IBM求职要求.doc

Chip Development Engineer Job IDSTG-0337611Job typeFull-time Regular Work countryChinaPosted26-May-2011 Work cityBeijing, ShanghaiJob areaSoftware Development TravelNo travelJob categorySoftware Development & Support Business unitSysSwDevJob roleSoftware Developer Job role skillsetGeneral Commissionable/Sales-Incentive jobs onlyNo -Job DescriptionIBM Chip Design Engineers are working on cutting edge SoC (System on a Chip), ASIC, High Performance Processor, and Digital Custom and Mix-signal Circuit IP design for our clients inside and outside of IBM. By employing the industry leading tools, methodology, and semiconductor technologies ranging from 90nm to 32nm and beyond, you will be participating in the delivery of end to end solutions including architecture design and performance analysis/tuning, front-end logic design and verification, back-end implementation and optimization, circuit IP design, EDA deployment, as well as Chip hardware validation.Required Skills1. CS/EE or background in digital or analog Chip Design related areas2. Research and development experience on one or more of the following areas: Architectural design, analysis, and optimization Proficient in Verilog/VHDL, and well conversant with programming and script languages Digital logic implementation and verification on the basis of the target system specification SoC design methodology: Knowledge of SoC integration, modeling and verification at different abstract level ASIC Back-end design methodology: Knowledge of synthesis, timing, DFT, floorplanning, physical design, signal/power integrity, packaging, and other back-end activities. Experience/knowledge in the field of Analog and mixed-signal IP design, test and evaluation with Bulk CMOS, BiCMOS, or SOI technologies.3. Experience in one or some of the application domains, will be a plus Multi-Media, Graphic and Gaming processing Digital signal and RISC Processor architecture Consumer Electronics applications Communication, Networking and wireless applications High Speed Interface/Serdes applications Other emerging technology and industry areas4. Good English/communication skill and willingness to work with a global team5. Good learning competency and be able to work on diverse areas in a flexible environment 6. Strong technical leadership will be important consideration for senior positions. Required Bachelors Degree English: FluentChinese simplified: FluentIBM is committed to creating a diverse environment and is proud to be an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, genetics, disability, age, or veteran status.-2011 CSTL CAMPUS - Chip Design Engineer Job IDSTG-0362306Job typeFull-time Regular Work countryChinaPosted05-Nov-2010 Work cityBeijing, ShanghaiJob areaSoftware Development TravelNo travelJob categorySoftware Development & Support Business unitSysSwDevJob roleSoftware Developer Job role skillsetGeneral Commissionable/Sales-Incentive jobs onlyNo -Job descriptionJob Scope:IBM Chip Design Engineers are working on cutting edge SoC (System on a Chip), ASIC, High Performance Processor, Digital/Analog and Mix-signal Circuit IP design for our clients inside and outside of IBM. By employing the industry leading tools, methodology, and semiconductor technologies ranging from 90nm to 22nm and beyond, you will be participating in the delivery of end to end solutions including architecture design and performance analysis/tuning, front-end logic design and verification, back-end implementation and optimization, circuit IP design, EDA & Methodology development and deployment, as well as Chip hardware validation.Key Attributes:1. CS/EE or background in digital or analog Chip Design related areas2. Research and development experience in one or more of the following areas: Architectural design, analysis, and optimization Proficient in Verilog/VHDL, and well conversant with programming and script languages Digital logic implementation and verification on the basis of the target system specification SoC design methodology: Knowledge of SoC integration, modeling and verification at different abstract level ASIC Back-end design methodology: Knowledge of synthesis, timing, DFT, floorplanning, physical design, signal/power integrity, packaging, and other back-end activities. Electronic Design Automation algorithm, tool, and methodology development Experience/knowledge in the field of Analog and mixed-signal IP design, test and evaluation with Bulk CMOS, BiCMOS, or SOI technologies. Good software background and strong C/C+ skill is a plus.3. Experience in one or some of the application domains, will be a plus Digital Media, Audio/Video Graphic and Gaming processing Digital signal processing and RISC Processor architecture Consumer Electronics applications Communication, Networking and wireless applications High Speed Interface/Serdes applications High performance computing (servers) chipset and ASICs Other emerging technology and industry areas4. Good English/communication skill and willingness to work with a global team. Skill of other languages will be a good plus.5. Good learning competency and be able to work in diverse areas in a flexible environment Required Bachelors Degree English: FluentChinese simplified: FluentIBM is committed to creating a diverse envir