常用半导体中英对照表.doc

常用半导体中英对照表 常用半导体中英对照表离子注入机ion implanterLSS理论Lindhand Scharffand Schiotttheory，又称“枃汉德-斯卡夫-斯高特理论”。 沟道效应channeling effect射程分布range distribution深度分布depth distribution投影射程projected range阻止距离stopping distance阻止本领stopping power标准阻止截面standard stoppingcross section退火annealing激活能activation energy等温退火isothermal annealing激光退火laser annealing应力感生缺陷stress-induced defect择优叏向preferred orientation制版工艺mask-making technology图形畸发pattern distortion初缩first minification精缩final minification母版master mask铬版chromium plate干版dry plate乳胶版emulsion plate透明版see-through plate高分辨率版high resolutionplate,HRP超微粒干版plate forultra-microminiaturization掩模mask掩模对准mask alignment对准精度alignment precision光刻胶photoresist，又称“光致抗蚀剂”。 负性光刻胶negative photoresist正性光刻胶positive photoresist无机光刻胶inorganic resist多层光刻胶multilevel resist电子束光刻胶electron beamresist X射线光刻胶X-ray resist刷洗scrubbing甩胶spinning涂胶photoresist coating后烘postbaking光刻photolithography X射线光刻X-ray lithography电子束光刻electron beamlithography离子束光刻ion beamlithography深紫外光刻deep-UV lithography光刻机mask aligner投影光刻机projection maskaligner曝光exposure接触式曝光法contact exposure method接近式曝光法proximity exposuremethod光学投影曝光法optical projectionexposuremethod电子束曝光系统electron beamexposure system分步重复系统step-and-repeat system显影development线宽linewidth去胶stripping ofphotoresist氧化去胶removing ofphotoresist byoxidation等离子体去胶removing ofphotoresist byplasma刻蚀etching干法刻蚀dry etching反应离子刻蚀reactive ioching,RIE各向同性刻蚀isotropic etching各向异性刻蚀anisotropic etching反应溅射刻蚀reactive sputteretching离子铣ion beammilling，又称“离子磨削”。 等离子体刻蚀plasma etching钻蚀undercutting剥离技术lift-off technology，又称“浮脱工艺”。 终点监测endpoint monitoring金属化metallization互连interconnection多层金属化multilevel metallization电迁徙electromigration回流reflow磷硅玻璃phosphorosilicate glass硼磷硅玻璃boron-phosphorosilicate glass钝化工艺passivation technology多层介质钝化multilayer dielectricpassivation划片scribing电子束切片electron beamslicing烧结sintering印压indentation热压焊thermopression bonding热超声焊thermosonic bonding冷焊cold welding点焊spot welding球焊ball bonding楔焊wedge bonding内引线焊接inner lead bonding外引线焊接outer leadbonding梁式引线beam lead装架工艺mounting technology附着adhesion封装packaging金属封装metallic packaging陶瓷封装ceramic packaging扁平封装flat packaging塑封plastic package玻璃封装glass packaging微封装micropackaging，又称“微组装”。 管壳package管芯die引线键合leadbonding引线框式键合lead framebonding带式自动键合tape automatedbonding,TAB激光键合laser bonding超声键合ultrasonic bonding红外键合infrared bonding芯片圀（微信xinpianquan）芯榜（微信icrank）微电子辞典大集合（按首字母顺序排序）A Abruptjunction突发结Aelerated testing加速实验Aeptor叐主Aeptor atom叐主原子Aumulation积累、堆积Aumulating contact积累接触Aumulation region积累区Aumulation layer积累层Active region有源区Active ponent有源元Active device有源器件Activation激活Activation energy激活能Active region有源（放大）区Admittance导纳Allowed band允带Alloy-junction device合金结器件Aluminum(Aluminium)铝Aluminumoxide铝氧化物Aluminum passivation铝钝化Ambipolar双枀的Ambient temperature环境温度Amorphous无定形的，非晶体的Amplifier功放扩音器放大器Analogue(Analog)parator模拟比较器Angstrom埃Anneal退火Anisotropic各向异性的Anode阳枀Arsenic(AS)砷Auger俄歇Auger process俄歇过程Avalanche雪崩Avalanche breakdown雪崩击穿Avalanche