软硬结合板简介及关键参数介绍ppt课件.ppt

Rigid FlexPresentation 2 Content MaterialIntroductionDesignruleStandardProcessFlowOpenDiscussion 3 1 軟板基材薄膜種類 聚脂樹脂 Polyester PET 尺寸熱安定性不如PI Aramid纖維布 高吸水性 單價及使用性並不理想 強化型介電材料 撓曲性較差且供應者與使用者不多 氟素樹脂膜 無法在高溫下維持尺寸的穩定 聚亞醯胺樹脂 Polymide PI 熱聚合後仍保一定柔軟與彈性 同時在很寬的操作範圍下有不錯電氣特性故最常使用 MaterialIntroduction 4 2 聚亞醯胺基材種類依軟板結構分為兩大類1 有接著劑三層軟板基材 3LFCCL 2 無接著劑二層軟板基材 2LFCCL 兩者分屬不同製造過程 製造方式與材料特性不同 3L應用在大宗軟板產品 2L用在較高階軟板製作上 例 軟硬複合板 COF 以單面板為例 高尺寸安定需求 高密度線路需求 耐化性需求 電氣特性需求 耐燃性需求 環保需求 2L FCCL 3L FCCL MaterialIntroduction 5 2 1 聚亞醯胺薄膜簡介聚亞醯胺薄膜 Polyimide 簡稱PI 外觀呈黃棕色 是由芳香族的雙酐類及雙胺類合成聚亞醯胺酸高分子 簡稱PAA 之後經高溫熱化脫水形成 2 2 品目型號說明各家標示項目不盡相同 以台虹3L FCCL為例 MaterialIntroduction 6 3 2L FCCL製造方式與比較 MaterialIntroduction 7 3 2L FCCL製造方式與比較 MaterialIntroduction 8 資料來源 JMS 工研院IEK ITIS計劃 2004 3 4 全球FCCL廠商3LFCCL 2LFCCL概況 表量產 表小量產 試產或送樣中 MaterialIntroduction 9 CVLCoverlay PIfilmAdhesiveReleasepaper MaterialIntroduction 10 Bondingmaterial1 PPPrepreg1 BSBondingsheet ReleasepaperAdhesivePETfilm Epoxy Glassfiber MaterialIntroduction 11 EMImaterial1 Silverfilm MaterialIntroduction 12 Content MaterialIntroductionDesignruleStandardProcessFlowOpenDiscussion 13 WorkingPanelSize PopularWorkingPanelSize B Usablearea Border A B andRoutingPath C PCBwith1 G FDesign2 Impedancecoupon DesignRule 14 Paneltype Panelsize OptimizedPanelUtilization DesignRule 15 Flexarea RigidArea TransitionZone RigidArea DesignRule 16 FCCL FlexCopperCladLaminateCVL CoverlayerStiffener FR4 PI StainlessbaseReinforcementLowflowPrepreg ResinscaleflowlowerthannormaltypeBS BondingSheetSF SilverFoil EMIshielding PartialCVL Componentonflex PlusII stackvia Squeezeout fromLowflowPrepreg Terms Definition DesignRule 17 Traceandcomponentpadattransitionzone DesignRule 18 G H RigidPCB RigidPCB F I Flexarea Mechanicaldesignattransitionzone DesignRule 19 Flexiblearea Mechanicaldesignattransitionzone DesignRule 20 Punchwithharddierequirement UMTsuggesttoplaceradius0 50mm Changefromrightangletoradius OnlyUVlasercuttingcanmakeitrightangle Before Before After After Mechanicaldesignforflexradius DesignRule 21 Radiusonly0 2mm Punchwithharddierequirement UMTsuggesttoplaceradius0 50mm Changefromrightangletoradius OnlyUVlasercuttingcanmakeitrightangle Before After Mechanicaldesignforflexradius DesignRule 22 UMTsuggesttomakethiswasteslotasmin 1 50mmwide 1 25mm Nominal2 00mmOrmin 1 50mm Before After Mechanicaldesignforflexoutline DesignRule 23 UMTsuggesttomakethesecornersasfullradius Keypoints Thequalityofappearanceinspectionforthesecornerswillbebetter Burr bothrigidandflexmaterialwillbelessthanpreviousdesign Before After Mechanicaldesignforflexoutline DesignRule 24 UMTsuggesttoplacetwopcsinzerodegreedirectionandtheothertwopcsin180degreerotation Y X KeyPoints Alloutlineshouldbesymmetrical Incl wastematerialslot Mechanicaldesignforpanelization DesignRule 25 Providetearresistance UMTsuggesttoplacerecessedslotatthetransitionzone KeyPoints Arecessslotwoulddecreasethestress Recommendedslotwidth Min 1 50mm Nominal 2 00mm Mechanicaldesignfortransitionzone DesignRule 26 Mechanicaldesignforbendingcriteria Radius Flexlength DesignRule 2020 1 29 27 可编辑 28 Content MaterialIntroductionDesignruleStandardProcessFlowOpenDiscussion 29 TYPE1 STANDARDPROCESS TYPE2 PMFPROTECTFLEX LASERCUTTING ForRemoveFR4 TYPE3 FR4PROTECTFLEX CONTENT TYPE1PROCESS Standard ForFlexWithoutEdgeFingerorSMTPads 31 Unimicron Unimicron TYPE1 A Stackup Structure3 2F 3 32 L45 FlexMaterial WaitforCombinationWithRigidmaterial CoverlayerMaterial Lamination FlexcorewithCVL CVL Cutting MechanicalDrilling I InnerLayer imagetransfer DESLine develop etch strip AOI automaticopticalinspection OxideTreatment P T H CopperPlating LaminateCutting TYPE1 B ProcessFlow Flex L4 L5 33 L36PlusIProcess ConformalMask imagetransfer DESLine develop etch strip AOI automaticopticalinspection Ply UpOfLayer Lamination L45 core Blind CopperPlating LaserDrilling BlaserAOI InnerLayer imagetransfer DESLine develop etch strip