PCB-设计规范rev4(20050117)

HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 1 印刷電路板設計規範印刷電路板設計規範 Print Circuit Board Layout Rule HON HAI PRECISION IND CO LTD HSINCHU SCIENCE PARK BRANCH OFFICE PROPRIETARY NOTE This item is the property of Hon Hai Precision Ind Co LTD Taiwan and contains confidential and trade secret information This item may not be transferred from the custody of Hon Hai except as authorized by Hon Hai Precision Ind Co LTD and then only by way of loan for limited purposes It must not be reproduced in whole or in part and must be returned to Hon Hai Precision Ind Co LTD upon request and in all events upon completion of the purpose of the loan HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 2 設計規範修改履歷表設計規範修改履歷表 項目日期版本變更說明負責人 11999 12 200 無 覃桂芳 鄭雅慧 黃介彥 22001 12 111 1 重新檢討 SMT Wave Solder 與手焊設計規範 2 新增自動插件機設計規範 譚瑞梅 鄭雅慧 蔡育誌 周有麟 3 2002 8 12 1 修改 Chip R C Pad 設計 2 新增零件 Pad 設計 0 4mm Pitch QFP CSP MLFP Filter Crystal CP Point Transformer LED 3 新增無折斷邊設計規則 4 新增零件角度定義 5 修正 Fiducial Mark 設計 6 測試點規格變更 覃桂芳 鄭雅慧 蔡育誌 周有麟 42003 8 13 1 修改折斷邊導圓角 via hole 蓋綠漆原則 最小排版 尺寸 金手指 no used pin 取消 2 修改 SMT 零件 Pad 設計 3 新增撈孔裂片設計原則 4 新增 UV 點膠限制 5 新增 C 型螺絲孔設計 橢圓孔設計 Ring Pad 設計 PCB 表面焊接 Pin 與 Pad 尺寸 淚滴設計 覃桂芳 鄭長秦 黃介彥 蔡育誌 52004 11 18 4 1 增加英文對照 2 修改 1808 電容靠板邊設計條件 P14 3 修改金手指設計條件 P22 4 修改 V CUT 規格 P10 5 修改 Via hole 規格 P18 6 修改排板標準 P23 P24 P25 7 修改高壓電容底部撈孔限制 P26 8 修改 BGA 可不加辨識點條件 P30 9 修改 SMT 零件 Pad 設計 P38 P47 P53 P59 P60 10 增加 BGA CSP PCB 表面處理限制 P48 P49 11 刪除後焊屏蔽設計 增加易開罐式屏蔽設計 P61 12 修改背面印膠 PAD SIZE P68 P69 13 修改 Wave solder 與手焊設計規範 P72 P73 P77 79 P80 P81 P84 14 修改自動插件機設計規範 P85 P91 鄭長秦 黃介彥 蘇柄綺 吳瑞祥 葉霙秋 HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 3 目錄目錄 Table of Content 前言前言 Introduction PCB 機構設計機構設計 Mechanical Design for PCB 1 折斷邊設計 Break away Design Rule 1 1 定位孔 Tooling Hole 1 2 光學對位記號 Fiducial Mark 1 3 郵票孔 Routing Tab 1 4 V 形切槽 V Cut 1 5 PCB 板厚規格 PCB thickness 2 限制區 Limitation Restriction 2 1 機構限制區 Restriction for Mechanism 2 2 郵票孔限制 Restriction for routing tab 2 3 V cut 限制 Restriction for V cut 2 4 PCB 外形尺寸限制 Limitation for PCB Outline Dimension 2 5 銅柱製程限制 Restriction for Stand off Process 2 6 PCB 變形量限制 Limitation for PCB Warpage 2 7 PCB 外形缺口限制 含排版 Restriction for PCB outline Slot Hole including panelization 2 8 TRACE 限制 Restriction for Trace 2 9 VIA HOLE 設計 Restriction for Via Hole 2 10 測試點置放的規則及限制 Restriction for Test Point 3 金手指 Golden Finger 4 排版 Panelization PCB 零件設計零件設計 Component Design for PCB 5 零件擺置方向 Orientation of Component Placement 6 光學辨識點 Fiducial Mark on QFP Figure B NPTH please refer to Figure B 1 2 光學對位記號光學對位記號 Fiducial Mark 1 2 1 光學對位記號規格 如圖 A Spec for fiducial mark see Figure A Figure A 直徑為 1mm Cu pad 表面處理為化金 噴錫 化銀 OSP Dia 1mm Cu pad Surface treatment Immersion gold Immersion silver HASL OSP Figure A 直徑為 3mm Solder mask 黑化或粗糙面 Dia 3mm Solder mask Blacked or rough surface Figure A 直徑為 4 5mm 線寬為 1mm Cu circle 銅箔加蓋綠漆 Dia 4 5mm Width 1mm Cu circle Cu pad covered by solder mask 1 2 2 上層 Top Side 光學對位記號置放位置 如圖 B Figure B Position of fiducial