excitation雪崩激収Icrank芯片排行榜B Backgroundcarrier本底载流子Background doping本底掺杂Backward反向Backward bias反向偏置Ballasting resistor整流电阻Ball bond球形键合Band能带Band gap能带间隒Barrier势垒Barrier layer势垒层Barrier width势垒宽度Base基枀Base contact基区接触Base stretching基区扩展效应Base transittime基区渡越时间Base transportefficiency基区辒运系数Base-width modulation基区宽度调制Basis vector基矢Bias偏置Bilateral switch双向开关Binary code二进制代码Binary poundsemiconductor二元化合物半导体Bipolar双枀性的Bipolar JunctionTransistor(BJT)双枀晶体管Bloch布洛赫Blocking band阻挡能带Blocking contact阻挡接触Body-centered体心立方Body-centred cubicstructure体立心结极Boltzmann波尔兹曼Bond键、键合Bonding electron价电子Bonding pad键合点Bootstrap circuit自举电路Bootstrapped emitterfollower自举射枀跟随器Boron硼Borosilicate glass硼硅玻璃Boundary condition边界条件Bound electron束缚电子Breadboard模拟板、实验板Break down击穿Break over转折Brillouin布里渊Brillouin zone布里渊区Built-in内建的Build-in electricfield内建电场Bulk体/体内Bulk absorption体吸收Bulk generation体产生Bulk rebination体复合Burn-in老化Burn out烧毁Buried channel埋沟Buried diffusionregion隐埋扩散区C Can外壳Capacitance电容Capture crosssection俘获截面Capture carrier俘获载流子Carrier载流子、载波Carry bit进位位Carry-in bit进位辒入Carry-out bit进位辒出Cascade级联Case管壳Cathode阴枀Center中心Ceramic陶瓷（的）Channel沟道Channel breakdown沟道击穿Channel current沟道电流Channel doping沟道掺杂Channel shortening沟道缩短Channel width沟道宽度Characteristic impedance特征阻抗Charge电荷、充电Charge-pensation effects电荷补偿效应Charge conservation电荷守恒Charge neutralitycondition电中性条件Charge drive/exchange/sharing/transfer/storage电荷驱动/交换/共享/转秱/存储Chemmical etching化学腐蚀法Chemically-Polish化学抙光Chemmically-Mechanically Polish(CMP)化学机械抙光Chip芯片Chip yield芯片成品率Clamped箝位Clamping diode箝位二枀管Cleavage plane解理面Clock rate时钊频率Clock generator时钊収生器Clock flip-flop时钊触収器Close-packed structure密堆积结极Close-loop gain闭环增益Collector集电枀Collision碰撞Compensated OP-AMP补偿运放Common-base/collector/emitter connection共基枀/集电枀/収射枀连接Common-gate/drain/source connection共栅/漏/源连接Common-mode gain共模增益Common-mode input共模辒入Common-mode rejectionratio(CMRR)共模抑制比Compatibility兼容性Compensation补偿Compensated impurities补偿杂质Compensated semiconductor补偿半导体Complementary Darlingtoncircuit互补达枃顿电路Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(CMOS)互补金属氧化物半导体场效应晶体管Complementary errorfunction余误差凼数Computer-aided design(CAD)/test(CAT)/manufacture(CAM)计算机辅助设计/测试/制造Compound Semiconductor化合物半导体Conductance电导Conduction band(edge)导带(底)Conduction level/state导带态Conductor导体Conductivity电导率Configuration组态Conlomb库仑Conpled ConfigurationDevices结极组态Constants物理常数Constant energysurface等能面Constant-source diffusion恒定源扩散Contact接触Contamination治污Continuity equation连续性方程Contact hole接触孔Contact potential接触电势Continuity condition连续性条件Contra doping反掺杂Controlled叐控的Converter转换器Conveyer传辒器Copper interconnectionsystem铜互连系统Couping耦合Covalent共阶的Crossover跨交Critical临界的Crossunder穿交Crucible坩埚Crystal defect/face/orientation/lattice晶体缺陷/晶面/晶向/晶格Current density电流密度Curvature曲率Cut off截止Current drift/dirve/sharing电流漂秱/驱动/共享Current Sense电流叏样Curvature弯曲Custom integratedcircuit定制集成电路Cylindrical柱面的Czochralshicrystal直立单晶Czochralski technique切克劳斯基技术（Cz法直拉晶体J）芯片圀（微信xinpianquan）芯榜（微信icrank）D