FPC_中英文对照VIP

,FPC名词中英对照Qualitybeginswitheducation,andendsupwitheducation.,.,ManufactureProcedure制程,MaterialPreparation材料准备Panelization/Shear下料Drilling钻孔CopperPlating镀铜ElectrolessCopperPlating化学铜BlackHole黒孔SensitiveDryFilm干膜贴合Exposure曝光Developing显像Etching蚀刻DESStripping脱膜,.,CoverlayTacking贴保护膜Abrade粗化Lamination压着Curing熟化Brushing刷磨Pre-treatment前处理SurfaceTreatment表面处理Dryup干燥Micro-etching微蚀AcidCleaning酸洗WaterCleaning水洗Anti-corrosionTreatment防锈处理anti表示反对，抵抗,.,(Gold、Solder、Nickel)Plating电镀（金、锡、镍）FlashPlating/StrikePlating闪镀PatternPlate局部电镀ENIG:ElectrolessNickel/ImmersionGold化学镍金PrintingofLegend文字印刷BackBoardLamination补强板压着ElectricalTest电测LaserCut镭射切割AutomaticOpticalInspection（AOI）自动光学检验SurfaceMountingTechnology（SMT）表面贴装技术,.,Conductor导体,Conductor导体Open开路Short短路Nick缺口Pinhole针孔pin（针）+hole（洞）ExtraneousCopper铜刺copper（铜）+extraneous（额外的）Spur毛边Nodule结瘤,.,EtchedConcave表面缺口concave（凹的）Delamination分层Discoloration异色dis（否定前缀）+colorationDent打痕Scratch伤痕DentonCoverlay/Covercoat打痕ScratchonCoverlay/Covercoat伤痕Void缺胶Misalign偏移CoverlayBurr毛边,.,ForeignMatters异物,ConductiveForeignMatter导电性异物ConductorConductiveNon-conductiveForeignMatter非导电性异物non（否定前缀）同disBlisteringandDelamination起泡和分层Squeeze-outofAdhesiveofCoverlay溢胶Ooze-outofCovercoat覆盖涂层渗出SkippingofCovercoat覆盖涂层跳漏,.,SurfaceConditionofPlatedMetalandSolder电镀金属或焊锡的表面条件,GoldPlating镀金gold（金）+plating（电镀）GoldPlatingDefect镀金不良defect（缺陷、不良）TinPlating镀锡分解记忆同GoldPlating,.,DarkenedAppearance(BlackeningDiscoloration)变暗（变黑）PlatedExposeWetting电镀露铜Expose（暴露）exposure（曝光）PeeledOff剥离PlatedWicking电镀渗入NoPlating漏镀Rough电镀粗糙Wicking药水渗入,.,VisualInspectionofEdgesofOutlinesandHoles外形和孔边缘,TearandNick撕裂和缺口ThreadyBurr丝状毛刺Warpage弯曲、变形PoorMicro-joint微连结不良joint（连结）OutlineMisalign外形偏移NoOutline外形漏冲BendingLineMisalign反折偏移,.,VisualInspectionRelatedtoStiffenerBonding补强,ForeignMatterFPC与补强板之间的异物Void气泡Chip-off缺角Deformation变形,.,AffixedSubstancesontheSurface表面附着物,ThermosettingAdhesive热固胶PSA-PressureSensitiveAdhesive压敏胶FluxResidue助焊剂残渣Residue（残渣）ResidueofMetalPowders金属粉末残渣Powder（粉末）ResidueofAdhesive粘结剂残渣,.,Marking标记,Thickness厚度ComponentHole元件孔ViaHole导通孔ViaHoleMisalign导通孔偏移MountingHole组装孔SMT(S-Surface；M-Mounting；T-Technology),.,ConductorWidth导体宽度width（宽）length（长）height（高）thickness（厚度）ClearancebetweenConductors导体之间的间距DistancebetweenHoleCenters孔中心间距MinimumDistancebetweenBoardEdgeandConductor板边和导体之间的最小距离minimum（最小）maximum（最大）WrongMarking标记错误UnclearLetter字符不清晰un为否定前缀，同dis、non,.,PositionalAccuracy定位精度,PositionalAccuracyofHole孔的定位精度RegistrationofHoletoLand孔与焊盘的重合性RegistrationofCoverlay(orCovercoat)toLand覆盖层与焊盘的重合性Registration重合性,.,RegistrationofStiffenertoFPC补强板与FPC的重合性,RegistrationofHole孔的重合性RegistrationofOutline外形的重合性RegistrationofPunchedOutlinetoConductorPattern冲外形与导体图形的重合性Punch冲切RegistrationofPressureSensitiveorThermosettingAdhesivetoFPCandStiffener压敏胶或热固胶