ASM-809固晶机操作手册2.doc

AD809-06 Operation ManualChapter 4 Control Function & Parameters第4章 控制功能及參數主操作表:AD809共有八個主要模式。按ADV或RTD鍵進行選擇及在選取項目後按ENTER確定選擇。按鍵盤上的MODE鍵後, 如下的操作表會顯示在屏幕下方。AUTOSETUPPARASERVDIAGWHPARTCHPCBALNPCB按ADV或RTD鍵選取項目後按ENTER執行。其中:AUTO= 用於執行 “AUTO Mode” 功能SETUP=用於執行 “SETUP Mode” 功能PARA=用於執行 “PARAMETER Mode” 功能SERV=用於執行 “SERVICE Mode” 功能DIAG=用於執行 “DIAGNOSTIC Mode” 功能WHPAR=用於執行 “WORKHOLDER Parameter” 功能TCHPCB=用於執行 “TEACH PCB” 功能ALNPCB=用於執行 “ALIGN PCB” 功能4.1 AUTO Mode (自動模式)模式操作表#項目說明Auto0Auto Bond根據已編寫的焊點程式執行自動焊點。按下列的鍵可trigger不同的功能。 - 轉換攝像機的觀察位置 - 立刻停止焊接- 停止焊接現時正在進行焊接的管芯1Single Cycle Bond只焊接一個管芯。這項功能用於焊接測試。焊點會被更新為焊接The bond point will be updated to the bond target position if you use IQC inspection.2Unload wafer當這項功能被triggered時, 會自動地卸除芯片, 載入新的芯片, 對準芯片角, 對準芯片XY位移, 到達第1粒管芯, 計算新的行程路徑方向及檢查管芯尺寸。3Wafer PRS啟動或關閉芯片工作台上的圖像識別系統功能。預設值為ENABLE。4Manual Align PCB用控制桿瞄準對準點後按ENTER。屏幕會顯示出PCB (X,Y) MALN 1, 表示在X行及Y列上輸入PCB 的第1對準點。5Edit Bond Pt編輯或修正焊點位置, 用控制桿移動瞄準, 然後按ENTER設定。6Goto Bond Pt直接鍵入PCB上的指定焊點。7Epoxy Offset當銀漿點偏離於焊點時, 用於修正焊接位置。必須按序分別輸入焊點及銀漿點以使機器知道銀漿偏距。8Miss Die Check啟動或關閉在進行自動焊接時的漏晶檢查功能。9Replace picked Die若機器在按STOP後停止操作時, 用於啟動或關閉更換管芯功能。4.2 SETUP Mode (設定模式)模式操作表#項目說明Setup0Bond ArmThe bondarm set-up is to define and teach the proper position of the bondarm during bonding to ensure smooth operation and better placement accuracy.0Pick PositionThe pick position is the position where the bondarm stops after swinging in theta motion from bond position before it goes down to pick level to pick die. The range value is -36 to -40.1Prepick Position靠近拾取位置的焊臂位置, 但不能妨礙芯片圖像識別系統的攝像機。2Blow Position當向外吹氣時的焊臂位置。3Miss Die Position用於漏晶探測時調校及定義焊臂位置。4Prebond Position靠近焊接位置的焊臂位置。5Bond Pos焊接管芯到PCB上的焊臂位置。6Unload Car Position當按ADV或RTD載入載具時用於定義焊臂位置。步數可調。預設值是301。1Bond Head執行焊頭參數數據輸入功能。0Head Home Level 焊頭在原位高度時的位置。1Pick Level拾取管芯時的焊頭位置。3Bond Level按ADV或RTD定義焊頭在焊接時的高度。步數可調。預設值是525。4Replace Die焊頭放管芯回芯片上的高度。放回管芯的高度通常低於拾取高度(數值會增大)。#Wafer Set只用於AD809M-06多個芯片。3Wafer Table用於執行芯片工作台設定功能。0Show Wafer Centre移動芯片工作台到芯片中心。1Teach Wafer LimitTo set the wafer limit based on the outside actual dimension of wafer shape, the wafer could be circle or polygon.If wafer shape is set to Circle, 3 points on the wafer edge need be located for defining the circle as in the following diagram.If wafer shape is set to Polygon, use the joystick to locate the points on the edge of the wafer then press ADV every time a point is identified and finally press ENTER for the last point. Different polygon shapes of wafers are illustrated on the following sketch.2Teach Start PosnTo define the position of the bond head to start to pick a die.3Teach Load PosnTo define the loading position of the wafer table after bonding by using the joystick to locate the position.4Teach PitchTo calculate the distance between 2 dice by using the joystick to move each die to fit with the cursor of the monitor and then press ENTER.5Edit Polygon VertexThis is to edit polygon wafer programming only. It offers the user to edit the wafer limit.6Show Wafer LimitIt shows the margin of the programmed wafer area.7Wafer PRSThis provides option to the user to enable or disable the PRS on some occasion.4Wafer PRSThis provides option to the user to Edit the PRS Parameter on some occasion.0Adjust Video LevelUsing ADV or RTD to adjust the digitized picture so as to make a recognizable clear pattern on the monitor.1Load ReferenceThis function is applied after the die is placed. PR reference can be loaded after the lighting is adjusted and following by selecting the search range. Finally, the calibration will be done by the PR system.2Adjust Search RangeTo define the searching area by pressing ADV or RTD. Search area should be set to the maximum size which should only contain one whole die.3CalibrationTo do calibration for the PR system.4Search AlgorithmThere are 2 kinds of searching algorithm, (street and template). For template method, there are a total of 10 kinds of templates. This searching method is to compare the pattern within the template. The street method is to compare the space around a die.5Chip/Ink RejectThere are a total of 3 digits in the