SMT常用术语之中英文对比.doc

SMT常用术语之中英文对比 AI :Auto-Insertion 自动插件AQL :acceptable quality level 允收水准ATE :automatic test equipment 自动测试ATM :atmosphere 气压BGA :ball grid array 球形矩阵CCD :charge coupled device 监视连接组件(摄影机)CLCC :Ceramic leadless chip carrier 陶瓷引脚载具COB :chip-on-board 芯片直接贴附在电路板上cps :centipoises(粘度单位) 百分之一CSB :chip scale ball grid array 芯片尺寸BGACSP :chip scale package 芯片尺寸构装CTE :coefficient of thermal expansion 热膨胀系数DIP :dual in-line package 双内线包装(泛指手插组件)FPT :fine pitch technology 微间距技术FR-4 :flame-retardant substrate 玻璃纤维胶片(用来制作PCB材质)IC :integrate circuit 集成电路IR :infra-red 红外线Kpa :kilopascals(压力单位)LCC :leadless chip carrier 引脚式芯片承载器MCM :multi-chip module 多层芯片模块MELF :metal electrode face 二极管MQFP :metalized QFP 金属四方扁平封装NEPCON :National Electronic Package andProduction Conference 国际电子包装及生产会议PBGA:plastic ball grid array 塑料球形矩阵PCB:printed circuit board 印刷电路板PFC :polymer flip chipPLCC:plastic leadless chip carrier 塑料式有引脚芯片承载器Polyurethane 聚亚胺酯(刮刀材质)ppm:parts per million 指每百万PAD(点)有多少个不良PAD(点)psi :pounds/inch2 磅/英吋2PWB :printed wiring board 电路板QFP :quad flat package 四边平坦封装SIP :single in-line packageSIR :surface insulation resistance 绝缘阻抗SMC :Surface Mount Component 表面粘着组件SMD :Surface Mount Device 表面粘着组件SMEMA :Surface Mount EquipmentManufacturers Association 表面粘着设备制造协会SMT :surface mount technology 表面粘着技术SOIC :small outline integrated circuitSOJ :small out-line j-leaded packageSOP :small out-line package 小外型封装SOT :small outline transistor 晶体管SPC :statistical process control 统计过程控制SSOP :shrink small outline package 收缩型小外形封装TAB :tape automaticed bonding 带状自动结合TCE :thermal coefficient of expansion 膨胀(因热)系数Tg :glass transition temperature 玻璃转换温度THD :Through hole device 须穿过洞之组件(贯穿孔)TQFP :tape quad flat package 带状四方平坦封装UV :ultraviolet 紫外线uBGA :micro BGA 微小球型矩阵cBGA :ceramic BGA 陶瓷球型矩阵PTH :Plated Thru Hole 导通孔IA Information Appliance 信息家电产品MESH 网目OXIDE 氧化物FLUX 助焊剂LGA (Land Grid Arry)封装技术 LGA封装不需植球，适合轻薄短小产品应用。TCP (Tape Carrier Package)ACF Anisotropic Conductive Film 异方性导电胶膜制程Solder mask 防焊漆Soldering Iron 烙铁Solder balls 锡球Solder Splash 锡渣Solder Skips 漏焊Through hole 贯穿孔Touch up 补焊Briding 穚接(短路)Solder Wires 焊锡线Solder Bars 锡棒Green Strength 未固化强度(红胶)Transter Pressure 转印压力(印刷)Screen Printing 刮刀式印刷Solder Powder 锡颗粒Wetteng ability 润湿能力Viscosity 黏度Solderability 焊锡性Applicability 使用性Flip chip 覆晶Depaneling Machine 组装电路板切割机Solder Recovery System 锡料回收再使用系统Wire Welder 主机板补线机X-Ray Multi-layer Inspection System X-Ray孔偏检查机BGA Open/Short X-Ray Inspection Machine BGA X-Ray检测机Prepreg Copper Foil Sheeter P.P. 铜箔裁切机Flex Circuit Connections 软性排线焊接机LCD Rework Station 液晶显示器修护机Battery Electro Welder 电池电极焊接机PCMCIA Card Welder PCMCIA卡连接器焊接Laser Diode 半导体雷射Ion Lasers 离子雷射Nd: YAG Laser 石榴石雷射DPSS Lasers 半导体激发固态雷射Ultrafast Laser System 超快雷射系统MLCC Equipment 积层组件生产设备Green Tape Caster, Coater 薄带成型机ISO Static Laminator 积层组件均压机Green Tape Cutter 组件切割机Chip Terminator 积层组件端银机MLCC Tester 积层电容测试机Components Vision Inspection System芯片组件外观检查机高压恒温恒湿寿命测试机 High Voltage Burn-In Life Tester电容漏电流寿命测试机 Capacitor Life Test with Leakage Current芯片打带包装机 Taping Machine组件表面粘着设备 Surface Mounting Equipment电阻银电极沾附机 Silver Electrode Coating MachineTFT-LCD(薄膜晶体管液晶显示器) 笔记型用STN-LCD(中小尺寸超扭转向液晶显示器 行动电话用PDA(个人数字助理器)CMP(化学机械研磨)制程研磨液(Slurry)，Compact Flash Memory Card (简称CF记忆卡) MP3、PDA、数字相机Dataplay Disk(微光盘)。交换式电源供应器(SPS)专业电子制造服务 (EMS)，PCB高密度连结板(HDI board， 指线宽/线距小于4/4 mil)微小孔板(Micro-via board)，孔?6mil以 下 水沟效应(Puddle Effect)：早期大面积松宽线路之蚀刻银贯孔(STH)铜贯孔(CTH)组装电路板切割机 Depaneling MachineNONCFC=无氟氯碳化合物。Support pin=支撑柱F.M.=光学点ENTEK 裸铜板上涂一层化学药剂使PCB的pad比较不会生锈QFD：品质机能展开PMT：产品成熟度测试ORT：持续性寿命测试FMEA：失效模式与效应分析TFT-LCD(薄膜晶体管液晶显示器) (Liquid-Crystal Displays Addressed by Thin-Film Transistors)导线架(Lead Frame)：单体导线架(Discrete Lead Frame)及积体线路导线架(IC Lead Frame)二种ISP的全名是Internet Service Provider，指的是网际网络服务提供ADSL即为非对称数字用户回路调制解调器SOP: Standard Operation Procedure(标准操作手册)DOE: Design Of Experiment (实验计划法)打线接合(Wire Bonding)卷带式自动接合(Tape