mark on top side see Figure B Figure B 光學對位記號置放位置 請按圖面尺寸擺放 The position of fiducial mark please refers to Figure B Figure B 遮光銅箔 用來遮蓋下層的光學對位記號 為 5mm 5mm 銅 箔大小加蓋綠漆 Shadow pad is used to cover the fiducial mark on lower layer The size of it is 5 5mm pad with solder mask Figure B 平衡銅點 Dummy Pad 用來平衡電鍍的區域 其規格由各家 板廠自行製訂 但距離 V Cut 邊必須 1mm 開始鋪設 且每條板 邊皆須鋪設 鋪設的層數與設計使用層數搭配 如四層板則鋪 設四層 二層板則鋪設二層 依此類推 除特殊狀況另由 layout 工程師提供 否則皆以此規格製作 Balanced Cu pad is used to balance the electrical plating area and the specification is decided by PCB supplier The balanced Cu pad has to be arranged on 1 mm from the V cut edge and every dummy board has to have it The layers of balanced Cu pad depends on how many layers on this design For example the balanced Cu pad is four layers if it is 4 layers PCB Please follow this specification to make balanced Cu pad except for layout engineer illustrates specific design in advance Figure B 板邊規格一般以 10mm 設計 若為特殊狀況則以工程圖面製作 Normally Width of dummy board is 10mm Please follow engneering drawing if it is special case 1 2 3 下層 Bottom Side 光學對位記號置放位置 如圖 C Figure C Position of fiducial mark on top side see Figure C 規格同上層 光學對位記號及遮光銅箔置放的位置按圖面尺寸擺放 The specification is the same as it on top side Fiducial mark and shadow pad are arranged according to Figure C HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 7 另於下層需特別注意 光學對位記號距離平衡銅點至少需 2 5mm 如 Fig C Please notice the distance between fiducial mark and balanced Cu pad has to be at least 2 5mm see Figure C 1 2 4 折斷邊之角落導角以半徑 4mm 原則設計 The radius of corner on break away is 4mm 1 2 5 今後各排版圖之折斷邊則以此規格規範 除特殊設計另行規定標示於排版 圖上 故於排版圖上不再標示此規格中之尺寸 The break away must meet this specification and it is unnecessary to be marked on panel drawing HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 8 HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 9 HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 10 1 3 郵票孔設計郵票孔設計 Routing Tab 五個貫穿孔的郵票孔 其規格如圖所示 Five through holes on routing tab the specification is as below 1 4 V 形切槽設計形切槽設計 V Cut Design 其規格及在 PCB 上的應用 如圖所示 Specification and application on PCB are illustrated on below V CUT Specification FR 4 FR 4 FR 4 T 3 0mm 1 0mm T 0 8mm T 0 6mm t 0 4 0 1 t 0 3 0 1 t 0 3 0 1 CEM 1 FR1 FR2 CEM 1 FR1 FR2 CEM 1 FR1 FR2 CEM 1 FR1 FR2 T 1 6mm T 1 2mm T 1 0mm T 0 8mm t 0 7 0 1 t 0 6 0 1 t 0 4 0 1 t 0 4 0 1 CEM 3 CEM 3 CEM 3 CEM 3 T 1 6mm T 1 2mm T 1 0mm T 0 8mm t 0 6 0 1 t 0 5 0 1 t 0 5 0 1 t 0 4 0 1 0 0 1mm 上下刀偏差 Deviation between Upper and lower Knife t剩餘厚度 Thickness 30 45 T 0 5mm 30mm 1mm Max distance between two routing tabs HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 11 1 5 PCB 板厚規格板厚規格 PCB Thickness PCB Thickness Tolerance materialthicknessTolerance FR 4 FR 4 FR 4 FR 4 FR 4 FR 4 T 2 0mm T 1 6mm T 1 2mm T 1 0mm T 0 8mm T 0 6mm 0 2 0 15 0 12 0 1 0 1 0 06 CEM 1 FR1 FR2 CEM 3 T 1 0 1 6mm T 1 0 1 6mm 0 15 0 15 Notes FR 4 板厚大於 1 6mm 時 Tolerance T 10 For FR 4 PCB with thickness over 1 6mm the tolerance is T 10 FR 4 板厚 0 6mm 含 以下 使用郵票孔設計 For FR 4 PCB with thickness less than 