SMT检验标准(PCBA)

检验项目 A 1 零件脚吃锡不足 SOP QFP Inspection Item A 1 Insufficient Solder SOP QFP Lead 允收标准 Accept Standard 吃锡应该达零件脚长的 1 2 以上及需有 爬锡的状況 Side joint length D is more than 50 of lead length L 拒收标准 Reject Standard 吃锡未达脚长 1 2 以上 Side joint length D is less than 50 of lead length L 检验项目 A 2 零件脚吃锡不足 PLCC SOJ Inspection Item A 2 Insufficient Solder PLCC SOJ Lead 允收标准 Accept Standard 吃锡高度 F 零件脚厚度 T 的 1 2 焊接物 G Heel fillet height F more than solder thickness G plus 50 Lead thickness T 拒收标准 Reject Standard 吃锡高度 F 零件脚厚度 T 的 1 2 焊接物 G Heel fillet height F less than solder thickness G 50 lead thickness T 检验项目 A 3 零件偏移 SOP QFP Inspection Item A 3 Component Shift SOP QFP 允收标准 Accept Standard 偏移 1 零件脚 W 超出 PCB 不可超过本体宽度 的 1 4 Component lead shift off the pad ut not exceed 1 4 width of lead width W 2 对于尺寸小于 0 5mm 之 QFP 零件偏移 量不可超过本体宽度的 1 2 The QFP component lead of pitch less than 0 5mm shift off the pad but not exceed 1 2 width of lead width 拒收标准 Reject Standard 1 零件偏离焊垫且零件与焊垫接触面积 C 占零件本体宽度 W 的 3 4 以下 Component lead shift off the pad andcontact the pad less than3 4 width of lead width W 检验项目 A 4 零件偏移 PLCC SOJ Inspection Item A 4 Component Shift 允收标准 Accept Standard 零件脚超出 PCB A 不可超过本体 1 4 W Component Lead shift off the pad but not exceed 1 4 width of Lead area W 拒收标准 Reject Standard 零件偏离焊垫且超出本体面积 1 4 W Component Lead shift off the pad and exceed 1 4 width of Lead area W 检验项目 A 5 零件偏移 Inspection Item A 5 Component shift 允收标准 Accept Standard 零件位於焊垫中心点 Component is on the center of pad 拒收标准 Reject Standard 零件偏离焊垫且超出本体宽度 1 4 Component body shift off the pad and exceed 1 4Width of body width 检验项目 A 6 吃锡过多 Inspection Item A 6 Excess Solder 允收標準 Accept Standard 吃锡带形状如锥形 The contour of soldering look like conic shape 拒收標準 Reject Standard 焊锡超过焊垫四周 Tin excess around of pad 锡过多结成球点 Tin too much look like ball shape 检验项目 A 7 立件 Inspection Item Tombstone Effect 允收标准 Accept Standard 零件位於焊垫中心点 Component is on the center of pad 拒收标准 Reject Standard 零件高翘造成电极端未吃锡 Chip components standing on their Terminal end tombstone 检验项目 A 8 反向 Inspection Item A 8 Component Reverse 允收标准 Accept Standard 方向零件依 PCB 上方向标示上件 The polarity component is inserted according with polarity index on PCB 拒收标准 Reject Standard 零件上件方向与 PCB 上方向标示不同 The polarity component is inserted reversing with polarity index on PCB 检验项目 A 9 空焊 Inspection Item A 9 Void Soldering 允收标准 Accept Standard 零件吃锡饱满 并延伸至焊垫边 Solder well and Tin extend over side of pad 拒收标准 Reject Standard 零件脚吃锡未连接焊垫 造成空焊 One lead or series of leads on component Is out of alignment and fails to make Proper contact with the land 检验项目 A 10 短路 Inspection Item A 10 Short Circuit 允收标准 Accept Standard 零件吃锡部份无任何短路 There isn t any short circuit on solder part of component 拒收标准 Reject Standard 零件吃锡部份造成短路 There is short circuit on solder part of component 检验项目 A 11 缺件 Inspection Item A 11 Omitting Part 允收标准 Accept Standard PCB 