PFMEA-at-LED-Luminaire-0620.xls

潜潜在在过过程程失失效效模模式式及及后后果果分分析析 过过程程FMEA Potential Failure Mode and Effects Analysis P FMEA CrosCros s s RefeRefe rencrenc e e NumbNumb erer 相相关关 编编号号 Process Name Function 项项目目 功功能能 Potential Failure Mode 潜潜在在失失效效模模式式 Potential Effect s of Failure 潜潜在在失失效效后后果果 Sever ity 严严重重 度度 Classif icatio n 级级别别 Potential Cause s Mechanism s of Failure 潜潜在在失失效效起起因因 机机理理 Occur rence 频频度度 1 进料 确认接收物料 编号 规格和数量正 确 Incoming material confirm the item number description and the Qty of each delivery 部品编号和名称错误 The part NO and item NO may not correct 不能保证正常生产 The schedule of the MP may be delayed 5 供应商来料混装 The components may mixed up 2 送货单上的数量与实 物不符 The QTY may not match with the delivery note 不能保证生产数量 Can t guarantee the qty of the MP 5 供应商来料少数 The shortage of the delivery 2 包装破损 The packaging was damaged during the delivery 部品损坏 The components was damaged 5 1 包装材料差 The material of the packaging is not good enough 2 在运输或搬运期间没保 存好 The packaging was not properly transported and stored 2 2 IQC来料检查 部品规 格 外观符合BOM和 客户图纸要求 Inspection of the incoming material by the IQC specs exterior and the size etc according to the BOM and the drawing from the RD 散热件刮花 The heat sink was scratched 外观不良 客户投诉 The customer will complaints if the heat sink with the scratches 5 包装方法不当 材质差 Improper packaging or the poor quality raw material 2 散热件有披峰毛刺 The heat sink parts with peaks 外观不良 appearence defect 4 模具损坏或调试不当 Mold may damaged or improper testing of the mold 2 五金件尺寸差异 The size differences between the metal parts 不能装配 Unable to assemble 8 供应商模具损坏 变形 或 者生产时工艺参数设定不 当 The mold may damaged or the process of the injection may incorrect 2 电线尺寸差异 The size of the wire may differ 不能装配 爬电距离不 够 Unable to assemble or the distance of the wire may not enough 82 塑胶件尺寸差异 The size of the plastic parts may different 不能装配 Unable to assemble 8 2 包装材质与仕样书不 符 The material of the MP is different with the approve sample 客户投诉 Customer complaints 4 包材来料不良 Poor incoming packaging material 2 保护作用失效 Can not protect the goods 8 供应商用错材料 The vendor used the wrong material 2 部品损坏 The parts was damaged 不能装配 Can not Assemble 8 1 包装材料差 2 在运输或搬运期间没保 存好 The material of the packaging is not good enough The packaging was not properly transported and stored 2 3 仓库 正确保管 Warehouse Store the material properly 没有按先进先出管控 Fail to follow the First in first out standard 材料过期影响产品品 质 The quality of the parts may affected if over the expired date 5 入仓材料标识不明确 Have no marked well of each lot 2 温湿度超标 The temperature and the humidity are over the standard of the storage 材料氧化 The parts will be oxidated 5 未对保管条件进行管控 Have no keep the condition of the storage properly 2 2 IQC来料检查 部品规 格 外观符合BOM和 客户图纸要求 Inspection of the incoming material by the IQC specs exterior and the size etc according to the BOM and the drawing from the RD 供应商模具损坏 变形 或 者生产时工艺参数设定不 当 The mold may damaged or the process of the injection may incorrect 4 LED灯板刷锡膏 锡膏印刷位置 面 积正确且用量均匀 solder paste printing location size and the amount of the solder paste 印锡过厚 过薄 