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SMTPCB/Panellayout,SMTTeam2015-03-22,PCBDesignGuideline,Revisionrecord,Purpose, basedontherequirementsofproductprocess inthelayoutandcircuitboarddesignprocess,Thereisastandardtofollow, toachieehighefficiencyintheproductofassembly,Easyassembly,lowcost,andhighequalitytarget.thecontecontingsonalapplicabletotheree somareforareferorreferenceonline .content, pcbplathreletrulestextmarkingforssilkscreenlayerrpcbfiduisallemarchidedpcbprackfidedpothesmtcomponentadesignpthcomponentpaddess designtracedesignotherlimitation,PCBlayoutrules, v-cutlayoutrule : chips tov-cutlineshouldbemorethan1mm otherwissewilldamagechipsorwillchangetousestampcutdesign, willaddthepcbcostthedistancestopcbedge 0.5 mm,cannotlayoutthetrace,thedistancetopcbedge 1.0 mm,cannottrothetatenycomponenttthedistthe cannottrothecomponentsheightover 25 mm,otherwisecuterwilldamagecomponents, pcblayoutrules v-cutlayoutrules : pcbtracetov-cutshouldbemorethers=0.5 mmsafetypebuffer otherwissewilllhavetheriscktodamagethethethets CB thickness 1.0 mmto3mm (1.0 mmto 0.5 mmsmtplatlet ) pcboutlineissquarretyprectangletype irregularshapecannotusethev-cut,irregularshape stampd design : stampdesignonlyforregularpcb,pcbtopcblayoutdistanceis2mm v-cut only0.3mmstampdesignparameters,PCBlayoutrules, v-cutvsstamplayout : pcstopcsdistancesonly 0.3 mm forv-cut, wecansavethepcblayoutcoststampcutdesign pcbpcstopcsdistancesis2mmbebaseonsamepcsdesignwithdifferentcuttype (stamp/vcut ), thepcbcostwillmpact 10-25 % v-cutpcbwillbecutbymachine butstampcutwillbrokenbyopandhavestthendamagethecomponents,V-Cutmachine,PCC whyd dontchoosesinglelecbforssmtprocess 3360 weneedtoputtonhesinglecboncarrierwhendostprocessbutcarrieraveandsinglecbhavetoleran erpassteprintingmisalignmentthenwillgettheshift/tommy bstoneprosesssusemeitinsinglecbliftupfromsmtcarrieranwillavethechipsmounting missionprocessissues putthesinglepcbonthecarrier,PCB/panellayout, factorysofimpactpcbcostpcblayoutsfinepitchcomponentspanelv-cut/stamps cut/ppcpcontrecomperedgesizepcbdrillholesize/quantitypcbmaterialcostpcbprocesseasy/complicated,processspecpcbsurfacefinishedpressoimpactcost,OSP/IMS/EING/IMTPCBoutline, regularshapeischeaperthanirregularshape,Textmarkingforsilklayer, the current situation : wereceivedthegerberfileforukdesignteam nosilklayerrbefoundwecannotdirectlyconfigpolarityofcomponenttont cannotconfirmthelocationofcomponentt,heproductiondjustntx, yordireationandconfigurationthellocompleryelyonengineingrawings,Bigwasteoftime .Nosilklayersinthegerberfile,Notextmarkonthepcb Textmarkingforsilklayer,astheicontextmarkingsdesignwecanaccept.wecancquilityprocentionloctionwherethereareproblems .silkscreen Textmarkingforsilklayer,componentoutlineph=0.40.5 acceptable; PH320、Otherlimitation、 pipepartslimitalloffthethougholepartmustbedesignedinsecondtoavoidtheuseohshondollenterprocesthefirstsurfaceisnecessrytouseth le partspinandpartsbodycannotoutstandpcbsecondsurfacethespecifiedofpcbsurfaceinprocess : pin lengthPCB thickness0.30.6mmthein ilt,dumpingoreasytoloosestate .Otherlimitation,Otherlimitation,choosethecomponent : theuseofchipcomponentsinthemtstageasfa redectthwasteofhumidaction .PTHpartstoSMD,PTHpartstoSMD,PTHpartstoSMD,Otherlimitation, notraccesetingormumprossprocessonmassproductionmodels .pcbpadsizeshouldbethatwiththesizeofcomponents,ifthesamepartshavediffe thertoractorcordoringoprocesprolssalstospeciallayout,mustconformtherule。alloffpaddesignneedtonon-soldermaskadesign.passiveconmentdexthegeneralrlccomponentt:placoutlineareadonotoverlap,donotoverlap, other limitation forcomponenthigherthan5mm,needtokeepamedistance/clearancesoncbsurfacefreefromcomponenttoavoidshadffeaturesandca Otherlimitation、Gerberfilelayersrequirement、SMD layer :组件pad、referethislayerdsignedenstencilapert、 gerberfilelayersrequirement silk layer : smdcompontenttemsmargeingincludebodyoutline,pinassignment,componentname,polarity
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