入门级专业英文词汇.ppt

Page:1/15,PCB入门级专业英语词汇,编制:工程MI组,日期:2013-11-15,Page:2/15,物料篇,Laminate层压板Basematerial基材CCL(Copper-cladlaminate)覆铜板PP(Prepreg)胶片,预浸或半固化片,常用的有1080/2113/2116/7628等.Resin,EpoxyResin树脂,环氧树脂Wovenglassfabric玻璃纤维布Core芯板Copperfoil铜箔,主要使用的铜箔有HOZ/1OZ等.Rolledcopperfoil压延铜箔THE铜箔(Hightemperatureelongationelectrodepositedcopperfoil)高延展性电解铜箔KraftPaper牛皮纸Peelablemask兰胶Kaptontape高温胶Carbonink碳油,Page:3/15,Soldermask/Solderresistink阻焊油墨Thermosettingtypeink热固化油墨Silkscreen/Componentmark/Legend字符Solder,Tin/Leadsolder焊料,铅锡焊料Drillbit,Routbit/millingcutter钻咀,锣刀,铣刀Chemical化学的Dryfilm干膜,是一种能感光,显像,抗电镀,抗蚀刻之阻剂TG(TemperatureofGlassTransition)玻璃态转换温度CTE(CoefficientofThermalExpansion)热膨胀系数CTI(ComparativeTrackingIndex)相对漏电指数Anti-CAF(conductiveanodicfilament)耐离子迁移Dielectricconstant介电常数(DK/Er)TD(TemperatureofDecompose)热裂分解温度RoHS(RestrictionofHazardousSubstancesDirective)危害性物质限制指令(Lead铅,Mercury汞,Cadmium镉,Chromium(VI)六价铬,Polybrominatedbiphenyls(PBBs)多溴联苯,Polybrominateddiphenylethers(PBDEs)多溴联苯醚),Page:4/15,工艺篇,Laminatecutting开料,裁板Baking烤板Desmear除胶渣PTH(Plated-Through-Hole)镀通孔,也指沉铜Plasmacleaner等离子清洗Panelplating全板电镀,也叫整板电镀Patternplating图形电镀Imagetransfer图形转移TinStripping褪锡Etching蚀刻Undercut侧蚀SES褪膜-蚀刻-褪锡连线(碱性蚀刻线)DES显影-蚀刻-褪膜连线(酸性蚀刻线)Etchingfactor蚀刻因子(蚀刻系数),主要用来衡量侧蚀量的大小,蚀刻因子=2*铜厚/(下线宽-上线宽),Page:5/15,Soldermaskprinting印阻焊Exposure曝光UVcureUV固化(ultraviolet)LPI(LiquidPhotoImage)液体感光成像Developing显影Silkscreenstencil丝印钢网，简称丝网Aluminumsheet铝片Scrubbing磨边DIwater纯水,去离子水(Deionization),由树脂对无物理大颗粒的水体进行阴阳离子的吸附,常见的有钙离子/氯离子/镁离子等HASL(HotAirSolderingLevel)喷锡,热风整平LF-HASL(leadfree-hotairsolderinglevel)无铅喷锡ENIG/Immersiongold沉金(沉镍金,ElectrolessNickel/ImmersionGold)ENEPIG(electrolessnickelelectrolesspalladiumimmersiongold)沉镍钯金HDI(HighDensityInterconnector)高密度互连,Page:6/15,Flashgold水金(电薄金)Hardgold厚金ImmersionTin沉锡OSP/Entek(OrganicSolderabilityPreservatives)有机保焊剂,防氧化处理Immersionsilver沉银Pressingprocess压合工艺Brownoxidation棕化Layerup叠层,预叠板Laminationstructure压合结构LASER(LightAmplificationbyStimulatedEmissionofRadiation)镭射,激光Registration对准，对位,Page:7/15,OPE(OptilinePostEtch)內层蚀刻对位冲孔机Rivet铆钉/铆合Fusion热熔X-ray,X射线CCD(ChargeCoupledDevice)电荷耦合器件X-Ydimensionmachine二次元Label,Barcodelabel标签,条码标签V-cut/V-score刻槽Rout锣槽,锣板Routing布线(route的ing形式),也指锣槽,锣板Punch冲板/啤板AOI(AutomatedOpticalInspection)自动光学检查Fly-probetest飞针测试UltrasonicCleaning超声波清洗Microetching微蚀AspectRatio纵横比,厚径比,一般指板厚与最小孔孔径的比值,Page:8/15,工程篇,Gerberdata:Gerber资料OriginalGerber原稿WorkingGerber工作稿，生产稿Specification规格,规范Fabricationdrawing制作图纸Purchasingorder定单Technicalcard/form技术卡/表单Pad焊盘Isolationpad孤立焊盘Groundlayer接地层Powerlayer电源层Signallayer信号层Dielectric介质层Impedance阻抗Single-endimpedance/Characteristicimpedance特性阻抗Differentialimpedance差分阻抗,Page:9/15,Coppercircuits线路Soldermaskopening阻焊开窗Solderdam/soldermaskbridge阻焊桥ThermalVia导热孔,散热孔Teardrop泪滴Annularring焊环Beveling斜边Chamfer斜边,倒角Clearance清除(通常在内层指隔离环clearanceland,在阻焊指开窗soldermaskclearance)Viaholes导通孔Componentholes元件孔BGA(BallGridArray)矩阵式球垫表面装组件IC(IntegratedCircuit)集成电路器Pitch节距,比如IC的节距,就是ICpad的中心距离VIP,ViainPad,盘中孔,Page:10/15,SMD(SurfaceMountDevice)表面贴装组件(零件)SMT(SurfaceMountingTechnology)表面贴装技术THT(Throughholetechnology)通孔插装技术Artwork底片,菲林Break-awayarea/panelrail工艺边Panel/Set/array套板Panelization排版Componentside元件面Solderside焊接面Soldering/Assembly装配Fiducialmark光点,定位光学点,用于装配时定位Slot槽FPC(FlexiblePrintedCircuits)软性电路板(软板)挠性印制板RigidPCB硬板Rigid-FlexPCB软硬结合板Semi-FlexPCB半挠性板FR-4(FlameResistantLaminates)耐燃性积层板材,Page:11/15,Goldfingers金手指Connector连接器Press-fithole压接孔,一般孔径公差要求严,插件的脚一般不需要焊接Stamphole/threadhole/mousebite邮票孔Blindhole盲孔Buriedhole埋孔Toolinghole工具孔,一般为NPTHX-out打X板,即有缺陷的板Counterbore沉头孔Countersinking锥型扩孔，嗽叭孔Drillmap/Drilldrawing/Holechart孔图SPC(StatisticalProcessControl)统计制程管制Green绿色glossgreen光亮绿色mattegreen/dullgreen哑光绿色Compensate补偿,Page:12/15,品质篇,Tolerance/outoftolerance公差/超出公差Dimension尺寸Delamination分层,多指多层板的金属层与树脂之间的分离而言Dent凹痕/凹陷Wrinkle皱褶/起皱Holebreakout孔破Void空洞Nick缺口Pinhole针孔Wicking灯芯效应Cleanliness清洁度IonCleanliness离子清洁度Etchback凹蚀NegativeEtchback负凹蚀,灯芯效应,Page:13/15,Electricaltest电测试Roughnessofholewall孔壁粗糙度Shelflife保质期(沉金,喷锡板12个月,OSP,沉银,沉锡6个月)Inspection检查visualexamination目视检查Thermalshocktest热冲击测试Solderabilitytest可焊性测试Edgediptest浸锡测试Solderfloattest浮锡测试Wavesoldertest波峰焊测试WettingBalance湿润平衡Conductorwidth导体宽度(线宽)Conductorspacing导体间距(线距),Page:14/15,Bowandtwist板弯板翘Scratch刮痕,刮伤Measling白斑Split裂纹Repair/rework