联想-MIDH ODM Manufacturing Quality RequirementV1.0(英文2012.10.15)

ODM Manufacturing Quality Requirement Version V1 0 Document Number MIDH P A S R Dept Abbr 00X Release Date 2012 10 15 Review Cycle 1 year Page 1 of 28 The online version is the master ODM Manufacturing Quality Requirement This document was approved for general use on the indicated date of issue The user of this document is responsible for obtaining the master latest version on line prior to use The latest version of this document is located at ECM If this is a printed hardcopy it s for reference only Users that have recommended process changes should send them via e mail to the process owner Document Control Owner and Approver OwnerDepartmentApproverDepartment Yan JianDongSC E New line and new site running supplier should submit the control run plan to Lenovo SQE review and following the plan to arrange the safe launch control run and submit the control run report Referring to attached qualification requirement 5 1 3 Supplier manufacturing factory supporting and responsibility 5 1 3 1 Organization 5 1 3 1 1 Dedicated Team for Lenovo is required The team is responsible for establishing maintaining and implementing quality related aspects of the Product and Process And the team is responsible for the efficiency and effectiveness of the process and communication 5 1 3 1 2 The supplier is required to set up End to End E2E Quality Focal Point to manage SQE for sub tier supplier management Supplier Internal Production Process Quality Control Field Support for the Quality Related Aspects in end user side Products Shipped Out Lenovo QA for new product qualification and quality performance tracking improvement 5 1 3 1 3 Employee Qualification Requirements The supplier shall provide below information for Quality Manager and or Representative Quality Engineer and Operator in RFQ process for evaluation How many years experience in quality How many years experience in PC or phone related industry How many years experience in current company The Operator should be well trained and qualified before producing Lenovo products The OOB requirements The supplier is required to leverage the resources to ensure the OOB Engineers and Operators can perform the OOB inspection and related processes strictly following the predefined procedure The OOB Engineers and Operators shall be qualified by Lenovo before Ship Support and monitored in mass production The supplier should support Lenovo to do on site OOB inspection if applicable and training for the OOB engineers and operators before Ship Support during ramp phase one month or defined quantity and when the field Lenovo data indicates the escape from vendor s OOB is not acceptable The ODM Manufacturing Quality Requirement Version V1 0 Document Number MIDH P A S R Dept Abbr 00X Release Date 2012 10 15 Review Cycle 1 year Page 5 of 28 The online version is the master vendors shall provide the working place and reimburse the travel cost The supplier should support Lenovo to do full and or sampling inspection for Lenovo products The supplier is required to work with Lenovo to define the return process once the shipment is rejected 5 1 3 2 Supplier s Responsibility In general the supplier owns the quality management responsibility for all manufacturing process both SMT and system level The Supplier should make sure products meet Lenovo quality requirements Supplier should perform incoming material inspection Lenovo can request or confirm AQL inspection specification Suppler is the owner for fixing line quality issue by following actions Inform Lenovo the quality issue and report the progress status on a regular base for all key issues Coordinate all related teams to fix the issues including internal team Lenovo team Lead to perform Failure Analysis FA and find out solution Verify the solution by verification test Manage rework screen with part supplier Take preventive actions and continuous improvement Get Lenovo s confirmation for below actions before implementation Any decision made on part and system rework include hardware and software change Any decision made on shipment with risks Any decision made on safety related issues Any decision made on part and system reliability issues It is forbidden to rework part by supplier if the supplier is not the part vendor Supplier should perform Line Reject failure analysis manage the performance data and provide the regular reports to Lenovo Lenovo can define the line performance target analysis method and format Lenovo can also trigger improvement action request and some special data analysis Supplier should take actions to support field quality issue These actions include but not limited to Analyzing history data and necessary information Providing risk assessment Driving FA and solution Confirming the solution by verification test and implement the solution Driving preventive actions and Continuous Improvement actions Field critical failure quick analysis and performance improvement Supplier should do below actions to manage Engineering Change EC BOM Change Test Code Process Change and any SW HW BIOS Change Follow the schedule requested by Lenovo Necessary Verification Test All Changes should be documented and inform Lenovo Provide tracking report and review with Lenovo by weekly base The supplier is required to perform quality control in New Product Introduction NPI phase by new product NPI Running process 5 1 3 3 General communication requirements 24 hours available phone and email communications should be documented and shared to both ODM Manufacturing Quality Requirement Version V1 0 Document Number MIDH P A S R Dept Abbr 00X Release Date 2012 10 15 Review Cycle 1 year Page 6 of 28 The online version is the master Supplier and Lenovo Quality Teams Lenovo SQE is the single focal point for supplier Manufacturing Quality Below Reports and Communications are required but not limited to Equivalent Phase Report is also feasible to replace the requirements in below table ItemReportMeeting