLs also exist, mainly for describing logic that is targeted for vendor-specific programmable logic devices.high-speed digital designThe design of digital circuits relative to their analog behavior. Particularly, where the fast switching edge rates used cause transmission line effects to become significant.holeA gap left in the covalent bond when a valence electron gains sufficient energy to jump to the conduction band.HSDDAcronym for High-Speed Digital Design. HSDD, as used in this book, applies to both active and passive circuit elements.HSTLAcronym for High Speed Transceiver Logic.HTLAcronym for High Threshold Logic.HTTLAcronym for High power Transistor-to-Transistor Logic.HzSymbol for Hertz, as in cycles per second.II/OSymbol for Input/Output.IBISAcronym for Input/output Buffer Information Specification.IBIS modelA data file produced in conformance with the IBIS Specification. The IBIS file, or model, provides necessary data for a simulator to predict the analog behavior of digital circuits.IBIS quality levelsFour levels of increasing quality as defined in the IBIS quality checklist.IBIS rise timeRise time based on the IBIS Ramp specification of 20% to 80% of 0 Volts to Vcc switching.ICAcronym for Integrated Circuit.ICEMAcronym for Integrated Circuits Electromagnetic Model, specification 62014-3 from IEC.ICMAcronym for IBIS Interconnect Modeling Information (specification). Connectors, packages, and interconnections.ideal-generic modelsExamples: ideal current source, ideal operational amplifier.IEC1. Acronym for International Engineering Consortium 2. Acronym for International Electrotechnical CommissionIEEEAcronym for Institute of Electrical and Electronics Engineers.IGBTAcronym for Insulated Gate Bipolar Transistor.IGFETAcronym for Insulated Gate Field Effect Transistor.impedanceMeasured in ohms, it is the total opposition to the flow of current offered by a circuit element. Impedance consists of the vector sum of resistance and reactance. The symbol, or term, for impedance is Z.in-control (SPC)A statistical process control (SPC) term that means that only random variation is seen in the process and that there are nospecial causereasons for variation.IPAcronym for Intellectual Property.ISOAcronym for International Standards Organization.JJEDECAcronym for Joint Electron Device Engineering Council.JFETAcronym for Junction Field Effect Transistor.junctionContact or connection between two or more wires or cables. The area where thep-type material andn-type material meet in a semiconductor.KKSymbol for kilo, as in 1000.KeywordSpecial words, as used in the IBIS Specification, that are reserved and set off by square brackets. E