The solder paste may over or less 元件贴装后多锡或少 锡 The solder paster was too much or less after the mounted 5 刮刀磨损或压力不符 The squee was damaged or the pressure was not enough 3 5 1 印刷速度快 Printing speeds are too quick 2 补充锡膏量不足 Supplement of the solder paste is insufficient 3 5 钢网清洁不干净 stencil is unclean 3 锡膏搅拌不充分 The solder paster was not mixed properly 3 锡膏在钢网上放置时间过 长 The time of the solder paste on the SS mesh was too long 3 印锡漏印 偏位 No solder paste solder paste shift 元件贴装欠品 偏位 竖立 Parts missing shifting upright 6 钢网孔堵塞 The holes of the SS mesh was jammed 3 6 基板偏位 The PCB board was not fixed properly 3 锡膏规格用错 Wrong type of the solder paste 降低产品功能 The product function will be affected 7 操作员取用错误 Operator used wrong solder paste 3 5 灯板自动贴片 元件 贴装位置及极性正确 元件漏贴装 极性错 Missing components and wrong polarity during mounting 产品无功能 No function 8 元件贴装程序设置错误 Wrong SMT program 3 偏位 破损 Improperly location or damaged 产品性能不良 Poor performance 5 1 吸嘴不良 Nozzle was damaged 2 吸嘴高度设定不合理 The high of the Nozzle is incorrect 3 错料 Wrong component 产品无功能 No function 8 作业员上料错误 Operator was taken wrong component 3 LED贴装不到位 LED have no fixed properly 散热不好 产品寿命短 The heat disperse not properly life time of the lamp are shorter 8 元件贴装高度设定错误 SMD are set incorrectly 3 4 LED灯板刷锡膏 锡膏印刷位置 面 积正确且用量均匀 solder paste printing location size and the amount of the solder paste 印锡漏印 偏位 No solder paste solder paste shift 元件贴装欠品 偏位 竖立 Parts missing shifting upright 6 灯板检查 检查MC PCB元件漏贴装 错 件 极性错 贴偏 元件漏贴装 错件 极性错 Missing components incorrect component and wrong polarity during SMT 产品无功能 No function 8 元件贴装程序设置错误 Wrong SMD program 3 偏位 破损 Improperly location or damaged 性能不良 Poor performance 7 1 吸嘴不良 Nozzle was damaged 2 吸嘴高度设定不合理 The high of the Nozzle is incorrect 2 7 灯板校正过回流焊 inspection correction 1 The solder temperature was too low 2 回流炉传送速度过快 The PCB board transported too fast 3 基板变形 烧焦 破 损 PCB board will be distorted burning and damaged 产品无功能 No function 8 焊接温度设定过高 回流 炉传送速度过慢 Temperature set up high Transport slowly 2 8 送风冷却失败 Cooling failure 2 元件偏移 裂开 SMD shift and damaged 产品无功能 No function 8 1 回流炉温度设定不适当 Reflow Oven temperature settings inappropriate 2 识别精度下降 Identify precision lower 3 元件偏移 裂开 SMD shift and damaged 产品性能下降 Poor performance 6 3 锡珠 Solder ball 安全问题 Safety issue 9 钢网清洁不干净 SS mesh is unclean 3 锡珠 Solder ball异响 Noise5 3 8 点亮测试 Lighting test C PCB方向放错 The direction of the C PCB are wrong 产品损坏或 功能 无 法正常生产 Product damaged 8 操作人员测试方法错误 Operator s testing way is wrong 2 测试方法错误 判断 错误 The wrong testing way or wrong judgement 产品无功能或性能不 良产品流出 No function or defective products 7 1 作业员操作误 operate incorrectly 2 作业员误判 operator judged by mistake 2 9 灯板分板 PCBA Cutting C PCBA破损 C PCBA Damage 基板破损废弃 增加 成本 the C PCBA damage plus the cost 7 分板治具设计不良 对基 板施加压力不均 导致基 板破损 Put the pruess to C PCB by jig is no equality so the C PCB damage 2 10 MC PCB 元件检查 检查MC PCB元件漏 贴装 错件 极性错 贴偏 MC PCB components inspection check leakage MC PCB mount components wrong parts wrong polarity improperly location 元件漏贴装 错件 极性错 Missing components