NPI MFG Quality requirement confirming report at RFQ DFM list from SIV to SOVP Quality plan from SIV to SOVP SIT1 dye stain x section report SVT SIT2 PVT QV Daily Report SOVP Daily Report Smart Ramp Report Details refer to Quality review NPI Technical Meeting NPI phase safe launch report Manufacturing Readiness Review SVT SIT2 PVT Entry Exit Review Ship Support Review smart ramp review Others as needed KPI KPI Performance Weekly Report with analysis KPI Continuous Improvement Plan and actions follow up KPI Review Meeting Problem Management Technical Report for each issue Daily Incident Status Summary Report Lessons Learnt LL Report for each LL candidates Daily Quality Status Review Change Management EC Closure Report for each BOM EC HW SW Weekly Overall EC Status Summary Report Test Code BIOS Process Change Weekly Status Review Meeting Customer Support Case investigation with fix solution suggestion Case Daily update with corrective action s follow up Lessons Learnt LL Report for each LL candidates with preventive actions Customer Complaint Review QMS Internal Audit Report Corrective Action Plan and Status Report Continuous Improvement Plan and Status Report Upon Request OthersUpon RequestUpon Request Note if different with physical project referring to project quality plan and requirement from Lenovo SQE 5 1 3 4 sorting Segregation rework Once Quality Issue happen ODM suppliers should identify the affected scope according the root cause and SFIS in time ODM suppliers should provide resources to sort Lenovo and hub inventory including Lenovo Agency Hub The segregated stock shall be returned to the Supplier for rework or rework locally base on the rework requirements The sort and rework criteria shall be provided by the supplier and approved by Lenovo ODM suppliers shall ensure the rework sorting quality The rework sorting capacity should meet Lenovo s demand The ODM supplier is forbidden to rework the commodities which are not produced by them before formal review and approval by Lenovo 5 1 3 5 End User Support and Field Data Analysis If end user have quality problem ODMs should give on site support based on Lenovo requirement The supplier is required to establish DOA system part Failure Analysis Process including on site FA Parts Return Quick exchange and transport to the professional FA owner within 24hours FA management processes ODM should perform the first 100units DOA system analysis in details The FA Cycle Time should meet Lenovo requirements DOA systems Parts torn down from the DOA systems are not allowed to be assembled to the fresh new shipping systems The supplier is required to establish Warranty data collection failure analysis and performance improvement process The analysis should meet Lenovo Corporate Quality requirements Monthly ODM Manufacturing Quality Requirement Version V1 0 Document Number MIDH P A S R Dept Abbr 00X Release Date 2012 10 15 Review Cycle 1 year Page 7 of 28 The online version is the master Warranty report is required All returned units should be changed the SN and IMEI with new and re link those old PCBA SN key parts Accessory etc or will be rejected by Lenovo Logistic ODM shall record the detail DOA RMA repair data for each units at least not limited include SN PN Date IMEI Defect cause Repair result to come out the record list report SQE will review in weekly and monthly review RMA data analysis requirement refer to attached file 5 1 4 Product safety HSF EMC requirement The supplier is required to assure the compliance of Lenovo Safety and Environmental requirements The supplier is required to assure the Manufacturing Site Certificates and the Mark Label Sticker on the products and related package are in accordant with Lenovo requirements Stop build ship immediately if any Safety Mandatory Environmental Requirements Related deviation is found The supplier shall report the deviation to Lenovo and go through problem solving and decision making process with Lenovo for any further disposition The supplier should follow the Chinese EMC standard and Lenovo EMC requirements it is applicable for most Word Wide countries If there s more rigorous requirement in some country please follow target country s Mandatory EMC standard The supplier should follow Lenovo related requirements to produce the product The detail requirement please refer to Lenovo global procurement website product content restrictions URL 5 2 Supplier Manufacturing and Quality control process 5 2 1 Manufacturing SFIS data system requirement Supplier Shop Floor data system should meet Lenovo basic requirement 1 Quality data collection the input defects Yield Rate include SMT testing Assembly Inspection OOB etc and related log 2 Repair data control the repair infor Traceability employee date symptom cause repair solution etc and the yield rate of repair products monitoring and data collection the 1st 2nd yield rate after return to line 3 System flow gating and BOM check function the data system shall have the function to be sure the previous stations pass and then can release to next station the system should have the function to prevent the wrong material used in SMT and Assembly 4 Traceability SMT traceability use component Lot DC PN Location Vendor etc to track the PCBA and finished goods use finished goods to track the component information Assembly traceability related information searching and use key parts to track finished goods or use finished goods to track the key parts etc 5 System hold and block function the system should have the function to hold or block those infected materials parts semi finish goods finish goods by PN WO Date station SN etc to prevent the infected units escapee to next station or ship out 6 Parts quality data collection this system should have function to collect and search the data by PN Model Date etc 5 2 2 Incoming inspection ODM Manufacturing Quality Requirement Version V1 0 Document Number MIDH P A S R Dept Abbr 00X Release Date 2012 10 15 Review Cycle 1 year Page 8 