电子专业术语.doc

COB（Chip On Board） 通过帮定将IC裸片固定于印刷线路板上 COF (Chip On FPC) 将芯片固定于TCP上 COG (Chip On Glass) 将芯片固定于玻璃上 El (Electro Luminescence) 电致发光，EL层由高分子量薄片构成，用作LCD的EL光源 FTN (Formutated STN) 一层光程补偿片加于STN，用于黑白显示 LED (Light Emitting Diode) 发光二极管 PCB (Print Circuit Board) 印刷线路板 QFP (Quad Flat Package) 四方扁平封装 QTP (Quad Tape Carrier Package) 四向型TCP SMT (Surface Mount Technology) 表面贴装技术 TCP (Tape Carrier Package) 柔性线路板，IC可固定于其上 STN （Super Twisted Nematic） 带有约180度到270度扭曲向列的显示类型 tf (Fall Time) 响应速度：下降沿时间 TN (Twisted Nematic) 带有约90度扭曲向列的显示类型 TNR (Tn With Retardation Film) 一种彩色显示，它不采用彩色滤光片，而是在普通TN玻璃上 附加上光程补偿片 tr (Rise Time) 响应速度：上升沿时间 Vop (Operating Voltage) LCD驱动电压 Vth (Threshold Voltage) 阀值电压 lqianqin 2004-2-21BGA (Ball Grid Array)即BGA球栅列阵：集成电路的包装形式，输入输出点是在组件底面按栅格排列的锡球。Flip chip(倒装芯片) 一种无引脚结构，一般含有电路单元。emma_ma 2004-3-02P/N Part Number 材料编号P.R Purchase Request 请?单P.O Purchase order 订单PMC Production & Material control 生管&物控PM Project Management 整个生产管理MC material control 物控PC Production Control 生管 PL Project Leader 项目管理OM Order Management 订单管理PMP Project management plan 项目(订单)管理计划书COPP PVT Process Verification Test Pilot run试生产第一阶段MVB Mass Verification Board pilot run试生产第二阶段M/P Mass Production 量产CRP Capacity Requirements Planning 产能需求规划ERP Enterprise Resource Planning 企业资源规划BOM Bill of material 物料清单MPS Master Production scheduling 主生产排程MRP Material Requirement Planning 物料需求规划WIP Work in process 在制品FG Finished Goods 制成品EOL End of Life 产品寿命中止OEM Original Equipment Manufacture 委托代工ODM Original Design Manufacture 委托设计与制造AVL Approved Vendor List 具备资格/被认可的?S商名册SCM Supply chain management 供应炼管理SLM Supply Line Management 供应商管理ECN Engineer change notice 工程变更通知书SO Shipping order 装货通知单SA Shipping advice 出货通知SI Shipping invoice 正式的出货文件/发货单P/L Packing List 装箱单B/L Bill of leading 提货单/提单N/W Net weight 净重G/W Gross weight 毛重ETD Expected time of deliveng 预定出货时间ETA Estimate time of arrival 预定到达时间CAT Component approval team 零件承认组A/R Account receivable 应收帐款A/P Account payment 应付帐款T/T Telegraph transfer 电汇转帐(付款)ID Input duty 关税VAT Value add tax 增值税IQC Incoming quality control 进料质量控制IPQC In-process quality control 制程质量管理(产品未完成前)FQC Finish or final quality control 成品质量管理(成品未装箱前)QE quality engineering 质量工程FAE Finished application engineer 终端应用工程部门CPSR Customer product standard request 客户产品规格标准要求QA Quality assure 品质保证OQA Out-going quality assure 出货品质保证OQC Out-going quality control 出货质量管理TQM Total quality management 全面质量管理QIT Quality improvement team 质量改善小组QIP Quality improvement plan 质量改善计划CAR Correction action require 品质异常修正联络单SCAR Supplier correction action require 供货商质量改善联络单CLCA Close loop correction action 循环改善措施AQL Acceptable quality level 消费者可接受之最高不良率D/R Defect rate 不良率ISO International organization for standardization 国际标准组织PDM Product date management 产品数据管理系统PDCA plan-do-check-action 质量之PDCA管理模式PDSA Plan-do-study-action 质量之PDSA管理模式CLCA close loop correctine action 5S seiri/seiton/seiso/seiketsu/shitsuke PCB Printed circuit board 印刷电路板PCA Printed circuit assembly 印制电路插件M/B Mother