印刷电路板流程介绍1ppt课件

,教育訓練教材,講師:連聰仁,流程圖PCBMfg.FLOWCHART,顧客(CUSTOMER),工程製前(FRONT-ENDDEP.),裁板(LAMINATESHEAR),內層乾膜(INNERLAYERIMAGE),預疊板及疊板(LAY-UP),通孔電鍍(P.T.H.),液態防焊(LIQUIDS/M),外觀檢查(VISUALINSPECTION),成型(FINALSHAPING),業務(SALESDEPARTMENT),生產管理(P&MCONTROL),蝕銅(I/LETCHING),鑽孔(PTHDRILLING),壓合(LAMINATION),外層乾膜(OUTERLAYERIMAGE),二次銅及錫鉛電鍍(PATTERNPLATING),蝕銅(O/LETCHING),檢查(INSPECTION),噴錫(HOTAIRLEVELING),電測(ELECTRICALTEST),出貨前檢查(OQC),包裝出貨(PACKING&SHIPPING),曝光(EXPOSURE),壓膜(LAMINATION),前處理(PRELIMINARYTREATMENT),顯影(DEVELOPIG),蝕銅(ETCHING),去膜(STRIPPING),黑化處理(BLACKOXIDE),烘烤(BAKING),預疊板及疊板(LAY-UP),壓合(LAMINATION),後處理(POSTTREATMENT),曝光(EXPOSURE),壓膜(LAMINATION),二次銅電鍍(PATTERNPLATING),錫鉛電鍍(T/LPLATING),去膜(STRIPPING),蝕銅(ETCHING),剝錫鉛(T/LSTRIPPING),塗佈印刷(S/MCOATING),預乾燥(PRE-CURE),曝光(EXPOSURE),顯影(DEVELOPING),後烘烤(POSTCURE),多層板內層流程(INNERLAYERPRODUCT),MLB,全板電鍍(PANELPLATING),銅面防氧化處理(OSP(EntekCu106A),外層製作(OUTER-LAYER),TENTING,PROCESS,鍍金手指(G/FPLATING),鍍化學鎳金(E-lessNi/Au),ForO.S.P.,選擇性鍍鎳鍍金(SELECTIVEGOLD),印文字(SCREENLEGEND),網版製作(STENCIL),圖面(DRAWING),工作底片(WORKINGA/W),製作規範(RUNCARD),程式帶(PROGRAM),鑽孔,成型機(D.N.C.),底片(MASTERA/W),磁片,磁帶(DISK,M/T),藍圖(DRAWING),資料傳送(MODEM,FTP),AOI檢查(AOIINSPECTION),除膠渣(DESMER),通孔電鍍(E-LESSCU),DOUBLESIDE,前處理(PRELIMINARYTREATMENT),前處理(PRELIMINARYTREATMENT),前處理(PRELIMINARYTREATMENT),全面鍍鎳金(S/GPLATING),雷射鑽孔(LASERABLATION),BlindedVia,(1)前製程治工具製作流程,(2)多層板內層製作流程,MLB,DOUBLESIDE,BlindedVia,(3)外層製作流程,ForO.S.P.,(4)外觀及成型製作流程,典型多層板製作流程-MLB,1.內層THINCORE,2.內層線路製作(壓膜),典型多層板製作流程-MLB,4.內層線路製作(顯影),3.內層線路製作(曝光),典型多層板製作流程-MLB,5.內層線路製作(蝕刻),6.內層線路製作(去膜),典型多層板製作流程-MLB,7.疊板,8.壓合,典型多層板製作流程-MLB,9.鑽孔,10.電鍍,典型多層板製作流程-MLB,11.外層線路壓膜,12.外層線路曝光,典型多層板製作流程-MLB,13.外層線路製作(顯影),14.鍍二次銅及錫鉛,典型多層板製作流程-MLB,15.去乾膜,16.蝕銅(鹼性蝕刻液),典型多層板製作流程-MLB,17.剝錫鉛,18.防焊(綠漆)製作,.,15,.,16,典型多層板製作流程-MLB,15.浸金(噴錫)製作,乾膜製作流程,典型之多層板疊板及壓合結構,.,1.下料裁板(PanelSize),2.內層板壓乾膜(光阻劑),3.曝光,4.曝光後,5.內層板顯影,6.酸性蝕刻(Power/Ground或Signal),8.黑化(OxideCoating),7.去乾膜(StripResist),9.疊板,Layer1,Layer2,Layer3,Layer4,CopperFoil,CopperFoil,InnerLayer,Prepreg(膠片),Prepreg(膠片),10.壓合(Lamination),11.鑽孔(P.T.H.或盲孔Via)(Drill&Deburr),12.鍍通孔及一次電鍍,13.外層壓膜(乾膜Tenting),14.外層曝光(patternplating),15.曝光後(patternplat