零件数目与 BOM 零件数目相符合 The component quantity of PCB have to match the component quantity on BOM 拒收标准 Reject Standard PCB 零件数目与 BOM 零件数目不符合 The component quantity of PCB don t match the component quantity on BOM 检验项目 A 12 多件 Inspection Item A 12 Excess Parts 允收标准 Accept Standard PCB 零件数目与 BOM 零件数目相符合 The component quantity of PCB have to match the component quantity on BOM 拒收标准 Reject Standard PCB 零件数目与 BOM 零件数目不符合 The component quantity of PCB don t match the component quantity on BOM 检验项目 A 13 掉件 Inspection Item A 13 Missing Parts 允收标准 Accept Standard PCB 零件数目与 BOM 零件数目相符合 The component quantity of PCB have to match the component quantity on BOM 拒收标准 Reject Standard 外力造成掉件 The component of external force makemissing parts 检验项目 A 14 焊垫吃锡不足 Inspection Item A 14 Insufficient Pad 允收标准 Accept Standard 吃锡带形状如锥形 The contour of soldering look like conic shape 拒收标准 Reject Standard 焊垫吃锡面积未达 75 以上 The solder area don t excess 75 of pad 检验项目 A 15 锡尖 Inspection Item A 15 Solder Icicle 允收标准 Accept Standard 零件脚无造成锡尖 There isn t any icicle on component lead 拒收标准 Reject Standard 零件脚造成锡尖 There is an icicle on component lead 检验项目 A 16 零件破损 Inspection Item A 16 Component Breakage 允收标准 Accept Standard 零件无任何裂痕或断裂 There isn t any breakage or break 拒收标准 Reject Standard 零件外部有刮 刺 割 碰等损伤 There is some scratch dub cut or bump damage on component appearance 检验项目 A 17 金手指缺点 Inspection Item A 17 Defect On Golden Finger 允收标准 Accept Standard 1 每面缺点不超过 3 根 单根不能超过两点 缺点单点不得大於金手指宽度 1 4 Every side of defect is less than 3 gold singers the gold singers is less than 2 point the point of defect is less than 1 4 wide of gold singer 拒收标准 Reject Standard 1 每面缺点超过 3 根 单根超过两点 缺点单 点大於金手指宽度 1 4 Every side of defect is more than 3 gold singers the gold singers is more than 2 point the point of defect is more than 1 4 wide of gold singer 检验项目 A 18 浮件 Inspection Item A 19 Floating 允收标准 Accept Standard 整个零件本体的长度全接触於基板面 The whole component body touches the PCB 拒收标准 Reject Standard 零件本体与基板面高度大於 0 5mm The nearest distance between component and PCB is more than 0 5mm 检验项目 A 19 锡渣 Inspection Item A 20 Solder Residue 允收标准 Accept Standard PCB 及零件皆无沾锡丝或锡渣 There isn t any solder wire or solder dregs on PCB or component 拒收标准 Reject Standard PCB 或零件沾有锡丝或锡渣 There is a solder wire or solder dregs on PCB or component 检验项目 A 20 锡珠 Inspection Item A 21 Solder Ball 允收标准 Accept Standard 1 锡珠直径 0 127mm 以下 及 PCB 每面 3 颗 锡珠以下 The diameter of solder ball is under 0 127mm and there are under 3 solder ball on one side of PCB 2 锡珠离焊垫或线路在在 0 127mm 以外 Solder balls beyond 0 127mm of lands or traces 拒收标准 Reject Standard 1 锡珠直径 0 127mm 以上 及 PCB 每面 3 颗锡珠以上 The diameter of solder ball is under 0 127mmand there over 3 solder ball on one side of PCB 2 锡珠离焊垫或线路在 0 127mm 以内 Solder balls within 0 127mm of lands or traces 检验项目 A 21 Inspection Item A 22 Other Body Adhere 允收标准 Accept Standard PCB 无结晶状异物及白包沉淀物 T