SMT钢板设计指引(01).doc

General Work Instruction 通用工作指示Title標題Stencil Design Guidelines鋼板設計指引Doc No.文件編號:FDMEI-009Revision 版本:1Page 頁碼:第 10 頁,共 10 頁 Revision History 版本記錄Rev.版本Change Description 修改內容Originated By編寫Date日期1New ReleaseXiejiangfengSept12, 2004Approval & Distribution 審批&分發APP審批DIST Dept.分發 部門No. Qty編號 份數Signature/Date簽署/ 日期APP審批DIST Dept.分發 部門No. Qty編號 份數Signature/ Date簽署/ 日期生產部PRD 01 培訓部 T&D 10 _ VV質檢部QA 02 _1_電腦部 MIS 11 _ VV制造工程ME 03 _1_項目部 PM 12 _物料部 MAT 04 _會計部 FIN 13 _V產品工程 PE 05 _新品導入 NPI 14 _ VV設備部EQU 06 _1_品質管理系統QMS 測試部TE 07 _管理代表 MR 廠務部 FE 08 _人事部 HR 15 _工業工程 IE 09 _總經理 GM 16 _Other Distribution Location : Checked by (Doc. Con.) : _ Effective Date : _Confidential & Proprietary Information of Flextronics. 偉創力機密及專利文件1. PURPOSE目的: To set up a general standardization for design stencil to improve stencil design rate and assure its quality.建立鋼板設計的通用標準,提高網板設計的效率,保證鋼板設計的質量.2. SCOPE範圍: It describes some of the guidelines used in Flextronics Dongguan in designing solder paste stencils.適用東莞偉創力開刻的鋼板均.3. DEFINITIONS定義: In Flextronics Dongguan most of the stencils are lasercut and electro-polished stencils made of stainless steel. 東莞偉創力大多數是由鐳射切割和電抛光製成的不銹鋼鋼板。4. RESPONSIBILITIES權責: ME engineers should refer to this instruction while design stencil except special case such as customers request. For not mentioned components and abnormal ones, other related standardization or practical experience should be refered.ME工程師在製作新鋼網時有責任參考此標準（特殊情況除外,如客戶要求等）,標準末提及的元件及其它異型元件,可依照其實相關標準或已經驗證之經驗進行.5. REFERENCE DOCCUMENT 參考文件:IPC7525 Stencil Design Guidelines IPC7525鋼板設計指引6.PROCEDURE程序:6.1 Detailed designing rules設計細則General Aperture Design position must be in stencils center. Stencils dimension depends on SMT printer type .SMT printer type include MPM&DEK. The compatible stencil dimensions is 736736mm& 680650mm.Dimension of external frame of stencil is 40x40mm.As below is stencil design guidelines. 開刻的位置必須在鋼板的中心位置鋼板的尺寸大小由SMT印刷機機型所決定.SMT印刷機機型有MPM&DEK,其所相容的鋼板尺寸大小為736736mm&680650mm兩種.鋼板外框厚度為40x40mm. 以下是鋼板開刻指引736X736mmCenter24” 6.1.1. General Aperture Design Guidelines for Surface-Mount Devices.在一般元件中有以下幾種開刻方式和尺寸:元件類型PITCHPad 寬度Pad 長度開口寬度開口長度鋼板厚度縱橫比面積比0201N/A0.25mm0.40mm0.23mm0.35mm0.075-0.125mmN/A0.66-0.890402N/A0.50mm0.65mm0.45mm0.6mm0.125-0.15mmN/A0.84-1.000603N/A0.8mm0.8mm0.7-0.8mm0.7-0.8mm0.15-0.18mmN/A0805N/A1mm1.2mm0.8-1mm1-1.2mm0.15-0.18mmN/A1206N/A1.4mm1.6mm1.2-1.4mm1.4-1.6mm0.15-0.18mmN/APLCC1.27mm0.65mm2.00mm0.6mm1.95mm0.15-0.25mm2.3-3.80.88-1.48QFP0.65mm0.35mm1.50mm0.3mm1.45mm0.15-0.175mm1.7-2.00.71-0.83QFP0.50mm0.25-0.33mm1.25mm0.22-0.25mm1.2mm0.10-0.125mm1.7-2.00.69-0.83QFP0.40mm0.25mm1.25mm0.2mm1.2mm0.10-0.125mm1.6-2.00.68-0.86QFP0.30mm0.20mm1.00mm0.15mm0.95mm0.075-0.125mm1.5-2.00.65-0.86BGA1.25mm0.80mm0.8mm0.75mm0.75mm0.15-0.20mmN/A0.93-1.25uBGA1.00mm0.38mm0.38mm0.35mm0.35mm0.115-0.135mmN/A0.67-0.78uBGA0.50mm0.30mm 0.3mm0.28mm0.28mm0.075-0.125mmN/A0.69-0.92Flip chip0.25mm0.12mm0.12mm0.12mm0.12mm0.08-0.1mmN/AFlip chip0.20mm0.10mm0.1mm0.1mm0.1mm0.05-0.1mmN/AFlip chip0.15mm0.08mm0.08mm0.08mm0.08mm0.025-0.08mmN/A 6.1.2. General Aperture Design Guidelines for Chip components such as Resistors and Capacitors 一般片狀元件如電阻電容的開刻 Oblong Aperture Design Aperture Design for MELF Components 6.1.3. For leaded SMDs,e.g; J-leaded or gull-wing components with 0.41.3mm pitch,the reduction is typically 0.030.08mm in width and 0.05-0.13mm in length.SOJ 和SOP的IC腳PIN的開口方式為0.41.3mm的PITCH在寬度上減少0.03mm0.08mm.