胶粘剂介绍--Panacol产品篇11

胶粘剂介绍-产品篇1Panacol电子胶的应用,XingyuanLiao,27.05.2020,Foundedin1978,aninternationalcompanyIn2008becameamemberofHonleGroup,Panacol-ElosolGmbH,2,Panacol概况,来自德国的胶粘剂专家Panacol(隶属HoenleGroup)，专注于胶粘技术的工业应用，自1978年成立以来在电子、汽车、医疗器械等领域获得广泛的认同，Panacol已经成为日益增长的全球工业胶粘剂市场的活跃供应商，拥有包括紫外固化胶粘剂、结构胶粘剂到硅胶的完整胶粘剂系列，同时提供点胶配件和UV固化设备。,Applicationrangeandfeature,应用范围芯片粘接天线触点连接倒装芯片各向异性粘接高频屏蔽三维模塑成型（3D-MID）,性能特点不含铅、不含溶剂可在较低温度（低于200C）下固化无需改变生产过程的设备在温度骤变时具有很好的弹性热稳定性好无析出,SmartCardsandinternalStructures,AdhesiveforSmartcard,Vitralit1650UVcuringonecomponentepoxyresinHighflexibility,lowTgLowioniccontentGoodenvironmentalresistanceVitralit1680UVandheatcuringonecomponentepoxyresinHighTg,lowioniccontentLowwaterabsorption,goodacidresistanceLowcoefficientofthermalexpansion(1),Vitralit1688UVcuringonecomponentepoxyresinLowwaterabsorption,goodchemicalresistanceOutstandingmechanicalpropertiesLowwarpage,lowcoefficientofthermalexpansionVitralit1671OnecomponentframematerialwithgoodedgestabilityUVandheatcuringatlowtemperatureLowioniccontent,lowwaterabsorptionGoodthermalconductivity,具体应用线路板组装PCBAssembly,主要产品表面涂敷ConformalCoating贴片胶SMDadhesives芯片包封Glob-top倒装芯片底部填充胶FlipchipUnderfill元器件固定胶Silicones产品特点导热或导电UV或加热固化各向同性或各向异性胶领先的设备技术全方位的技术及产品服务,AdvantagesSuitableforsmall-andlarge-seriesproductionProcessingwithdispenser,inscreenprintingandpintransferUV-curingorcurableatroomand/orhightemperatureSimpleprocessing,27.05.2020,8,ProductsofPanacol:ApplicationsaroundPCB,27.05.2020,9,SMD-adhesivesVitralit5607,Structalit5604,Structalit5605Stx-501139,501149and510829(fastcuring)ConformalCoatingVitralit2007F,2008,2009FGlob-Top/Dam&FillVitralit1671,1692,1650,1680,structalit5892Vitralit631591,631591LVStructalit8805ElectricallyconductiveElecolit3012,3043,3653,3601,3603(UVcurableACA)ThermalconductiveElecolit6601,6603,3653Vitralit6138,ApplicationsaroundPCB,27.05.2020,10,ElectricallyConductive,27.05.2020,11,ThermallyConductive,27.05.2020,12,Vitralit6104VTprotectionagainstvibrationInlineproductioncuring15secuvpostcure120C,ApplicationsinEletronics,27.05.2020,13,ConformalCoatingMaterial,具体应用芯片包封Chipencapsulation,芯片包封保护芯片和金线UV或者加热固化单组份环氧树脂不含游离离子，具有导热性良好的耐酸性，低吸水性可选黑色推荐产品：PanacolVitralitVi1671,Vi1650,Vi1680,Vi1688等。,具体应用围堰与填充DamandFill,围堰与填充适用于细间距元件保护芯片和晶线UV或者加热固化单组份环氧树脂不含游离离子，具有导热性良好的耐酸性，低吸水性可选黑色推荐产品：PanacolVitralitVi1671.,具体应用天线印刷Antennaprinting,天线印刷导电胶适合主动和被动元件在3DMID区域接触式印刷厚膜浆料适合丝网印刷UV固化产品适合RFID推荐产品：PanacolElecolitEL3043,EL414等。特性不含溶剂，含银填料导电胶低温快速固化优异的填充性能,27.05.2020,17,UV固化设备介绍,BluepointLEDbluepointLEDhasbeendevelopedforallapplicationsrequiringamostintensiveUVirradiation.Thankstoitshighintensityandthepossibilitytoprogramcompleteprocesssequences,e.g.exposureserieswithdifferentintensitiesandholdingtimes,itispossibletorealiseshortestcycleandmachinethroughputtimesespeciallyinfullyautomatedproductionlines.,27.05.2020,18,UV固化设备介绍,LEDPowerlineTheLEDPowerlineisahigh-performancearraywithalltheadvantagesofLEDtechnology:Extremelylonglastinglifetimeandtheydonotrequireheatinguporcoolingphases.TheLEDPowerlineisavailableinwavelengthsof365/375/385/395/405nm.Thisvarietyallowsadjustmentofthewavelengthtotheappropriateapplication.TheLEDPowerlineisavailableindifferentlengthsfrom80mm-in40mmstepsvariableuptoalength1m.,27.05.2020,19,UV固化设备介绍,UVAPRINTHPVAcompacthigh-intensityUVcuringunitwithCAD-designedreflectorgeometryguaranteeingoptimumUVyield.Spectraandarcl