incorrect component and wrong polarity during SMT 产品无功能 No function 8 元件贴装程序设置错误 Wrong SMD program 3 偏位 破损 Improperly location or damaged 性能不良 Poor performance 7 1 吸嘴不良 Nozzle was damaged 2 吸嘴高度设定不合理 The high of the Nozzle is incorrect 3 7 灯板校正过回流焊 inspection correction Wrong SS mesh or the wrong program 3 13 DRIVER PCB自动贴片 元件贴装位置及极 性正确 Driver PCB SMT automatically correct location and polarity 元件漏贴装 极性错 Missing components and wrong polarity during SMT 产品无功能 No fuction 8 元件贴装程序设置错误 Wrong SMD program 3 偏位 破损 Improperly location or damaged 产品性能不良 Poor performance 5 1 吸嘴不良 Nozzle was damaged 吸嘴高度设定不合理 The high of the Nozzle is incorrect 3 12 DRIVER PCB 锡膏印 刷 锡膏印刷位置 面积正确且用量均匀 Driver PCB board Solder paste printing printing location size and the amount 印锡过厚 过薄 The solder paste may too much or less 元件贴装后多锡或少 锡 The solder paste may less or too much once the component was fixed 错料 Wrong component 产品无功能 No fuction 8 作业员上料错误 Operator was taken wrong component 3 14 DRIVER PCB 元件检 查 检查DRIVER PCB 元件漏贴装 错件 极性错 贴偏 Driver PCB components checking 元件漏贴装 错件 极性错 Missing components incorrect component and wrong polarity during SMT 产品无功能 No function 8 元件贴装程序设置错误 Wrong SMD program 3 偏位 破损 Improperly location or damaged 性能不良 Poor performance 7 1 吸嘴不良 Nozzle was damaged 2 吸嘴高度设定不合理 The high of the Nozzle is incorrect 3 15 DRIVER PCB过回流焊 回流炉条件符合要 求 Driver PCB board during the reflow solder The condition of the Reflow oven are as required 锡不充分融化 The solder paste was not fully melted 性能不良 Poor performance 7 1 焊接温度设定过低 The solder temperature was too low 2 回流炉传送速度过快 The PCB board transported too fast 3 基板变形 烧焦 破 损 PCB bending damage 产品无功能 No function 8 焊接温度设定过高 回流 炉传送速度过慢 1 Temperature set up high 2 Transport slowly 3 13 DRIVER PCB自动贴片 元件贴装位置及极 性正确 Driver PCB SMT automatically correct location and polarity 8 送风冷却失败 Cooling failure 3 元件偏移 裂开 The components was in wrong location and poor condition 产品无功能 No fuction 8 1 回流炉温度设定不适当 Reflow soldering temperature settings inappropriate 2 识别精度下降 Identify precision lower 3 产品性能下降 Poor performance 6 3 锡珠 Solder ball 安全问题 Safety issue 9 钢网清洁不干净 SS mesh is unclean 3 异响 Noise 5 3 16 DRIVER PCB 执锡检 查 修复 连锡 假 焊 虚焊等不良 The solder paste on the Driver PCB Repair skip miss ing welding incomplete weld etc 静电防护失效 Failed ESD protection 元件损坏 Parts was damaged 8 作业员未做静电防护 no ESD protection 2 铬铁接地失效 The soldering iron fail to meeting the grounding 元件损坏 Parts was damaged 7 铬铁没接地线或地线开路 The soldering iron has no contact the grounding or short circuit of the grounding 2 连锡等不良不能被检 出 Skip or joined between two parts can not detected 产品无功能 No function 8 1 作业员操作误 operate incorrectly 2 作业员误判 operator judged by mistake 3 15 DRIVER PCB过回流焊 回流炉条件符合要 求 Driver PCB board during the reflow solder The condition of the Reflow oven are as required 基板变形 烧焦 破 损 PCB bending damage 产品无功能 No function 产品性能不良 Poor performance 6 1 检查方法错误或不标准 Wrong methods of the inspection 2 目视判断困难 3 检查技 能不足 Visual inspection is difficult 3 leak of the inspection skill 3 17 預加工 Performing 零件Pin腳不符要求 