display. The first digit is for chip die and the third digit is for ink die. The value of the digits is from 0 to 9. The bigger the value, the stricter the requirement of an accepted die. The 2nd digit is always a 0. The default is 206.6Angle Acceptance(+/-)The rate of die rotation on the wafer to be picked-up. Die rotated outside the pre-set value will be skipped.7Search DieTo search a die on the wafer, whether it is rotated, inked or good die.8Pattern Die Search CodeThe code can be set to either 0 or 2. Numeric value 0 is for searching good and inked die, while 2 is for the test and blank die. The default setting is 0.9Clear All PR ReferenceThis is to clear all the reference of the PR stored in the program.5WorkholderSet-up of some functions of workholder related to controller side.0Teach Unload PCB PosnTo define the unloading position of the PCB or workholder table after bonding completion of substrates. This position serves also as the loading position of new carrier or substrates to be processed. 1Measuring RulerTo measure the distance between any 2 points on the workholder side, i.e. pitch of bond points, reference alignment points distance, etc.2ADV PCBTo move the table to the next PCB.3Home PCBTo move the workholder table to the first PCB alignment point.4RTD PCBTo move the table back to the preceding PCB.5Epoxy OffsetRefer to Chapter 3.56Home PCB TableThis function can be used to home the workholder table.6EjectorTo perform ejector parameter data entry function.0Ejector typeThis function is optional. For smaller dice i.e. LED, ordinary is chosen, while composite type is selected for bigger dice. This type should be selected only if the ejector assembly is for composite.1Ejector Home LevelThe home level position of the ejector.2Ejector Up LevelThis level will totally free up the die from the mylar tape adhesion. The height of the ejector pin should be about one die thick at this level.7Ejector ValveTo Enable or Disable the ejector cap vacuum8Collet VacuumTo Enable or Disable the collet vacuum9Epoxy Drum SoleNot capable for standard AD809-06 machine4.3 BOND Parameter (焊接參數)ModeMenu #TitleDescriptionPara-meter0Delay Menu用於執行延遲參數數據輸入功能。0Arm Pick DelayTo specify the time delay just after the bonding process has been completed and before the bond arm starts to rotate to pre-pick position. The default value is 20.1Head Pick DelayTo specify the time delay just after the bond arm reaches the pick position and before it will reach the pick level. The default value is 70.2Eject Up DelayTo specify the time delay just when the bond head stops descending and before the ejector start rising up. The default value is 20.3Pick DelayTo specify the time for the bond arm to remain at pick up level after the ejector up and return to its home position. The default value is 50.4Arm Bond DelayTo specify the time delay just after the picking process has been completed and before the bond arm starts to rotate to pre-bond position. The default value is 20.5Head Bond DelayTo specify the time delay just after the bond head reaches its bond position and before it goes down to reach the bond level. The default value is 60.6Bond DelayTo specify the time delay for the bond arm to remain at the bond level before going up. The default value is 50.7PR DelayTo specify the time delay when the X-Y Table stop and before PR system starts to recognize a pattern. The default is 70.8Index WH DelayDelay after die bonded on the substrates and the w/h table starts to index.9Wblow On DelayThe duration for weak airflow blow from the collet before the bondhead rises from bond level to home level.1Set Motor SpeedsThis is to perform the profile parameters of the respective motors. Optionally, a password is required to access this information.0Bond Arm焊臂馬達驅動q運動The bond arm motor drives the theta motion of the bondarm itself.1Bond head Up焊頭可作兩種運動, 上升及下降。The bond head is divided into two motions, up and down. Separate profiles are available to each motion.2Bond head DownThe down profile may be slower than up motion to prevent excessive vibration when collet is in contact with the die.3EjectorFor sensitive die, slow speed for ejector may avoid die from cracking or breaking.4Table XX軸馬達的速度。