0 6mm use routing tab HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 12 2 限制區限制區 Limitation Restriction 2 1 機構限制區 Restriction for Mechanism 以機構圖標示的區域為原則 Please refer to mechanical drawing 限高部份 標示區域尺寸及限高 包括正面及背面部份 Height limitation has to be illustrated on top and bottom side 禁止部份 標示區域尺寸 禁止走線 禁止擺放零件 Component and trace cannot be arranged on restricted area Sample 限制區示意圖 Restriction drawing 無折斷邊設計 Non breakaway design Unit mm Area TYPE ABCDProcess 140 2540 25SMT Dip C B D Reflow LIMIT2 0mm LIMIT 2 5mm LIMIT 3 0mm LIMIT0 0mm 15mm 15mm 50mm 20mm20mm20mm A C HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 13 有折斷邊及排版時 包含折斷邊尺寸 Panel array with break away design 單位 mm Area TYPE ABCDEProcess 10 50 250 50 251SMT Dip 2 2 郵票孔限制 Design rule for rounting tab 郵票孔不可在零件下 後焊零件 PHONE JACK 及客戶機構要求 除外 Routing tab can t be located under component except for touch up phone jack and customer mechanical request 郵票孔中心距離 Trace 邊緣至少 0 5mm Routing tab center must keep at least 0 5mm from any trace 郵票孔旁不可有螺絲孔 距離 1mm Routing tab can t be located near screw hole at least keep away 1mm Break away Restriction D A E 2 C E 2 E B E V cut 0 5mm 1mm 0 25mm 1 0mm HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 14 2 3 V cut 限制 V Cut requirement V cut 距離 Trace 邊緣至少 0 5mm V cut must keep away at least 0 5mm from any trace V cut 距離零件或 PAD 邊緣至少 0 5mm V cut must keep away at least 0 5mm from SMD pad 距 V cut 2mm 內之 0603 1206 電容 電感易 Crack 之零件應垂直 V cut 若無法垂直 則需在板邊撈孔 0603 1206 chip capacitor inductor within 2mm from V cut has to be perpendicular to V cut PCB has to be routed if the component cannot be perpendicular to V cut 距 V cut 5mm 內之 1808 2210 高壓電容應垂直 V cut 並在板邊撈孔 若無法垂直 V cut 應加大撈孔範圍並進行 Strain gage test 驗證 1808 2210 HV chip capacitor within 5mm from V cut has to be perpendicular to V cut and with routing hole on the PCB breakaway PCB has to be routed and verified by strain gage test if the component cannot be perpendicular to V cut 2mm V cut 5mm OK 14mm OK V cut 2mm V cut 2mm 0 5mm OK 3mm 2mm V cut 2mm OK OK V cut 5mm V cut 5mm 0 5mm OK3mm HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 15 2 4 PCB 外形尺寸限制 單位 mm PCB dimension unit mm 最小尺寸 50L 50W Minimum 50L 50W 最大尺寸 330L 250W Maximum 330L 250W 厚度限制 0 5 3 0mm Thickness 0 5 3 0mm 金屬基板相關尺寸公差 Tolerance on metal PCB a 板長 板寬 0 0 1 Board length and width 0 0 1 b Stand off 孔徑 hole diameter 4 4 0 1 0 Stand off hole diameter 4 4 0 1 0 c Stand off 孔徑中心至板邊距離 0 05 Center of Stand off hole to board edge 0 05 d Stand off 孔徑中心 Pitch 0 05 Stand off pitch 0 05 4 4 0 1 0 0 05 0 05 0 0 1 4 4 0 1 0 鋁板要求 HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 16 2 5 Stand Off 製程限制 Stand off 金屬基板 Stand Off 孔徑中心外 3 5mm 方形範圍內 如圖灰色部分 不 可置放零件 避免治具壓損零件 To avoid damage on component component cannot be placed on the area 3 5mm square from the center of the hole 3 5mm 3 5mm HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 17 2 6 PCB 變形量限制 PCB warpage 板彎 A B 小於或等於 7 1000 PCB warpage specification A B 7 1000 2 7 PCB 外形缺口限制 含排版 PCB outline For SMT