The pin of commodity not match the specification Pin腳尺寸NG The dimension of the pin not match the specification 6 用錯治具 Use the wrong fixture 2 Pin腳受傷 Pin is broken 6 治具設計NG The fixture design NG 2 18 插件 Hand insert 漏插零件 No insert the commodity 产品性能不良 Poor performance 6 1 检查方法错误或不标准 Wrong methods of the inspection 2 目视判断困难 3 检查技 能不足 Visual inspection is difficult 3 leak of the inspection skill 3 16 DRIVER PCB 执锡检 查 修复 连锡 假 焊 虚焊等不良 The solder paste on the Driver PCB Repair skip miss ing welding incomplete weld etc 连锡等不良不能被检 出 Skip or joined between two parts can not detected 零件插反 Insert the commodity reversed 产品性能不良 Poor performance 6 1 检查方法错误或不标准 Wrong methods of the inspection 2 目视判断困难 3 检查技 能不足 Visual inspection is difficult 3 leak of the inspection skill 3 19 DRIVER PCB波峰焊 Driver PCB board during the wave solder 锡不充分融化 The solder paste was not fully melted 性能不良 Poor performance 7 1 焊接温度设定过低 The solder temperature was too low 2 传送速度过快 The PCB board transported too fast 3 基板变形 烧焦 破 损 PCB bending damage 产品无功能 No function 8 焊接温度设定过高 传送 速度过慢 1 Temperature set up high 2 Transport slowly 3 8 送风冷却失败 Cooling failure 3 元件偏移 裂开 The components was in wrong location and poor condition 产品无功能 No fuction 8 1 炉温度设定不适当 Reflow soldering temperature settings inappropriate 2 识别精度下降 Identify precision lower 3 产品性能下降 Poor performance 6 3 18 插件 Hand insert 20 DRIVER PCB 执锡检 查 修复 连锡 假 焊 虚焊等不良 The solder paste on the Driver PCB Repair skip miss ing welding incomplete weld etc 静电防护失效 Failed ESD protection 元件损坏 Parts was damaged 8 作业员未做静电防护 no ESD protection 2 铬铁接地失效 The soldering iron fail to meeting the grounding 元件损坏 Parts was damaged 7 铬铁没接地线或地线开路 The soldering iron has no contact the grounding or short circuit of the grounding 2 连锡等不良不能被检 出 Skip or joined between two parts can not detected 产品无功能 No function 8 1 作业员操作误 operate incorrectly 2 作业员误判 operator judged by mistake 3 产品性能不良 Poor performance 6 1 检查方法错误或不标准 Wrong methods of the inspection 2 目视判断困难 3 检查技 能不足 Visual inspection is difficult 3 leak of the inspection skill 3 21 电源板分板 D PCBA破损 D PCBA Damage 基板破损废弃 增加 成本 元件损伤影响功 能 the C PCBA damage plus the cost The components damage affect The Function 7 分板治具设计不良 对基 板施加压力不均 导致基 板和元件破损 Put the pruess to D PCB by jig is no equality so the D PCB and compontents damage 2 22 輸出線點固定膠 Dot fixed glue on output wire 漏點膠 No dot the glue 斷線 Wire Open 7 1 沒有依W I進行點膠 Not follow the W I to dot the glue 2 23 DRIVER PCB 测试 按正确方向放到测具 上做点亮测试LED点 亮时间要小于10秒 Driver PCB Testing Fix the Driver PCB on the testing fixture to light the LED the time for lightening LED has to be shorter than 10 seconds DRIVER PCB方向放错 Driver PCB fixed by incorrect direction 产品损坏或无功能 无法正常生产 No function 6 操作人员测试方法错误 Operator s testing way is wrong 3 输入 输出电流不在 范围内 Input and output current are not in the specified range 亮度不够或寿命短 Insufficient brightness or short lifetime 7 1 元件损坏 The parts damaged 2 元件参数不符合规格 The part parameter are not qualified 3 测试方法错误 判断 错误 The wrong testing way or wrong judgement 产品无功能或性能不 良产品流出 No function