PCB基板厚度用料结构.doc

规格配料结构规格配料结构0.1H/H11061.31/1676280.21/112116H/H77628H/1210801.42/277628H/H115061/177628T/T17628H/H776282/211061.52/2776280.32/2115061/187628H/217628H/H876281/122116T/T87628H/1221161.62/287628H/H1080+2116+10801/187628T/T1080+2116+1080H/H876280.42/21080+2116+10801.72/2876281/11080+7628+1080H/H276281/197628T/T27628H/H976280.52/2276281.82/2976281/17628+1080+76281/197628H/H7628+1080+7628H/H976280.62/27628+1080+76281.92/2976281/1376281/1107628H/H37628H/H1076280.72/2376282.02/21076281/12116+27628+21161/1107628H/H1080+37628+1080H/H1176280.82/21080+37628+10802.21/11176281/147628H/H127628H/H476282.32/21276280.92/2476281/11276281/127628+1080+27628H/H127628H/H27628+2116+276282.42/21276281.02/227628+2116+276281/11376281/157628H/H137628H/H576282.52/21376281.12/2576281/11376281/157628H/H137628H/H676283.02/21676281.22/2676281/11676281/167628H/H167628H/H676283.21/11776282/2177628PCB板材厚度规格： 0.5mm，0.7mm，0.8mm，1.0mm，1.2mm，1.5mm，1.6mm，2.0mm，2.4mm，3.2mm，6.4mmPCB板上铜箔的厚度规格： 18um, 25um, 35um, 70um和105um常用半固化片规格：型号10802116L2116A2116H15007628L7628A7628H7628M厚mil344.55677.59.38板厚一般分为含铜和不含铜两种厚度一含铜厚度：二不含铜厚度厚度mil厚度mm配料结构备注20.0501106不含2OZ铜箔30.0750.076主:11080次:11086不含2OZ铜箔厚度mil厚度mm配料结构备注40.100.102主:12116次:13313或2106或12113或12313或1080+10650.127主:12116次:2108060.1500.152主:11506次:2108070.178主:17628次:1080+211680.2000.203主:17628次:22116或2211390.2280.23022116100.250.25422116110.280主:1080+2116+1080次:22165120.3000.305主:21506次:2116+1080+2116130.33主:1080+7628+1080次:21506140.3560.3627628150.3827628160.4060.41主:27628次:32116170.43主:7628+1080+7628次:27628180.4570.467628+1080+7628190.487628+2116+7628200.5080.51主:7628+2116+7628次:7628+21080+7628或37628210.5337628220.5637628230.5837628240.600.61主:37628次:2116+27628+2116250.64主:37628次:2116+27628+2116260.661080+37628+1080270.691080+37628+1080280.710.711主:47628次:47628300.7647628310.790.8047628友情备注：1 foot = 12