Process 2 7 1 每單片內缺口長寬皆大於 10mm 以上需補缺口 Dummy board has to be designed on panel if the gap is larger than 10mm 2 8 TRACE 限制 Trace Connector Pitch 0 8mm 含 以下Connector Pitch 0 8mm a 兩個 Pad 間走線方式如左圖 禁止使用右圖之設計 亦不可鋪大 銅面 同時 Pad 與 Pad 間需覆蓋防焊漆 The trace linking two pads should follow left figure the layout shows on right figure are prohibited Large copper pad is also not allowed The space between two pads has to be covered by solder mask b 由 PAD 拉出之 TRACE 寬度須 PAD 寬度 The width of trace must be smaller than width of pad Bad design on trace Pad 禁止 Not allow 標準 Standard Trace 10mm 10mm 10mm 10mm HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 18 2 9 VIA HOLE 設計Via hole Via Hole 邊緣離 PAD 邊緣至少 8mil 且中間以綠漆隔開 Via hole should keep away at least 8mils from pad and it has to be covered by solder mask BGA 內部之 Via Hole 皆需塞孔蓋綠漆 Via hole on BGA area has to be covered by solder mask Via Hole 禁止設計於裸銅與非裸銅區中間 Via hole cannot be placed on the interface of exposed copper and solder mask Via Hole 塞孔設計時 孔徑不可大於 16mil For stuffed via hole the diameter of via hole has to be less than 16mil Via Hole 不塞孔設計時 綠漆距離 Via Hole 邊緣 2mil For non stuffed via hole the solder mask should keep away 2mils from via hole Via Hole Unit mil Pad A Drill B 44 32 28 24 24 20 24 14 12 10 8 8 2mil Solder mask Non stuffed Via Hole B A Solder mask PCB 8mil Stuffed Via Hole Dia 16mil Pad Solder mask Via Hole Dia 16mil Exposed copper Solder mask Via Hole 禁止 Not allow 8mil HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 19 2 10 測試點置放的規則及限制 Test point 1 原則上 每一 NET 至少須留一個測試點 未置放 ICT 點之 NET 須標明於 Layout Check List In principle each NET should keep a test point at least If the NET doesn t have ICT point it has to be marked on layout check list 2 如無法 100 置放 ICT 測試點 則以功能測試未含蓋零件優先置放 測試點 If ICT coverage is not 100 those components which function test can not be covered should place ICT test pad as high priority 3 測試點設計規範 Test point a 測試點邊緣離 Pad 至少 8mil 且中間以綠漆分隔開 The test point should keep at least 8mils from pad and it is separated by solder mask b 只有 SMT Process 之 via hole 若不當測試點 則需塞孔印防焊 漆若當測試點 則 via hole 做不塞孔設計 亦不印防焊漆 Via hole has to be covered by solder mask if it doesn t be used as test point Via hole used as test point cannot be stuffed and covered by solder mask c 含 Wave Solder Process 之 via hole 需印或塞防焊漆 且 via hole 不得作為測試點 需外拉出測試 Pad For the product treated by wave solder process via can not be test pad and has to be stuffed An independent test pad is required Via holeTest Pad 8mil Solder Mask Test Point Pad HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 20 印防焊漆定義 Printing solder mask definition 以印刷防焊漆方式覆蓋 ICT via hole 的非測試面 且防焊漆不可超出 另一平面 不可沾至 ICT 點 Using solder mask to cover the ICT via hole bottom and the solder mask cannot be over to the test point d 測試點直徑Test point diameter For pad design only Standard diameter 30mil Minimium diameter 20mil e 金手指可當測試點 Golden finger can be used as test point f DIP 零件 Pad 不可當測試點 Pad of dip component cannot be used as test point 4 點和點之間距最少為 50mil Space between two