or defective products 7 1 作业员操作误 operate incorrectly 2 作业员误判 operator judged by mistake 3 24 D PCBA 暂存 D PCBA provisional preserving 元件性能损坏 The component has been damaged 无法正常工作 Can not performance well 8 1 存放环境温湿度不符 Storage temperature and humidity envsoldering ironment are inappropriately 2 没有防静电保护 No ESD protection 2 D PCBA 摆放混乱 D PCBA board not storage properly 元器件相碰损坏 导致 无功能 The components may damaged 7 产品无周转工具 No tool for the transport 2 25 移印 Date code Pad printing 移印错误 漏印 Wrong pad printing or no pad printing 无法追溯 Unable to track 5 1 机器操作不正确 he printing machine was not running properly 2 判断基准不明确 unclear judgement of criterion 3 设定参数不明确 incorrect set parameter 4 Date code 不清晰 Date code is unclear 产品外观不良 appearence defect 5 胶头有油污 Gluing head was unclean 4 26 铆压灯头 組裝 燈頭铆合NG Cap poor mounting 燈頭铆合扭力NG The torque force of Cap not match the specification 8 铆合治具調查不當 poor adjust the mounting fixture 2 8 铆歪 Mounting inclined 2 铆压变型 错位 产品无功能 No fuction 8 1 铆压定位不对 2 作业技能不足 3 27 焊LED线 红色和黑 色线分别焊到MCPCB 的 焊盘和 焊盘 Weld LED wires The white one needs to be welded to MCPCB and the gray one be welded to MCPCB 焊锡不熔化 线材假 焊 虚焊 Solder is not melting welding wire false 产品无功能 No function 8 1 烙铁温度过低 The temperature of iron is too low 2 作业技能不足 The operating skill was not enough 2 产品性能不良 Poor performance 6 3 PAD损坏 The pad was damaged 功能不良 影响品质 Poor function or affects quality 6 1 烙铁温度过高 Temperature of iron is too high 2 焊接时间过长 Welding time is too long 3 线材焊错位置 The wire was welded in wrong position 产品无功能 No function 8 作业错误 Wrong operating 3 锡点间连锡 Skip between two parts 产品无功能 烧毁产 品 No function and production will be damaged 8 作业技能不足 Short operating experience 2 铬铁碰到LED soldering iron was bump into LED LED烫坏 LED damaged 8 作业失误 Wrong operating 3 28 半成品外观检查 Appearance inspection with semi finished products 漏检或误判 missing inspection or misjudgement 不良流出 Defective products passed 6 1 检查方法错误或不标准 Improper or non standard inspection method 2 作业员检查员技能不足 The skills shortage of inspectors 3 29 半成品测试 测试数 据符合产品要求 Semi finished products testing The testig data needs to meet the requirements of product 输入电流不在范围内 Input current is over the range 亮度不够或寿命短 Insufficient brightness or short lifetime 7 1 元件损坏 The parts damaged 2 元件参数不符合规格 The part parameter are not qualified 3 27 焊LED线 红色和黑 色线分别焊到MCPCB 的 焊盘和 焊盘 Weld LED wires The white one needs to be welded to MCPCB and the gray one be welded to MCPCB 测试方法错误 判断 错误 The wrong testing way or wrong judgement 产品无功能或性能不 良产品流出 No function or defective products 7 1 作业员操作误 Operate incorrectly 2 作业员误判 Operator judged by mistake 3 30 老化测试 aging testing 漏检查 No inspection 不良流出 The defective product may can not found out before the shipment 7 异常电源停止 Abnormal power off 3 老化过程中产品损坏 Products damage during te life time testing 产品寿命短 short life time 7 1 元件损坏 The component damage 2 元件参数不符合规格 The component parameter are not in conformity with specification 3 31 成品测试 测试数据 符合产品要求 Finished products testing The testig data needs to meet the requirements of product 