CaseStudyEBC SeminarSH_seminar_CaseStudy_MD140_TC404_LORD985_EP20_340_ME543

Ingot-GlassBondingAdhesiveLORD985硅棒玻璃粘接胶LisaLi_Fairfield,LORDChinaEBCDistributorShanghaiSeminarAug2.2012,SolarCellmanufacturingflow,LORD985粘棒胶应用在硅片生产工艺中。,3,LORD985A/B使用步骤,LORD985测试,混合比1:1配比，抹在硅棒表面LORD985胶水。胶水混合均匀呈墨绿色。硅棒施胶一面压在玻璃板上，施加适当压力，排除气泡，使胶水均匀分布在玻璃板上。等待15分钟左右，胶水初步固化。46小时室温固化后，上机切割。,硅棒在机器内切割完成。,4,LORD985A/B使用步骤,LORD985测试,切割完成后，准备温水冲淋,冲淋去除切削液，无硅片掉落,准备热水脱胶，条件70度10%柠檬酸,1015分钟以后，硅片从玻璃板上落下，无任何胶水贴附在硅片上。,5,LORD985A/B使用步骤,LORD985测试,硅片被冲干净后，放入纯水中，清理残胶，并垒成堆。,清理完成的硅片,总体切割效果很好，仔细观察硅片的边缘（粘胶面那端），有明显的亮点和缺口，跳线或者线抖动造成的缺陷。,Whatdocustomerscareabout?,1.不掉棒，不掉片2.无崩边，无线痕3.方便操作，容易脱胶4.无刺激气味,Competitionsituation,目前最主要的竟争对手：杭州得力,Productfeaturecomparison,LORD985Valueproposition,出片率高，成品良率多晶90%，单晶97%以上,Customerevaluation,协鑫GCL：最大的硅片切割企业，香港上市常州天合光能：整个产业，美国上市企业河北晶龙：最大的单晶切割企业，整个产业国内硅片生产企业几百家，只要生产，必须使用，消耗材料，市场很大。,其它产品需求,1.粘工件板与玻璃板的胶（水煮胶）环保的趋势,AnyQuestions?,12,ValueSellingcase:TPMSApplication,乾创,LORDChinaEBCDistributorShanghaiSeminarAug2.2012,14,CaseBriefDescriptionWhatismarket?汽车胎压计系统Whatisapplication？灌封/粘结Picture?,LORDSolutionWhatiscustomersrequirement?1：与外壳紧密粘接（PA66/FG15)2：不影响无线信号3：防水4：高低温（-40125摄氏度）5：低密度，轻量化6：UL-V07：固化速度尽量快8：外观平滑（自流平）WhatistheproductLordoffered?EP20环氧胶+固化剂,16,ValueSelling,WhycustomerselectLordsolution?1：Lord产品密度轻2：信号功能好3：固化剂有多种选择4：有相关行业应用。Whatdocustomerdocareabout?1：信号功能2：防水防震性能3：密度4：行业应用,Competitivesituation,Productfeaturecomparison?1：Lord粘接和固化性能好2：防震性能相对聚氨酯差Price?略高于硅胶和聚氨酯产品Whatconcernwehavetoday?1：硬度2：成本3：交期Othersolution?找到相对硬度低一些的产品补充,AnyQuestions?,18,LORD340Application,Fairfield,LORDChinaEBCDistributorShanghaiSeminarAug2.2012,Description,Thermoset340isaveryheavilyfilledepoxyresinformulatedtoprovidemaximumthermalconductivity,excellentelectricalinsulation,andoutstandingmechanicalproperties.Thermoset340resinoffersaverylowcoefficientofthermalexpansionandisappropriateforapplicationswheretheexpansionandcontractionofanepoxyencapsulationsystemmustbemaintained.ElectronicpackagesencapsulatedwithcuredThermoset340aredifficulttore-enter.,Thermoset340resinmaybemixedwithanyofThermosetshardenerstoobtainavarietyofhandlingandcuredproperties.WhenusedwithThermosetNo.70hardener,340resinisanUnderwritersLaboratoriesrecognizedmaterialundertheComponents-PlasticsClassificationas94HBat0.011inches.,Application,LEDTUBE,LEDBLUBLAMP,竞争情况,硅胶客户用硅胶进行粘接，国内厂家如武汉回天、广州恒大等。导热硅脂在部分不需要粘接的结构上，使用导热硅脂进行导热，而粘接则采用卡口或是螺丝进行固定。对手有道康宁、武汉回天、广州恒大等。,LORD340的优势,与其他类型的硅胶和导热硅脂对比具有导热和粘接双重功能。1.4W的高导热型的环氧树脂。已通过ULHB认证。适合大规模的流水线生产。,AnyQuestions?,28,CaseStudyforME-543ApplicationElitbond,LORDChinaEBCDistributorShanghaiSeminarAug2.2012,30,Productuse：ME-543（Underfill）BGAchipisplacedontopoftheFR4substrates.Itwillbeusedinflip-chipmounting.SolderbumpshavebeenpreparedonICpads.Bumpwidthis85umwhilebumpheightis60um.Center-to-centerpitchofICpadis125um.Diesizeis2449x3824um.,32,Thegapheightislessthan20um.CustomerhastriedLoctiteFP4530.TheflowabilityofFP5430isacceptablebutitdoesnothavethermalconductivity.ME-543underfillisusedforthermalconductivityandbumpprotectionpurpose.Unfortunately,ME-543cannotflowundertheflipchipbecausethefillersizeistoolargetoenterintothegap.(Seebelowdiagrams)CustomerplantolayoutanewPCBwithgapheight