LFstencildesign无铅工艺钢板设计规则PPT

StencilDesignRuleforLeadFreeProcess模板设计规则无铅工艺,MEC200PSE2008/8/21,總表1:1of3,總表2:2of3,總表3:3of3,注意事項:,1.鋼板開孔要避開Via孔.2.鉭容離Via孔至少10mil以上.3.貫穿孔零件,在開為甜甜圈時,外徑減內徑須大於等於12mil.4.關與鋼板架橋(1).甜甜圈架橋尺寸為10mil.(3等分)(2).銅柱架橋尺寸為12mil.(4等分)(3).零件與零件之間開孔安全距離須大於等於12mil,D=PCBPADsize(mil),BGA(pcbpad14mil)Stencildesignformula:Stencildesignsize1:1,PCBPAD,Stencildesign,15mil,15mil,BGA(pcbpad2排PINStencildesignformula:Stencildesignsize=L*WW=PCBPADwidthsize(w)-2L=PCBPADlengthsize(l)+4GNDpadL-gnd=PCBGNDPADlengthsize(l-gnd)-20milGNDpadW-gnd=PCBGNDPADwidthsize(w-gnd)-20mil(whenGNDsize120,則減40mil,whenGNDsize35*22mil(兩個)W=PCBPADwidthsize(w)-1.6(外移3mil)間距為15mil,PCBPADsize:(大PAD)78.7*31.5mil(小PAD)78.7*23.6mil,PCBPADsize:(大PAD)78.7*31.5mil(小PAD)35*22mil(兩個),銅柱Stencildesignformula:Stencildesignsize=L*Wmil(外徑)=Mask層數值+50mil(內徑)=Drill層數值-2mil廠商架橋時,間距應為12mil.,Ex:,PCBPADsize:(外徑)217mil(內徑)106mil,Stencildesignsize:(外徑)267mil(內徑)104mil,貫穿孔零件(SolderTail=round)Stencildesignformula:Stencildesignsize=外徑*內徑(外徑)=Mask層數值+5mil(內徑)=Drill層數值+7mil備註:(外徑)-(內徑)一定要大於或等於12mil,廠商架橋時,間距應為10mil.,Ex:,PCBPADsize:(外徑)50mil(內徑)36mil,Stencildesignsize:(外徑)55mil(內徑)43mil,功率晶體Stencildesignformula:Stencildesignsize=L*MmilW=不變L=PCBPADwidthsize(w)-5Mil(往極性方向減去5mil),Ex:PCBPADsize:104*56.65Mil,Stencildesignsize:104*51.65Mil,Connector零件(SolderTail=oblong)Stencildesignformula:Stencildesignsize=外徑*內徑(外徑)=Mask層數值+2mil(內徑)=Drill層數值+4mil架橋時,間距應為10mil.,Ex:PCBPADsize:(外徑)36*32mil(內徑)22*22mil,Stencildesignsize:(外徑)38*34mil(內徑)26*26mil,Connector零件(ODD)Stencildesignformula:Stencildesignsize=L*Wmil鋼板厚度:0.18mil,左邊小PINW=PCBPADwidthsize(w)8milL=PCBPADlengthsize(L)+2mil外凸2mil,下內側切齊,右邊小PINW=PCBPADwidthsize(w)4milL=PCBPADlengthsize(L)+5mil外凸5mil,下內側切齊,PCBPAD