PCBA可制造性设计规范PPT课件

SMTPCB/Panellayout，SMTTeam2015-03-22，PCBDesignGuideline，Revisionrecord，Purpose， basedontherequirementsofproductprocess inthelayoutandcircuitboarddesignprocess，Thereisastandardtofollow， toachieehighefficiencyintheproductofassembly，Easyassembly，lowcost，andhighequalitytarget.thecontecontingsonalapplicabletotheree somareforareferorreferenceonline .content， pcbplathreletrulestextmarkingforssilkscreenlayerrpcbfiduisallemarchidedpcbprackfidedpothesmtcomponentadesignpthcomponentpaddess designtracedesignotherlimitation，PCBlayoutrules， v-cutlayoutrule : chips tov-cutlineshouldbemorethan1mm otherwissewilldamagechipsorwillchangetousestampcutdesign， willaddthepcbcostthedistancestopcbedge 0.5 mm，cannotlayoutthetrace，thedistancetopcbedge 1.0 mm，cannottrothetatenycomponenttthedistthe cannottrothecomponentsheightover 25 mm，otherwisecuterwilldamagecomponents， pcblayoutrules v-cutlayoutrules : pcbtracetov-cutshouldbemorethers=0.5 mmsafetypebuffer otherwissewilllhavetheriscktodamagethethethets CB thickness 1.0 mmto3mm (1.0 mmto 0.5 mmsmtplatlet ) pcboutlineissquarretyprectangletype irregularshapecannotusethev-cut，irregularshape stampd design : stampdesignonlyforregularpcb，pcbtopcblayoutdistanceis2mm v-cut only0.3mmstampdesignparameters，PCBlayoutrules， v-cutvsstamplayout : pcstopcsdistancesonly 0.3 mm forv-cut， wecansavethepcblayoutcoststampcutdesign pcbpcstopcsdistancesis2mmbebaseonsamepcsdesignwithdifferentcuttype (stamp/vcut )， thepcbcostwillmpact 10-25 % v-cutpcbwillbecutbymachine butstampcutwillbrokenbyopandhavestthendamagethecomponents，V-Cutmachine，PCC whyd dontchoosesinglelecbforssmtprocess 3360 weneedtoputtonhesinglecboncarrierwhendostprocessbutcarrieraveandsinglecbhavetoleran erpassteprintingmisalignmentthenwillgettheshift/tommy bstoneprosesssusemeitinsinglecbliftupfromsmtcarrieranwillavethechipsmounting missionprocessissues putthesinglepcbonthecarrier，PCB/panellayout， factorysofimpactpcbcostpcblayoutsfinepitchcomponentspanelv-cut/stamps cut/ppcpcontrecomperedgesizepcbdrillholesize/quantitypcbmaterialcostpcbprocesseasy/complicated，processspecpcbsurfacefinishedpressoimpactcost，OSP/IMS/EING/IMTPCBoutline， regularshapeischeaperthanirregularshape，Textmarkingforsilklayer， the current situation : wereceivedthegerberfileforukdesignteam nosilklayerrbefoundwecannotdirectlyconfigpolarityofcomponenttont cannotconfirmthelocationofcomponentt，heproductiondjustntx， yordireationandconfigurationthellocompleryelyonengineingrawings，Bigwasteoftime .Nosilklayersinthegerberfile，Notextmarkonthepcb Textmarkingforsilklayer，astheicontextmarkingsdesignwecanaccept.wecancquilityprocentionloctionwherethereareproblems .silkscreen Textmarkingforsilklayer，componentoutlineph=0.40.5 acceptable； PH320、Otherlimitation、 pipepartslimitalloffthethougholepartmustbedesignedinsecondtoavoidtheuseohshondollenterprocesthefirstsurfaceisnecessrytouseth le partspinandpartsbodycannotoutstandpcbsecondsurfacethespecifiedofpcbsurfaceinprocess : pin lengthPCB thickness0.30.6mmthein ilt，dumpingoreasytoloosestate .Otherlimitation，Otherlimitation，choosethecomponent : theuseofchipcomponentsinthemtstageasfa redectthwasteofhumidaction .PTHpartstoSMD，PTHpartstoSMD，PTHpartstoSMD，Otherlimitation， notraccesetingormumprossprocessonmassproductionmodels .pcbpadsizeshouldbethatwiththesizeofcomponents，ifthesamepartshavediffe thertoractorcordoringoprocesprolssalstospeciallayout，mustconformtherule。alloffpaddesignneedtonon-soldermaskadesign.passiveconmentdexthegeneralrlccomponentt:placoutlineareadonotoverlap，donotoverlap， other limitation forcomponenthigherthan5mm，needtokeepamedistance/clearancesoncbsurfacefreefromcomponenttoavoidshadffeaturesandca Otherlimitation、Gerberfilelayersrequirement、SMD layer :组件pad、referethislayerdsignedenstencilapert、 gerberfilelayersrequirement silk layer : smdcompontenttemsmargeingincludebodyoutline，pinassignment，componentname，polarity