of 28 The online version is the master Supplier should perform the IQC inspection both function and cosmetic and meet Lenovo requirement or get Lenovo approval especially for key parts key parts inspection please check the attached file The IQC inspection report should be record and submit by daily and weekly to Lenovo team Any key issues should highlight to Lenovo team in time and supporting to dispose timely with Lenovo Any inspection spec difference or confusion shall be reported in time to Lenovo team to confirm 5 2 3 Material and finish good stock management requirement Supplier should provide the suitable material WIP semi finish good finish good stocks with qualified environment Temperature Humidity ESD MSD Light etc MSD materials should be well stocked by MSD protection solutions ESD protection should be well certified by authorized 3rd party to provide enough ESD protection People of stock management should be well trained and procedures clearly define the management process and requirement both material and finished good FIFO is requested for any stock well FIFO must be executed by suppliers Stock in or out should be well managed and tracked SFIS data is necessary 5 2 4 Material kitting measurement and traceability Supplier should have the well material kitting team and well trained for those operators with clear SOP L C R materials should be measured correctly before using on line for each real tray SFIS is better Material kitting and measurement can be tracked SFIS is request Spare materials should be well packed and stocked returning to material stock or production stock MSD materials should be packed with Vacuum solution The real or tray materials unpacking separating repacking should be well controlled with clear mark and correct process Clear procedure to MSD material packing and unpacking process is requested 5 2 5 SMT process and quality control Supplier to provide platform specific PCBA component test coverage document which includes ICT PCBA FT and FA Tests If test coverage changes supplier must change and re publish the document Supplier to provide platform specific Test Flow Test Content document including PCBA FT on line and off line FA testing This document should be updated and republished if changes are made Supplier must provide the DFM report to demonstrate adherence to Lenovo DFM requirements and highlight all no conformance from NPI to MP SOPs SIPs MIs WIs are required for every station all rework must have SOP SIP MI WI Suppliers must have fully documented STOP LINE process and must demonstrate all operators understand the STOP LINE criteria and rules Supplier must comply with Lenovo requirements once Lenovo has special requirement for glue application cure and rework for edge bonding of BGA and other key components And submit related document to Lenovo All key support fixtures including those residents in equipment with moveable pins must be tested via strain gage Fixtures should be labeled with unique names or numbers and revisions Supplier should control the MSD materials following the international spec Supplier should well control the ESD Effective quality organization is required IPQC PQC to perform the quality inspection and audit ODM Manufacturing Quality Requirement Version V1 0 Document Number MIDH P A S R Dept Abbr 00X Release Date 2012 10 15 Review Cycle 1 year Page 9 of 28 The online version is the master PCBA testing referring to testing requirement AOI inspection is required before shielding cover mount and after reflow soldering SMT traceability requirements All SMT components can be tracked base on supplier Date code part number date and time manufacturing history The repair record should include repair guy location symptom treatment component related Date Code Part number supplier etc The solder paste glue can be tracked the part number supplier and lot code The program of print mount reflow ICT ATE Function testing reflow profile should be tracked SMT machine and equipment calibration Supplier should well management those SMT equipment with correct calibration and maintenance Clear calibration and maintenance label and related reports is requested CPK measurement is requested for those key machines including mounter printer oven etc Profile requirement Profile board should be well made with correct solution to cover all plain board center side and corner Profile should be measured every shift with correct meter and tracked effectively Profile board should be tracked by version and maker SMT FA capability requirement for quick analysis Supplier should have the capable team for SMT FA and enough analysis equipment eg X section Dye Stain Strain gage X Ray solder ability etc 2 pcs X section Dye stain is requested during NPI phase and submit reports 5 2 6 Assembly production and quality control Boxline Test Coverage The supplier should come out the test plan and test coverage both SMT and Boxline from NPI stage to Lenovo SQE to review and finalize the testing plan before SOVP The Supplier is required to execute and maintain the test process accordingly after approved by Lenovo SQE team Test Process Code change should be informed to Lenovo and get Lenovo s approval before implementation Boxline testing referring to attachment testing requirement PQC The supplier is required to set up Process Quality Control PQC during production at the end of Assembly and also other proper stations Both Cosmetic and Functional Inspection are required PQC is responsible to report any failure to corresponding teams on time Below requirements shall be complied for PQC before execution The operators shall be well trained and certified The tooling equipments shall be qualified and calibrated The Inspection instruction shall be defined The Production Processes are under control IPQC ODM Manufacturing Quality Requirement Version V1 0 Document Number MIDH P A S R Dept Abbr 00X Release Date 2012 10 15 Review Cycle 1 year Page 10 of 28 The online version is the master The supplier is required