输入电流不在范围内 Input current is over the range 亮度不够或寿命短 Insufficient brightness or short lifetime 7 1 元件损坏 The parts damaged 2 元件参数不符合规格 The part parameter are not qualified 3 测试方法错误 判断 错误 The wrong testing way or wrong judgement 产品无功能或性能不 良产品流出 No function or defective products 7 1 作业员操作误 Operate incorrectly 2 作业员误判 Operator judged by mistake 3 29 半成品测试 测试数 据符合产品要求 Semi finished products testing The testig data needs to meet the requirements of product 32 成品外观检查 observational inspector 漏检或误判 missing inspection or misjudgement 不良流出 Defective products passed 6 1 检查方法错误或不标准 Improper or non standard inspection method 2 作业员检查员技能不足 The skills shortage of inspectors 3 33 包装 Packing 泡殼錯位 The blister is moved 客户投诉 Customer complains 6 吸塑卡放偏 The Blister card place the wrong location 3 漏装 short pack 操作疏忽 Operating mistake 彩盒内有异物 There are foreign materials in color box 作业台上有异物 含有其 它不相干物品 There are foreign body on work table incude the irrelevant things 外箱箱内有异物 There are foreign materials in outer container 漏贴贴纸 missing label 作业前与作业后识别不了 导致遗漏 Can t distinguish the worked products and not worked products then rusult in leakage Current Design or ProcessControls Prevention 现现行行设设计计控控制制预预防防 Current Design or ProcessControls Detection 现现行行设设计计控控制制探探测测 Detec tion 探探测测 度度 RPN Recommended Actions 建建议议措措施施 Responsibility Use hygroscope to monitor the humidity and temperature 2 使用空调系统 Using the air condition 每日确认温湿度计实际值并进行 记录 Check the humidity and temperature daily also make the record 220无 None CTQ尺寸列入IQC测量基准 书 CTQ size will be included in the IQC inspection stardand 1 IQC受入检查 IQC inspection Check the CTQ size if matched with the customer s requirements 2 装配前100 目视检查 CTQ尺寸 参考客供图纸 100 double check before the assembly 1 定期更换刮刀 安装前进 行确认 Repaire or change the squee regularly confirm before the installation 2 气压在 设备日常保养表 中 制造 成型条件确 认表 中确认 Reflect the pressure info in Day to day maintenance of the equipment and the Manufacturing and molding condition confirmation form 3 WI中体现锡膏印刷钢网厚 度以及刮刀类型 Remark the type of the blade and the thickness of the SS mesh 1 生产或更换型号生产时首件要做 锡膏厚度测试 Make a solder paste testing before each MP and different order 2依钢网操作指导进行确认 Confirm the testing result according to the operating instruction of the Stencil 3 定期保养钢网 Maintaining the Stencil regularly 4 追加手动清洁刮刀 Cleaning the squee manually 345无 None 1 WI中规定刮刀印刷速度 Identify the speed of the scraper in WI standard 2 规定锡膏一次加锡量为约 250g Keep the quantity of the solder paste approximately 250g each time 1 制造成型条件表中确认记录 Confirm the record in the Manufacturing and molding condition confirmation form 2 设定一次供给锡膏可印刷的块 数 Evaluate the qty of the PCB board for each supplement of the solder paster 345 无 None 设定每4H手动清洁钢网一 回 Clean the SS mesh every 4 hours manually SMT钢网 刮刀清洁记录表 Make the record of each cleaning 345 按照 锡膏管理基准书 作 业 Operating according to the Solder paste control standard 在锡膏使用管理表中记录 Make the record W I中规定锡膏未使用时在 钢网上放置时间 W I have no identify the time of the solder paste on the SS mesh 发生异常时及时处理确认 Take actions in time o