test points has to be at least 50 mils 5 點邊與零件邊之間距最少為 8mil The space from test point to component has to be at least 8mils 6 測試點盡量置放於同一面 因雙面治具成本加倍 For cost consideration test pads have better been placed on the same side 7 PCB 測試用定位孔要求 Alignment pin for ICT a 每一大片 PCB 須有 2 個以上定位孔 且孔內不可沾錫 At least 2 alignment holes are necessary in a panel and it has to be NPTH b 定位孔以對角線 距離最遠之 2 孔為定位孔 Alignment holes have to be set on diagonal and any two alignment holes with the longest distance are used for fixing PCB 8 PCB 改版時 ICT 點儘量不可更動 Don t move ICT test points as possible when PCB version is changed HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 21 3 金手指金手指 Golden finger 1 為避免於組裝時 金手指插入卡槽產生粉屑而造成金手指接觸不良 故於金手指到板邊以不印綠漆 Solder Mask 設計 To avoid that golden finger was polluted by peeled solder mask during the assembly process solder mask cannot be coated on the space from golden finger to board edge 2 金手指為考量導入卡槽 故以板邊磨斜邊的方式設計 Considering the easy assembly on socket the shape of board edge should be bevel 3 金手指表面以鍍金或化金設計 電鍍金厚度以 10 inch 化金厚度以 3 5 inch 為標準 若客戶有特殊需求以客戶需求設計 The surface finish of golden finger has to be plating gold or immersion gold The thickness of plated gold is 10 inch and the thickness of immersion gold is 3 5 inch Please follow customer s specification if they have any concern 4 via hole 之設計Via hole 若為 Mini PCI 則 via hole 邊緣須距離金手指 pad 上緣至少 10mil For Mini PCI the space from golden finger to via hole has to be at least 10 mils 若為 PCI 則 via hole 邊緣須距離金手指 pad 上緣至少 30mil For PCI the space from golden finger to via hole has to be at least 30 mils 5 內層銅箔設計 Inner copper 若為 Mini PCI 則內層銅箔鋪設離板邊至少 20mil For Mini PCI the space from inner grounding to board edge has to be at least 20 mils 若為 PCI 則內層銅箔鋪設離板邊至少 100mil For PCI the space from inner grounding to board edge has to be at least 100 mils 6 磨斜邊設計bevel edge 若為 Mini PCI 則斜邊至板邊規格為 7 3 4 mil 角度為 45 10 度 且金手指不可留導線 For Mini PCI the maximum space from bevel edge to board edge cannot be over 7 3 4mil The angle is 45 10 degree and no trace can be placed on golden finger 若為 PCI 則斜邊至板邊規格為 1 81 0 25 0 38mm 角度為 20 10 度 導線寬度設為 15mil For PCI the space from bevel edge to board edge has to be 1 81 0 25 0 38mm The angle is 20 5 degree and the width of trace is 15mils 7 為增加金手指於組裝過程中之良率 No Used 金手指應於 Lab 階 段前取消 若客戶指定不可取消另議 HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 22 To get high golden finger YR on assembly process the no used golden finder should be removed on Lab stage The golden finger will be keeped if customer request 8 金手指拉導線鍍金 其導線應靠左側邊緣 The Au plated trace connected with golden finger has to be closed to left side Moat 電源層銅箔 指 VCC 或 GND 向板內縮放尺寸 Powerpad VCC or GND offset dimension Golden Finger Mini PCI 7 3 4 mil PCI 1 81 0 25 0 38mm Mini PCI 45 10 PCI 20 10 A 10 inch Dimension has to be illustrated Board edge Moat width Mini PCI 20mil PCI 100mil Via Hole Covered by solder mask from this line Golden finger Mini PCI 10mil PCI 30mil HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 23 4 排版排版Panelization 