与FPC和补强板的重合性PressureSensitive压敏胶；orThermosettingAdhesive热固胶PlatingThicknessofCopperPlated-throughHole镀通孔的镀铜层厚度,.,BoardType板,SingleSidedFlexBoardS/S单面板DoubleAccessorBack-baredFlexBoard单面双接触板DoubleSidedFlexBoardD/S双面板Rigid-flexBoard软硬结合板BareBoard空板,.,Die模具,DieDrawing模具图纸MassProductionDie量产模具Mass（大量的）PrototypeDie样品模具SteelDie钢模Die刀模TopDie上模BottomDie下模WireCut线切割,.,OutlineDie外形模具PressureSensitiveAdhesiveDie胶纸模具StiffenerDie补强模具SilverDie银浆模具Post导柱Punch冲头Pin销钉,.,Jig(Fixture)治具,ElectricalTestJig电测治具TackingJig假贴治具ExposureJig曝光治具ScreenPrintingFrame丝印网框,.,Hole孔,GuideHoleforExposure曝光定位孔GuideHoleforDie模具定位孔GuideHoleforTacking假贴定位孔GuideHoleforAdhesive贴合定位孔GuideHoleforElectricalTest电测定位孔GuideHoleforScreenPrinting丝印定位孔LiftedLand孔环StannizeHole渗锡孔FittingHole装配孔,.,Material原材料,CopperFoil(Cu)铜箔EDElectroDeposit电解铜RARolledAnnealed压延铜CVLCoverlay保护胶片BaseMaterial基材FCCLFlexibleCopperCladLaminate挠性覆铜板,.,PIPolyimide聚酰亚胺PETPolyesterFilm聚酯FR4Fiberboard玻纤板SheetSteel钢片PSA（PressureSensitiveAdhesive）压敏胶ReleasePaper离型纸Stiffener补强,.,FPCReliabilityTestItems,TestingofElectricalPerformance电气性能SIRSurfaceInsulationResistance表面层绝缘电阻DielectricWithstandingVoltageofSurfaceLayers表面介质层耐电压强度Withstanding承受TestingofMechanicalProperty机械性能测试PeelStrength剥离强度,.,Pull-outStrengthforPlainHolesandFootprints孔和焊垫的拉脱强度Footprints脚印，足迹PlatingAdhesion镀层附着力(Ad)Adhesive接着剂Solderability可焊性FlexuralEndurance耐弯折性EnvironmentalPerformance环境性能TemperatureCycle温度循环HumidityTest湿度测试ThermalShock冷热冲击,.,Migration迁移性ChemicalResistance耐化学性Cleanliness清洁度FlameResistance阻燃性ShearTest推力测试HandsetRenovateTest翻盖测试WindowBendTest窗口弯折测试SlidingTest滑盖测试Slide滑动，滑行,.,PullStrengthTest焊点拉伸强度测试Pull:拉Push：推Salt（盐）Fog（雾）TestCrossSection切片检测Section区域PlatingThickness镀层厚度ConstantTemperatureandHumidity恒温恒湿Constant恒定的，常数FoldFatigueTest翻折疲劳测试DimensionalStability尺寸安定性Ductility延展性,.,Others其他,Temperature温度Humidity湿度Pressure压力LineWidth/Space线宽/线距Pitch线路间距Connector连接器(abbr.Conn.）Capacitance(C)电容Capacity容量Resistance(R)电阻Diode（D）二极管ESDElectro-StaticDischarge静电,.,Shortage短装MixedPacking混装AQLAcceptableQualityLevel品质允收标准Traveler流程单BoundarySample限度样本Checklist检查清单TrackingList追踪表TrendChart走势图Foolproofing/Bakayoke防呆法Shielding屏蔽层,.,常用缩写,质量管理五大工具APQP:AdvancedProductQualityPlanning产品质量先期策划SPC:StatisticalProcessControl统计过程控制FMEA:FailureModeandEffectAnalysis失效模式和效果分析MSA:MeasurementSystemAnalysis测量系统分析PPAP:ProductionPartApprovalProcess生产件批准程序,.,油墨1.EMIElectro-MagneticInterference电磁屏蔽膜2.S/R/S/MSolderResistance/Mask阻焊油墨3.PSRPhoto-sensitiveSolderResistance感光油墨4.Silver银浆,.,IC封装形式BGABallGridArray球栅阵列结构QFNQuadFlatNo-leadPackage方形扁平无引脚封装QFPPlasticQuadFlatPackage方型扁平式封装技术CSPChipScalePackage芯片尺寸封装TSOPThinSmallOutlinePackage薄型小尺寸封装,.,RMAReturnMaterialAuthorization退货授权MRBMaterialReviewBoard材料审查会议ECNEngineeringChangeNoticePCNProcessChangeNotice工序变更通知CTECoefficientofThermal