長度上減少0.05mm0.13mm.6.1.4. Plastic BGAs Reduce circular aperture diameter by 0.05mm or 10%.塑膠BGA的開口方式為收縮0.05mm. 或10%.6.1.5 Fine pitch QFP Reduce circular aperture diameter by 1015% in width and 100% in length.密腳IC：寬收縮1015%,長開100%.6.1.6 Ceramic BGAs Increase circular aperture dimension by 0.050.08mm.Pad sizeAperture size 陶瓷BGA的開口方式爲：在原有BALL的基礎上增加0.050.08mm6.1.7 On the other hand, for fine pitch BGA (FBGA) and CSPs with less than 13 mil pad diameter, square apertureswith 24 mil radius corners are normally usedAperture with radiused cornersPad 另一方面，對焊盤直徑小於13mil的細間距的BGA（FBGA）和CSP,通常使用增加24mil的角的方形開孔方法。6.1.8For square pads, most apertures will have radiused or mitered corners to aid paste release or prevent solder balls. 對方形的焊盤,將四個角內縮以防有錫球如下圖Square PadAperture with radiused corners 6.1.9. Laser cut and electro-polished stencils will normally have tapered aperture walls to aid paste release.鐳射加電抛光開孔的鋼板通常開尾追形孔壁來幫助錫膏的釋放。Tapered aperture walls6.1.10.If there are too many sharp corners, especially for small apertures, then stencil cleaning will be extremely difficult. Hence, some apertures may take slightly different shapes or have radiused corners to aid stencil cleaning. 如果有太多尖角特別是細縫，將給鋼板的清洗帶來特別的麻煩，則有些採用輕度的改變形狀或圓形角的開孔方法。Radiused corners or oval shaped aperturesPad with sharp cornersProcess Window for Intrusive Soldering6.1.11. LLP Aperture: Metal stencil Laser cutting, Thickness 0.13mm (5mil)Stencil : Metal stencil, Laser cuttingThickness : 0.13 mm ( 5 Mils)LLP腳按 100%開孔,但向外平移 0.1mm中間接地部分大於 2x2mm 時開成2x2 且 其 += 0.2mm;外圍四邊縮小0.15 mm , 小 於 2x2 時,按 面 積 的 90% 開 孔 LLP的開孔：金屬鋼板加鐳射開孔，厚度爲0.13mm（5mil）。6.1.12. Making Fiducials基準點的開法All stencil should have mark point and it should be located on bottom side with half-etched and filling disposal by black epoxy pitch at plating mode. Generally speaking, there are 2-3 mark points.Fiducials that are placed near critical compoment such as Fine Pitch BGA,QFP. 所有的網板應刻有基準點,基準點應於鋼網的底面半蝕刻,並用電鍍方式用黑色環氧樹脂填充處理.一般爲2-3個基點.在Fine pitch BGA,QFP的貼裝位的對角須開Mark. 6.1.13. Sign標識刻印While making stencil, related information should be etched on left-down corner of top side. Characters area should be more than 2X2mm for distinguishing. 製作鋼網時,應該在鋼網的正面左下角刻印如下內容,如有必要,亦可加上其他標記.爲了便於辨別,字母的面積必須不小於2x2mm. Customer: Model: Side: Thickness: Date: PCB: Rev Flextronics (Dongguan) Co.,LTD6.2 .Stencil Thickness:鋼板厚度This stencils thickness is decided on pitchs value of fine pitch component and making mode. The following sheet is reference for choosing proper stencils thickness: 印錫鋼網的厚度主要取決於板上細間距元件的PITCH值及鋼網製作方式，下表是一般選擇鋼網厚度的參考標準：Pitch ( mm)Chemically Etched (mil)Laster Cut (mil)Electroformed(mil)1.270 (50 mil)8 108 mil8 mil1.016(40mil)8 108 mil8 mil0.7874(31mil)8 108 mil8 mil0.635 (25 mil)6 87 mil6 mil0.508 (20 mil)/7 mil5 mil0.406 (16 mil)/6 mil5 mil0.305 (12 mil)/6 mil4 mil6.3.The method of etch蝕刻方法: Generally, We need to use laser cuter to do the width of aperture less or equal to 25mil, the chemical etch apply for the Stencil with the aperture size more than 25mil . Besides this two method, we need to use electropolishing smooth procedure To make the high accurate BGA , uBGA or CSP.一般情況下,開孔寬度小於或等於25Mil的,要求使用鐳射切割法,化學腐蝕法適用於不銹鋼板開孔大於25Mil PTH,除此之外,當製造高精度的BGA 和uBGA 或CSP時,需要Electropolishing 的抛光過程.6.4. Aspect Ratio& Area Ratio寬度比及面積比To insure