當單片 PCB 的尺寸小於 80mm 80mm 時 必須排版 金屬基板除外 Except for metal PCB single panel which is smaller than 80mm 80mm has to be made panel array 若無折斷邊設計 Design without break away PCB 1 零件或 Pad 邊緣距傳送邊 4mm The space from component pad to the PCB edge must be 4mm 2 設計需考慮有零件面之板內對角置放兩個 Fiducial Mark 其中心 距傳送邊 5mm 且於製造文件上標示座標 FMA FMB 辨識點 建議位置為 10 5 Asymmetric design Frame Cover 最大尺寸為 45 45 mm 機台限制 超出此規格應分為多個設計 For mounter limitation the maximum size of single frame cover is 45mm 45mm Frame or cover over this specification has to be designed as multi frame cover 當相同位置正反面均有 Shielding 時 下列方案擇一 If shieldings exist on both sides of PCB choose one of below solutions a 第一面使用定位設計 第二面使用無定位設計 必須設計為方形 Shieldiing with tooling pin is implemented on first side and shielding without tooling pin is used on the 2nd side Shielding on 2nd side must be rectangle b 第一面 Frame Cover 使用定位設計且將第二面定位孔相對位置避開 二面 使用定位設計 Shieldings with tooling pin are implemented on both sides but the position of tooling hole must be different 在 Shielding 下的 via hole 間距必須 1 5mm 且應以雙面綠漆覆蓋 若 1 5mm 只能採背面單面塞綠漆 For the via hole under the shielding via to via space must be 1 5mm and cover by solder mask on both sides If via to via space is smaller than 1 5mm please cover solder mask on back side 非 Module 設計時 PAD 與零件 或零件 PAD 至少保持 1mm For Non modular design pad to part s pad must keep 0 5 mm at least 定位孔 Tooling hole 內部 Inner PAD 0 2 mm SMD Frame Grey Area 0 5 mm 預留 1 0mm PCB SMD 0 3 mm PAD Yellow Area 0 3 mm HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 61 在 Shielding 下的 Trace 每 4mm 長度應以 0 5mm 綠漆隔開 The trace under shielding should be covered by 0 5mm solder mask every 4mm trace 易開罐式易開罐式 Shielding Ring Pull Shielding 1 中心 6 6mm 處為置件機吸嘴吸著點 範圍 禁止開孔 For mounter pickup there is no hole within 6 6mm in the center of the cover 2 依設計需求 易開罐上孔洞尺寸為 1 0 2 0mm Max 為 2 0mm For design necessary the hole diameter of the ring pull shielding cover should be 1 0 2 0mm Max 2 0mm 3 每一鐵殼至少要有一個孔洞且中心距 斷差 2mm 距離 There is at least a hole in the cover and the center of the hole to the v cut must keep 2mm 4 零件與拉拔點孔洞需保持 2 mm 以上距離 The component to the pulling hole must keep at least 2mm 5 無法設計多區間屏蔽 The multi zonal ring pull shielding can t be designed 6 0 2mm 材質厚度的兩易開罐 間隙容忍值為兩 tooling hole 中心間距 1 6mm 以上 The distance between two ring pull shielding cover must keep at least 1 6mm for the cover material thickness 0 2mm 非對稱性定位孔 Asymmetric tooling hole 外部 outer PAD 0 65mm HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 62 9 其它其它 Others 零件實體下方不可設計印錫膏的區域 Thermo Pad 除外 Can not design solder paste area under component body except for Thermo pad SOT 89 SOT 223 IC 類等零件下方綠漆鋪設由 Pad 邊緣算 起最少 24mil For SOT 89 SOT 223 IC type component etc the solder mask under component must keep 24 mils from pad edge d 24mil HON HAI PRECISION IND CO LTD PCB layout rule doc rev4 63 WaveWave SolderSolder 與與 手手 焊焊 設設 計計 規規 範範 Design Rule for Wave Solder and Manual Soldering 10 一般性規格General specification 11 PCB 外形尺寸PCB Dimension 12 螺絲孔設計Design of Screw Hole 13 背面 SMD 印膠 P