PCB及PCBA缺陷中英文对照表.doc

PCB及PCBA缺陷中英文对照表PCB及PCBA缺陷中英文对照表1板面凹痕 dent 41漏印字符 skip2内层白斑 I/L white spot 42金粗 Au too big3线路缺口 circuit nick 43金簿 Au too thin4蚀刻不净 undering etching 44金手指缺口 G/F voids/nick on G/F5绿油剥离 S/M peel off 45金手指发黑 G/F too black6显影不净 under developing 46字符印反 inverse C/M7基 材 白 点 laminate measling 47金手指针孔 G/F pinholes8铜面氧化 copper oxide 48标志不清 symbol unclear9绿油上焊盘 s/m on pad 49标志错 symbol wrong10白字上焊盘 c/m on pad 50绿油鬼影 ghost in S/M11阻焊不良 poor S/M 51手指印 finger print12线路擦花 track scratch 52补线不良 poor line repairing13锡上线 sn on circuit 53锡高 exessive solder14聚锡 sn mass 54孔小 hole undersize15锡灰 sn gray 55字符错 wrong C/M16焊盘露铜 cu exposed on pad 56字符印偏 C/M misalignment17锡上金手指 sn on G/F 57字符入孔 C/M in hole18金手指凹痕 G/F dent 58字符 重影 C/M doubloe image19金手指擦花 G/F scratch 59漏镀金手指 missing plating G/F20金手指粗糙 G/F roughness 60金手指发白 G/F gray21v-cut不良 poor V-cut 61焊盘脱落 pad break off/pad peel off22倒边不良 poor milling 62焊盘露铜 pad expose cu23针床压伤 ET dent 63断绿油桥 missing S/M bridge24拖锡不良 poor touch up 64塞孔 block hole25补金不良 poor repairing Au 65水迹 water print26补油不良 poor repairing s/m 66锡珠 solder ball27针孔 pinhole 67砂孔 pitting28胶渍 paster stain 68油薄 S/M too thin29k孔内毛刺 burrs in hole 69聚油 excess solder mask30锡珠入孔 solder in hole 70锡粗 Sn too thick31露铜 expose Cu 71线路上锡 Sn overlap scratch32露镍 expose Ni 72绿油下杂物 contamination under S/M33绿油起泡 solder mask blister 73焊盘损坏 land damage34绿油起皱 solder mask winbles 74焊盘翘起 lifted land35金手指氧化 G/F oxiding 75偏位 misregistration36金颜色不良 Au discoloration 76漏钻孔 missing hole37金面凸起 Au surface blister 77焊盘缺口 nick on pad38绿油入孔 solder mask in hole 78线路缺口 nick on track39爆板 board angle damafe 40翘板 warp 1开路 open circuit 46焊 盘 翘 起 lifted land2短路 short circuit 47漏 钻 孔 missing hole线路狗牙 circuit wist 48露 布 纹 weave exposure3线路缺口 circuit nick 49钻 偏 孔 hole misregistratiion4线路凹痕 circuit dent 50孔 损 害 hole damage5渗镀 plating Bloody 51基 材 分 层 delamination6焊盘缺口 pad nick 52蚀 刻 过 度 over etching7内层白斑 I/L white spot 53多 孔 hole too much8黑化不良 poor B.O 54残 铜 remain Cu9爆板 measling 55孔内露基材 laminate exposure in hole10粉红圈 pinking ring 56焊 盘 脱 落 pad break off11层压起泡 press blister 57焊 盘 凹 痕 pad dent12错位 misregistation 58焊 盘 凸 起 pad bulge13偏位 shift 59焊 盘 损 坏 pad damaged14孔内无铜 no Cu on Pth 60焊 盘 缺 口 pad nick15孔内毛刺 hole burrs 61焊 盘 露 铜 pad expose Cu16NPTH有铜 Cu on NPTH 30修理不良 poor repairing17铜面露基材 exposed laminate 31铜薄 copper too thin18铜面凹痕 dent on Cu surface 32内层擦花 I/L scratch19胶渍 gum residue 33内层偏位 I/L misregistation20夹膜 D/F nip 34内层杂物 I/L inclusions21蚀刻不尽 under etching 35掉膜 film off22线幼 line too thin 36干膜碎 D/F meaking23孔大 hole oversize 37退锡不尽 poor Sn stripping24孔小 hole undersize 38间隙小 space too marrow25偏孔 hole misregistration 39板薄 board too thin26铜面瘤粒 Cu nodule 40板厚 board too thickness27显影不尽 under developing 41针孔 pinhole28铜面刮伤 scratch on Cu surface 42崩孔 breakout29塞孔 hole plugged 43侧蚀 undrcut45亚色 dull colour 44镀层粗糙 plating layer roughnessPCB及PCBA常用度量衡单位换算所属目录：FASTPCBA靖邦公司资料 发布时间：2009-01-011英尺=12英寸1英寸inch=1000密尔mil1mil=25.4um1mil=1000uin mil密耳有时也成英丝1um=40uin（有些公司称微英寸为麦，其实是微英寸）1OZ=28.35克/平方英尺=35微米H=18微米4mil/4mil=0.1mm/0.1mm线宽线距1ASD=1安培/平方分米=10.76安培/平方英尺1AM=1安培分钟=60库仑 主要用于贵金属电镀如镀金1平方分米=10.76平方英尺1盎司=28.35克,此为英制单位1加仑(英制)=4.5升1加仑美制=3.785升1KHA=1000安小时1安培小时=3600库仑比重波美度=145-145/比重SG.SG.