AOI automaticopticalinspection OxideTreatment WaitforBuilduptoL27 NonflowPrepregMaterial PrepregRouting TYPE1 B ProcessFlow Rigid Flex L3 L6 PlusI 34 L27PlusIIProcess ConformalMask imagetransfer DESLine develop etch strip AOI automaticopticalinspection Ply UpOfLayer Lamination L36 core Blind CopperPlating LaserDrilling BlaserAOI InnerLayer imagetransfer DESLine develop etch strip AOI automaticopticalinspection WaitforBuilduptoL18 NonflowPrepregMaterial PrepregRouting OxideTreatment TYPE1 B ProcessFlow Rigid Flex L2 L7 PlusII 35 L18PlusIIIProcess LayUp Lamination L27 core ConformalMask imagetransfer DESLine develop etch strip AOI automaticopticalinspection P T H CopperPlating MechanicalDrilling I LaserDrilling BlaserAOI OuterLayer imagetransfer DESLine develop etch strip AOI automaticopticalinspection SolderMask ImmersionGold Routing HardDiePunching O STesting OQCPacking Shipping NonflowPrepregMaterial PrepregRouting TYPE1 B ProcessFlow Rigid Flex L1 L8 PlusIII TYPE2PROCESS PMFProtectProcess ForFlexWithEdgeFingerorSMTPads 37 Unimicron Unimicron TYPE2 A Stackup Structure1 1 2F 1 1 38 L34 FlexMaterial ToolingDrill LaminateCutting InnerLayerL3 L4 imagetransfer DESLine develop etch strip AOI automaticopticalinspection WaitforCombinationWithRigidmaterial CoverlayerMaterial Lamination FlexcorewithCVL CVL Cutting Pumice StiffenerMaterial StiffenerShearing Lamination Flexcorewithstiffener PMFMaterial PMFShearing Lamination FlexcorewithPMF Baking LaminationFlexcorewithPMF Plasma BrownOxide B ProcessFlow Flex L3 L4 TYPE2 39 BuildUpL2 L5 PlusI WaitforBuilduptoL1 L6 PPCutting Lamination withflexcore BlaserAOI MechanicalDrill L2 L5 PlugviaburiedviaL2 L5 Scrubbing InnerLayerL2 L5 imagetransfer AOI automaticopticalinspection ConformalMask imagetransfer DESLine develop etch strip AOI automaticopticalinspection LaserDrilling L2 L3 L4 L5 P T H CopperPlating DESLine develop etch strip B ProcessFlow Rigid Flex L2 L5 PlusI TYPE2 40 L1 L6Process Layup Lamination ConformalMask imagetransfer DESLine develop etch strip AOI automaticopticalinspection L25 buildupI CopperReduction bychemical Electro plating filledvia LaserDrilling L1 L2 L5 L6 BlaserAOI MechanicalDrill P T H CopperPlating OuterLayerL1 L6 imagetransfer DESLine develop etch strip AOI automaticopticalinspection Routing 2 O STesting OQCPacking Shipping SolderMask ImmersionGold Routing 1 Removerigidwasteareaaboveflexarea PSFLamination coverrigidarea Platinghardgold fingeronflex RemovePSF FlexPunch PProuting B ProcessFlow Rigid Flex L1 L6 PlusII TYPE2 LASERCUTTINGDIAGRAM 42 LASERCUTTINGDIAGRAMFORCAPREMOVAL Step1 TransitionLine TransitionLine Step2 Step3 Laserstop target copperdesigninL2 5 LaserDrillfromtoptoL2 bottomtoL5EtchawaytargetcopperinL2 5 RemoveFR4capaboveFlexalongwithlasercuttingpath TYPE3PROCESS FR4ProtectProcess ForFlexWithEdgeFingerorSMTPads 44 TYPE3 A Stackup Structure2 2F 2 45 B ProcessFlow Flex L3 L4 L34 FlexMaterial MechanicalDrilling I P T H CopperPlating LaminateCutting InnerLayer DES imagetransfer AOI automaticopticalinspection OxideTreatment WaitforCombinationWithRigidmaterial CoverlayerMaterial Lamination FlexcorewithCVL CVL Drilling LaminationFlexcorewithCVL CVL Punch TYPE3 46 B ProcessFlow RigidInnerCore RigidInnerCoreProcess WaitforBuilduptoL25 BondingSheetMaterial BS Drilling Coredrilling LaminateCutting InnerLayer DES imagetransfer AOI automaticopticalinspection CORE Cutting SoftBonding CorewithBS BS Punch TYPE3 47 B ProcessFlow Rigid Flex L2 L5 PlusII L25Process Lamination FlexwithRigid MicronviaCopperPlating InnerLayer DES imagetransfer L2 L5 AOI OxideTreatment WaitforBuilduptoL16 Rigid Rigid ConformalMask imagetransfer DESLine develop etch strip AOI automaticopticalinspection LaserDrilling L2 L3 L4 L5 RigidcoreLaminatewithFlexcore PRESS TYPE3 48 B ProcessFlow Rigid Flex L1 L6 PlusII L16Process Layup Lamination LaserDrilling L25 core P T H CopperPlating Drilling OuterLayer DES Imagetran