5Table YY軸馬達的速度。6Password用於封鎖控制器參數及馬達速度狀態。4.4 SERVICE Mode (輔助模式)ModeMenu #TitleDescriptionService0Format New Disk將新磁碟格式化。1Save Controller Param儲存控制器參數到已格式化的磁碟。2Restore Controller Param開啟在磁碟內的控制器參數。3Save WH Param儲存工作夾具參數到磁碟。4Restore WH Param開啟在磁碟內的工作夾具參數。5Print Controller Param列印參數表到配有RS-232介面的印表機。6Print Statistics列印焊接統計表到印表機。7Show Statistics顯示由某個指定時間至最後焊接單元的總工作時間、總停機時間、平均週期時間、總產量、印墨管芯計數、裂片管芯計數、不能成功拾取和吸咀阻塞計數的統計結果。8Clear Statistics用於清除統計記錄。9Set Date and Time按ADV或RTD鍵設定日期及時間, 然後按ENTER。4.5 DIAGNOSTIC Mode (診斷模式)模式操作表#項目說明DIAG0Test Bond用於執行測試焊接工序。1Select Test Modules用於選擇不同模件在所有模式中執行功能與否。用ADV或RTD鍵選擇需要的項目後按ENTER鍵。(用於啟動或關閉下列的測試項目: 焊臂、焊頭、頂針系統、芯片工作台、工作夾具及閥門。2Miss Step Records用於顯示焊臂、焊頭、頂針系統、X工作台及Y工作台的失步記錄。要重新計算, 按ENTER。3Single Step Test用於啟動或關閉逐步執行的測試焊接工序。預設值是Disable4Video Test用於啟動或關閉顯示數字化圖像識別圖案的視頻模式功能。預設值是Disable。4.6 WH PARAM (工作夾具參數)ModeMenu #TitleDescriptionWH Param0Table Parameter Menu提供選項編輯工作夾具參數。0Table SpeedTo specify the table speed of the work holder by pressing ADV or RTD keys. There are a total of 5 different kinds of speed, from A to E. Where E is the fastest and A is the slowest speed. The default value is C.1Table Joystick SpeedTo change the workholder table joystick speed for minimum motion.2Table TolTo specify the maximum deviation of distance of two alignment points (to be recognized by the PR system). The default value is 15.3Table Delay設定工作夾具攝像機在穿梭到其他行時等候的延遲時間To set the delay time for the WH camera to wait before shuttling to the other rows.4WH DelayTo specify the time delay between the first PCB inside the carrier and the activation of PRS. The default value is 200.1PR DelayTo specify the time delay when the work holder stops and the PR system starts recognize the pattern. The default value is 30.2Single CarrierTo enable or disable the function of the work holder as a single carrier. The default value is Disable.3Home In-Car TableTo enable or disable the function of the workholder to home position first after carrier is loaded during loading4Edit In-Sub PosnTo enable or disable the function of bond pausing before PR search for workholder after carrier is loaded. In case the PCB PR pattern is always beyond PR tolerance. Then PR alignment point can be manually adjusted during pausing of bonding5Check Missing StepsTo show the number of the missing steps of the PCB table-X and PCB table-Y. The counter could be reset by pressing the ENTER key.6Print W/H ParameterTo print out the W/H parameter only when the switch of the printer port is turned into “W/H”.7Epoxy Disc StepsTo specify the number of steps of epoxy disc movement after bonding a die. The default value is 130.4.7 Teach PCB Program (編寫PCB程式)ModeMenu #TitleDescriptionTCH PCB0Teach PCB Program執行PCB編程。0Change Carrier移動工作夾具載具到卸除位置以便更換其他PCB。1No. of Sub-CarSpecifies the number of sub-carriers in one pass. Sub-carriers are carrier with a group of PCBs. Maximum of two sub-carriers in one program.2Edit Align Pts執行編輯對準點功能。0Edit Alignment Points編輯或編寫圖像識別系統對準點。0PR Load Reference用於載入基準或PCB的對準點到圖像識別系統。1Home PCB移動工作台到首個PCB的首個圖像識別對準點。2ADV前進到下一個PCB。3Align Select當選取了對準選擇後, 會切換到圖像識別對準操作表。4RTD後退到先前的PCB.5PR VideoTo adjust the threshold value of the selected PR alignment point.6PR Range / Template用於調校適當的範圍, 模板圖形及尺寸。7PR Calibration輸入所有參數後執行校準。8PR SearchTo search for the alignment points whether the data entered is good or rejected.9PR ToleranceTo adjust the PR search image acceptance level.3Edit Bond Pts用於執行編輯焊點功能。0Edit用於編輯管芯及選項To edit the die and option is given to change to a new position.1Die #To move to a die position according to the number entered.2ADV用於前進到下一個管芯。3Delete用於刪除使用者希望從程式中刪除的焊點。4RTD用於返回先前的焊點。5Insert這項功能允許使用者在完成程式後增加或插入管芯。This function allows the user to add or insert a die even after completing the program. This is also use for individual programming where bond points is entered into the program point-by-point.#Wafer no.(WH pgm num)這項功能只適用於AD809M-06多個芯片的機器。7Group pattern這是把多個組別的焊點組合為一個組別的編程方法, 用於取代單獨輸入焊焊。8Repeat PatternThe grouped pattern can be repeated into number of PCBs or rows and col