比重（克/立方厘米）=145/（145-波美PCB及PCBA行业专用名词PCB及PCBA行业专用名词BOM(Bill of material) 物料需求單Laminate 基板Copper foil 銅箔Solder mask(s/m) 防焊Bare Board 空板Microetching 微蝕Exposure 曝光Dry Film 干膜Matte side 毛面Rcc(Resin coated copper) 背膠銅箔Final shaping 成型Electrical test(ET) 電測Visual Inspection 外觀檢查Gold Finger(G/F) 金手指Legend 文字Post Cure 后烤Desmear 除膠渣Developing 顯影Pattern Plating 線路電鍍Panel Plating 全板電鍍Puddle Effect 水坑效應Oxide Coating 黑氧化Routing Bit 銑刀Tolerance 公差Post Treatment 后處理Adhesion 附著力Stripping 去膜Baking 烘烤AQL(acceptable quality level) 品質允收水準Optical Target 光學靶點Lay up 疊合Chromation 鉻化處理Undercut 側蝕Microvia 微孔Annular Ring 孔環Burr 毛頭Entek 有機保焊處理Conformal Mask 銅窗Drum Side 光面Diazo Film 偶氮棕片Cut Lamination 下料Sheets Cutting 裁板Inner Layer Drilling 內層鑽孔Outter Layer Drilling 一次孔2nd Drilling 二次孔PCB及PCBA专用名词Laser Drilling 雷射鉆孔Blind&Burried Hole Drilling 盲(埋)孔鉆孔screen printing 網版印刷silk screen 絲網印刷scum 透明殘膜skip printing 跳印 漏印squeege 刮刀type 种類abietic acid 松脂酸air knife 風刀bridging 搭橋 橋接flux 助焊劑product process 制程pre-process 制前solder bridge 錫橋soler bump 錫突solder plug 錫塞immersion gold 浸金(化金)thin core 薄基板twist 板翘, 板扭warp ,warpage 板彎weave eposure 織紋顯露wicking 燈蕊效應yield 良品abrasion resistance 耐磨性absorption 吸收accelerated test 加速實驗acceleration 速化反應accelerator 加速剂batch 批cold solder joint 冷焊點component side 零件面double side 雙面double side board 雙面板fiducial mark 基準記號finished board 成品板lot size 批量rack 掛架register mark 對準用標記solder side 錫鉛面thickness 厚度warehouse 仓库wet process 濕制程Beveling 斜邊chamfer 道角dimension 尺寸Fixture 治具interconnection 互相連通line space 線距line width 線寬misregistration 對不准mouse bite 蝕刻缺口nick 缺口master drawing 主圖print and etch board 印刷後及蝕刻後板crease 皺褶dent 凹陷glass fiber 玻璃纖維布pin hole 針孔pit 凹點target hole 靶孔PCBA及PCB专用名词(二)PCBA及PCB专用名词(二)Black Oxide Removal 黑化還原Plug Hole 塞孔Ink Print&precure 印刷及預烤Scrub 表面處理Spray Coating 靜電噴涂Printing of Legend 文字印刷Pumice ( Wet Blasting) 噴砂Immersion Ni/Au(Electoless Ni/Au) 浸鎳金Hot Air Solder Leveling 噴錫N/C routing 撈型Beveling of G/F 金手指斜边Cleanning&Baking 清洗及烘烤Fixture Testing 治具測試original A/W 客戶原稿working A/W 工作片working master 工作母片carlson pin 定位梢component hole(30mil) 零件孔drill facet 鑽尖切削面drill pointer 鑽尖重磨機drilled blank board 已鑽孔的裸板hole diameter 孔徑hole location 孔位hole number 孔數lay back 刃角磨損margin 鑽頭刃帶open circuits 斷路runout 偏轉slot 開槽spindle 鑽軸tooling hole 工具孔stacking structure 疊板結構blow hole, void in PTH hole 吹孔 孔破deburring 去毛頭electroless-deposition 無電鍍化etchback 回蝕air inclusion 氣泡chase 網框fabric 網布liquid 液態狀mealing 泡點trim line 裁切線v-cut v型切槽golden board 標準板back lig