杜邦产品介绍(3).ppt

IntroductiontoFlexibleCircuitMaterials,Presentedby:JonathanC.Li,m,PartII:(40minutes),簡報大綱,軟性電路板基材之介紹基材的主要CompositionDielectricSubstrates(絕緣體)Adhesive(膠質)Conductor(導體),m,簡報大綱(continue),杜邦產品壓克力膠系列(ModifiedWAAcrylic)之基材環亞樹脂膠系列(ModifiedEpoxy)之基材杜邦料號解說PyraluxTelcam,m,軟性電路板之主要基材,CopperCladLaminates(銅箔基材)Single-SidedC.C.L.(單面銅箔基材),Adhesive,Conductor,DielectricSubstrate,m,Double-SidedC.C.L.(雙面銅箔基材),Conductor,DielectricSubstrate,Adhesive,軟性電路板之主要基材,m,Adhesive-LessC.C.L.(無膠銅箔基材),DielectricSubstrate,Conductor,軟性電路板之主要基材,m,Coverlay(覆蓋膜),軟性電路板之主要基材,m,Stiffner(補強材),軟性電路板之主要基材,DielectricSubstrate,Adhesive,m,Bondply,DielectricSubstrate,Adhesive,Adhesive,軟性電路板之主要基材,m,Mylar,Adhesive,Kapton,Adhesive,SheetAdhesivePhotoImageableCoverlay(PIC)DryFilmFine-LineApplicationCameraAutomotiveOthers,軟性電路板之主要基材,m,DielectricSubstrates,DefinitionAbasefilmonwhichtheprintedconductorsarelaid.Afilmwhichprovideselectricalinsulationbetweenconductors.Afilmwhichprovidesmechanicalstrengthofthecircuit.,m,必備之特性MechanicalStrengthFlexibilityDimensionalStabilityDielectricPropertiesThermalPropertiesChemicalResistanceMoistureAbsorptionCost,DielectricSubstrates,m,Substrates之種類PolyimidePolyesterFluorocarbonAramidPaperComposite,DielectricSubstrates,m,Polyimide:PopularizedbyDuPontunder“Kapton”AlsoknownasPIFirstchoiceoffilminmostFPCInfusibleandflameretardantHighTg(約260C-280C)Gooddimensionalstability,Substrates,m,Substrates,Polyester:PopularizedbyDuPontunder“Mylar”AlsoknownasPETLowestcostdielectricmaterialMostlyusedinlow-costconsumerapplicationGoodmechanicalpropertiesBadthermalproperties,m,Substrates,AramidPaper:SoldunderDuPonttradename“Nomex”UsedinspecializedapplicationGoodthermalinsulationmaterial,m,PropertyPolyesterPolyimideFluorocarbonAramidPaperComposite,TensileStrengthExcellentExcellentFairGoodBest,FlexibilityExcellentExcellentExcellentGoodFair/Good,Dim.StabilityFair/GoodGoodFairGoodFair/Good,DielectricStr.GoodGoodVeryGoodVeryGoodGood,SolderibilityPoorExcellentFairExcellentExcellent,C.O.T.(C)105200-230150-180220105-180,ThermalExp.LowLowHighModerateLow,Chem.Resist.GoodGoodExcellentVeryGoodFair,MoistureAbsorp.VeryLowHighVeryLowVeryHighLow,CostLowHighHighModerateModerate,TradeNameMylarKaptonTeflon/TedlarNomex,DielectricSubstrates,m,Adhesive,DefinitionMaterialthatbondslayerstogetherThermosettingThermoplastic,m,Adhesive,必備之特性AdhesionStrengthFlexibilityChemicalResistanceThermalResistanceMoistureAbsorptionElectricalPropertiesCost,m,Adhesive,Adhesive之種類PolyesterAcrylicEpoxyPolyimideButyralPhenolic,m,Adhesive,Polyester:UsedwherethedielectricisalsopolyesterUsedwherenosolderingisneededTypicalapplication:InstantcamerafilminterconnectsInstrumentclusterconnectioninautomobiles,m,Adhesive,Acrylic:UsedindemandingtemperaturerequirementapplicationMostpopularacrylicsystemisPyraluxbyDuPontExcellentadhesion,m,Adhesive,Epoxy:WidelyusedadhesivesystemGenerallylowercostthanacrylicAbletostandwavesolderingGoodinhightemperatureforlongperiodoftime(400to450F),m,Adhesive,Polyimide:UsedinadhesivelesscclandcoverlayUsedwheredimensionstabilityiscriticalUsedinhightemperatureapplicationHighmoistureabsorption,m,Adhesive,Polyester,Acrylic,Epoxy,Polyimide,ButyralPhenolic,Temp.Resist.,Chem.Resit.,Elec.Prop.,Adhesion,Flexibility,Cost,Moisture,Fair,Good,Excellent,Excellent,Excellent,Low,Fair,VeryGood,Good,Good,Excellent,VeryGood,Good,Good,Good,Good,Good,Excellent,Excellent,Excellent,Good,Good,Good,Good,Good,Good,Moderate,Fair,Fair,VeryHigh,Poor,Fair,Fair,High,Moderate,Poor,m,Conductors/Foil,MajortypesofconductorsMetalsMetalalloysconductiveinksCopper(themostcommonlyusedconductorinFPC)Electrolyticallydepositedcopper(ED)RolledAnnealedcopper(RA),m,Conductors/Foil,必備之特性Current-carryingcapacityFlexibilityServicetemperatureChemicalresistanceMechanicalstrengthCost,m,Conductors/Foil,ElectricalProperties,ThermalProperties,MechanicalProperties,RelativeCost,Aluminum,Copper,Gold,Nickel,Silver,Excellent,Good,Excellent,Excellent,Excellent,Excellent,Excellent,Excellent,Good,Good,Good,Good,Good,Fair,Fair/Good,Fair,Fair,VeryGood,VeryGood,Best,m,軟板基材製造過程,CopperRoll,KaptonRoll,CopperCladLaminate,Heater1,Heater2,LiquidAdhesive,Aging,m,IntroductiontoDuPontProducts,m,PartIII:(15minutes),DuPontProductFamily,PyraluxPyraluxFRPyraluxLFPyraluxAPPyraluxPC,TeclamTeclamFNCTeclamDNC,Pyralux,FR-series(AcrylicBased)Copper-CladLaminatesPanelFormPackaging.(24”x36”)ULApproved.(File#E124294)VeryGoodFlexureEnduranceEx.FR9111,FR9110,FR8510,FR8515CoverlayRollFormPackaging.(24”x250)ULApproved.(File#E124294)ExcellentDimensionalStabilityEx.FR0110,FR0210,m,Pyralux,FRcontinue.SheetAdhesiveRollFormPackaging.(24”x250)ULApprovedEx.FR0100,FR0200BondPlyRollFormPackaging.(24”x250)ULApprovedEx.FR0111,FR0212,m,Pyralux,LF-series(AcrylicBased)MilitarySpecificationsExcellentFlexureEnduranceVeryGoodforHigh-DensityCircuitrySameProductOfferingsasFR-seriesPC-series(Acrylic,urethane,&imide-based)DryFilmPhotoimageableCoverlayCameras&AutomotiveApplications,m,PyraluxP/Ns,FR9111,CuPICu,7-Specialconstruction8-1/2oz.C.C.L.9-1ozormoreC.C.L.,5-1/2oz.Cu1-1oz.Cu2-2oz.Cu,1-1milPI2-2milPI3-3milPI,FRLFAP,Copper-CladLaminates,m,PyraluxP/Ns,FR0111,Adh.PIAdh.,FRLFAP,7-Specialconstruction0-CoverlayorSheetAdhesive,1-1miladhesive2-2miladhesive3-3miladhesive,1-1milPI2-2milPI3-3milPI,Coverlay&SheetAdhesive,m,Teclam,FNC-seriesCopper-CladLaminatesULApprovedGoodFlexureEnduranceRollFormPackaging(250/500mmx100M)Ex.FNCRA110,FNC110CoverlayULApprovedRollFormPackagingEx.FNCC510,FNCC510-20,m,DNC-seriesULApprovedLeastRepellencyGoodPeelingStrengthExcellentHeat&HumidityResistanceExcellentTransparencySam