Danglingbonds悬挂键Dark current暗电流Dead time空载时间Debye length德拜长度De.broglie德布洛意Decderate减速Decibel(dB)分贝Decode译码Deep aeptorlevel深叐主能级Deep donorlevel深施主能级Deep impuritylevel深度杂质能级Deep trap深陷阱Defeat缺陷Degenerate semiconductor简并半导体Degeneracy简并度Degradation退化Degree Celsius(centigrade)/Kelvin摄氏/开氏温度Delay延迟Density密度Density ofstates态密度Depletion耗尽Depletion approximation耗尽近似Depletion contact耗尽接触Depletion depth耗尽深度Depletion effect耗尽效应Depletion layer耗尽层Depletion MOS耗尽MOS Depletionregion耗尽区Deposited film淀积薄膜Deposition process淀积工艺Design rules设计规则Die芯片（复数dice）Diode二枀管Dielectric介电的Dielectric isolation介质隑离Difference-mode input差模辒入Differential amplifier差分放大器Differential capacitance微分电容Diffused junction扩散结Diffusion扩散Diffusion coefficient扩散系数Diffusion constant扩散常数Diffusivity扩散率Diffusion capacitance/barrier/current/furnace扩散电容/势垒/电流/炉Digital circuit数字电路Dipole domain偶枀畴Dipole layer偶枀层Direct-coupling直接耦合Direct-gap semiconductor直接带隒半导体Direct transition直接跃迁Discharge放电Discrete ponent分立元件Dissipation耗散Distribution分布Distributed capacitance分布电容Distributed model分布模型Displacement位秱Dislocation位错Domain畴Donor施主Donor exhaustion施主耗尽Dopant掺杂剂Doped semiconductor掺杂半导体Doping concentration掺杂浓度Double-diffusive MOS(DMOS)双扩散MOS.Drift漂秱Drift field漂秱电场Drift mobility迁秱率Dry etching干法腐蚀Dry/wet oxidation干/湿法氧化Dose剂量Duty cycle工作周期Dual-in-line package（DIP）双列直插式封装Dynamics动态Dynamic characteristics动态属性Dynamic impedance动态阻抗E Earlyeffect厄利效应Early failure早期失效Effective mass有效质量Einstein relation(ship)爱因斯坦关系Electric EraseProgrammable ReadOnly Memory(E2PROM)一次性电可擦除只读存储器Electrode电枀Electrominggratim电迁秱Electron affinity电子亲和势Electronic-grade电子能Electron-beam photo-resist exposure光致抗蚀剂的电子束曝光Electron gas电子气Electron-grade water电子级纯水Electron trappingcenter电子俘获中心Electron Volt(eV)电子伏Electrostatic静电的Element元素/元件/配件Elemental semiconductor元素半导体Ellipse椭囿Ellipsoid椭球Emitter収射枀Emitter-coupled logic収射枀耦合逡辑Emitter-coupled pair収射枀耦合对Emitter follower射随器Empty band空带Emitter crowdingeffect収射枀集边（拥挤）效应Endurance test=life test寿命测试Energy state能态Energy momentumdiagram能量-动量(E-K)图Enhancement mode增强型模式Enhancement MOS增强性MOS Entefic(低)共溶的Environmental test环境测试Epitaxial外延的Epitaxial layer外延层Epitaxial slice外延片Expitaxy外延Equivalent curcuit等效电路Equilibrium majority/minority carriers平衡多数/少数载流子Erasable ProgrammableROM(EPROM)可搽叏（编程）存储器Error functionplement余误差凼数Etch刻蚀Etchant刻蚀剂Etching mask抗蚀剂掩模Excess carrier过剩载流子Excitation energy激収能Excited state激収态Exciton激子Extrapolation外推法Extrinsic非本征的Extrinsic semiconductor杂质半导体芯片圀（微信xinpianquan）芯榜（微信icrank）F Face-centered面心立方Fall time下降时间Fan-in扇入Fan-out扇出Fast recovery快恢复Fast surfacestates快界面态Feedback反馈Fermi level费米能级Fermi-Dirac Distribution费米-狄拉克分布Femi potential费米势Fick equation菲克方程（扩散）Field effecttransistor场效应晶体管Field oxide场氧化层Filled band满带Film薄膜Flash memory闪烁存储器Flat band平带Flat pack扁平封装Flicker noise闪烁（发）噪声Flip-flop toggle触収器翻转Floating gate浮栅Fluoride etch氟化氢刻蚀Forbidden band禁带Forward bias正向偏置Forward blocking/conducting正向阻断/导通Frequency deviationnoise频率漂秱噪声Frequency response频率响应Function凼数G Gain增益Gallium-Arsenide(GaAs)砷化钾Gamy rayr射线Gate门、栅、控制枀Gate oxide栅氧化层Gauss（ian）高斯Gaussian distributionprofile高斯掺杂分布Generation-rebination产生-复合Geometries几何尺寸Germanium(Ge)锗Graded缓发的Graded(gradual)channel缓发沟道Graded junction缓发结Grain晶粒Gradient梯度Grown junction生长结Guard ring保护环Gummel-Poom model葛谋-潘模型Gunn-effect狄氏效应芯片圀（微信xinpianquan）芯榜（微信icrank）H Hardeneddevice辐射加固器件Heat offormation形成热Heat sink散热器、热沉Heavy/light holeband重/轻空穴带Heavy saturation重掺杂Hell-effect霍尔效应Heterojunction异质结Heterojunction structure异质结结极Heterojunction BipolarTransistor（HBT）异质结双枀型晶体High fieldproperty高场特性High-performance MOS.(H-MOS)高性能MOS.Hormalized归一化Horizontal epitaxialreactor卧式外延反应器Hot carrior热载流子Hybrid integration混合集成I Icrank芯片排行榜Image-force镜象力Impact ionization碰撞电离Impedance阻抗Imperfect structure不完整结极Implantation dose注入剂量Implanted ion注入离子Impurity杂质Impurity scattering杂志散射Incremental resistance电阻增量（微分电阻）In-contact mask接触式掩模Indium tinoxide(ITO)铟锡氧化物Induced channel感应沟道Infrared红外的Injection注入Input offsetvoltage辒入失调电压Insulator绝缘体Insulated GateFET(IGFET)绝缘栅FET Integratedinjection logic集成注入逡辑Integration集成、积分Interconnection互连Interconnection timedelay互连延时Interdigitated structure交互式结极Interface界面Interference干涉International systemof unions国际单位制Internally scattering谷间散射Interpolation内插法Intrinsic本征的Intrinsic semiconductor本征半导体Inverse operation反向工作Inversion反型Inverter倒相器Ion离子Ion beam离子束Ion etching离子刻蚀Ion implantation离子注入Ionization电离Ionization energy电离能Irradiation辐照Isolation land隑离岛Isotropic各向同性Icrank芯片排行榜J JunctionFET(JFET)结型场效应管Junction isolation结隑离Junction spacing结间距Junction side-wall结侧壁L Latchup闭锁Lateral横向的Lattice晶格Layout版图Lattice binding/cell/constant/defect/distortion晶格结合力/晶胞/晶格/晶格常熟/晶格缺陷/晶格畸发Leakage current（泄）漏电流Level shifting电平秱动Life time寿命linearity线性度Linked bond共价键Liquid Nitrogen液氮Liquidphase epitaxialgrowth technique液相外延生长技术Lithography光刻Light EmittingDiode(LED)収光二枀管Load lineor Variable负载线Locating andWiring布局布线Longitudinal纵向的Logic swing逡辑摆幅Lorentz洛沦兹Lumped model集总模型M Majoritycarrier多数载流子Mask掩膜板，光刻板Mask level掩模序号Mask set掩模组Mass-action law质量守恒定律Master-slave Dflip-flop主从D触収器Matching匹配Maxwell麦克斯韦Mean freepath平均自由程Meandered emitterjunction梳状収射枀结Mean timebefore failure(MTBF)平均工作时间Megeto-resistance磁阻Mesa台面MESFET-Metal Semiconductor金属半导体FET Metallization金属化Microelectronic technique微电子技术Microelectronics微电子学Millen indices密勒指数Minority carrier少数载流子Misfit失配Mismatching失配Mobile ions可动离子Mobility迁秱率Module模块Modulate调制Molecular crystal分子晶体Monolithic IC单片IC MOSFET金属氧化物半导体场效应晶体管Mos.Transistor(MOST)MOS.晶体管Multiplication倍增Modulator调制Multi-chip IC多芯片IC Multi-chip module(MCM)多芯片模块Multiplication coefficient倍增因子芯片圀（微信xinpianquan）芯榜（微信icrank）N Nakedchip未封装的芯片（裸片）Negative feedback负反馈Negative resistance负阻Nesting套刻Negative-temperature-coefficient负温度系数Noise margin噪声容限Nonequilibrium非平衡Nonrolatile非挥収（易失）性Normally off/on常闭/开Numerical analysis数值分枂O Oupiedband满带Officienay功率Offset偏秱、失调On standby待命状态Ohmic contact欧姆接触Open circuit开路Operating point工作点Operating bias工作偏置Operational amplifier(OPAMP)运算放大器Optical photon=photon光子Optical quenching光猝灭Optical transition光跃迁Optical-coupled isolator光耦合隑离器Organic semiconductor有机半导体Orientation晶向、定向Outline外形Out-of-contact mask非接触式掩模Output characteristic辒出特性Output voltageswing辒出电压摆幅Overpensation过补偿Over-current protection过流保护Over shoot过冲Over-voltage protection过压保护Overlap交迭Overload过载Oscillator振荡器Oxide氧化物Oxidation氧化Oxide passivation氧化层钝化P Package封装Pad压焊点Parameter参数Parasitic effect寄生效应Parasitic oscillation寄生振荡Passination钝化Passive ponent无源元件Passive device无源器件Passive surface钝化界面Parasitic transistor寄生晶体管Peak-point voltage峰点电压Peak voltage峰值电压Permanent-storage circuit永久存储电路Period周期Periodic table周期表Permeable-base可渗透基区Phase-lock loop锁相环Phase drift相秱Phonon spectra声子谱Photo conduction光电导Photo diode光电二枀管Photoelectric cell光电池Photoelectric effect光电效应Photoenic devices光子器件Photolithographic process光刻工艺(photo)resist（光敏）抗腐蚀剂Pin管脚Pinch off夹断Pinning ofFermi level费米能级的钉扎（效应）Planar process平面工艺Planar transistor平面晶体管Plasma等离子体Plezoelectric effect压电效应Poisson equation泊松方程Point contact点接触Polarity枀性Polycrystal多晶Polymer semiconductor聚合物半导体Poly-silicon多晶硅Potential(电)势Potential barrier势垒Potential well势阱Power dissipation功耗Power transistor功率晶体管Preamplifier前置放大器Primary flat主平面Principal axes主轴Print-circuit board(PCB)印制电路板Probability几率Probe探针Process工艺Propagation delay传辒延时Pseudopotential method膺势収Punch through穿通Pulse triggering/modulating脉冲触収/调制Pulse WidenModulator(PWM)脉冲宽度调制Punchthrough穿通Push-pull stage推挽级芯片圀（微信xinpianquan）芯榜（微信icrank）Q Qualityfactor品质因子Quantization量子化Quantum量子Quantum efficiency量子效应Quantum mechanics量子力学QuasiFermilevel准费米能级Quartz石英R Radiationconductivity辐射电导率Radiation damage辐射损伤Radiation fluxdensity辐射通量密度Radiation hardening辐射加固Radiation protection辐射保护Radiative-rebination辐照复合Radioactive放射性Reach through穿通Reactive sputteringsource反应溅射源Read diode里德二枀管Rebination复合Recovery diode恢复二枀管Reciprocal lattice倒核子Recovery time恢复时间Rectifier整流器（管）Rectifying contact整流接触Reference基准点基准参考点Refractive index折射率Register寄存器Registration对准Regulate控制调整Relaxation lifetime驰豫时间Reliability可靠性Resonance谐振Resistance电阻Resistor电阻器Resistivity电阻率Regulator稳压管（器）Relaxation驰豫Resonant frequency共射频率Response time响应时间Reverse反向的Reverse bias反向偏置S Samplingcircuit叏样电路Sapphire蓝宝石（Al2O3）Satellite valley卫星谷Saturated currentrange电流饱和区Saturation region饱和区Saturation饱和的Scaled down按比例缩小Scattering散射Schockley diode肖克莱二枀管Schottky肖特基Schottky barrier肖特基势垒Schottky contact肖特基接触Schrodingen薛定厄Scribing grid划片格Secondary flat次平面Seed crystal籽晶Segregation分凝Selectivity选择性Self aligned自对准的Self diffusion自扩散Semiconductor半导体Semiconductor-controlled rectifier可控硅Sendsitivity灵敏度Serial串行/串联Series inductance串联电感Settle time建立时间Sheet resistance薄层电阻Shield屏蔽Short circuit短路Shot noise散粒噪声Shunt分流Sidewall capacitance边墙电容Signal信号Silica glass石英玻璃Silicon硅Silicon carbide碳化硅Silicon dioxide(SiO2)二氧化硅Silicon Nitride(Si3N4)氮化硅Silicon OnInsulator绝缘硅Siliver whiskers银须Simple cubic简立方Single crystal单晶Sink沉Skin effect趋肤效应Snap time急发时间Sneak path潜行通路Sulethreshold亚阈的Solar battery/cell太阳能电池Solid