铝基板制作流程.ppt

,A+PCBElectorics(ShenZhen)Co.,LTD,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,一、鋁基板制程1、噴錫流程：來料檢查一次沖/鑽孔圖形轉移圖形檢查蝕刻退膜蝕檢阻焊制作打定位孔字符制作噴錫噴錫檢查單面磨板（依客戶要求而定）V-CUT/成型通斷測試高壓測試FQC、FQA包裝入庫,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,2、OSP流程来料检查一次冲/钻孔图形转移图形检查蚀刻退膜蚀检阻焊制作打定位孔字符制作V-CUT/成型测试FQC、FQAOSPFQC包装入库,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,二、制程制作事项2.1来料检查IQCA、铜面检查：不允许有凹坑、擦花和严重氧化痕迹；Cusurfacecheck:Notches,scratchesandseriousoxidationarenotallowed.B、保护膜检查：保护膜不应有破损至铝面露出；Protectivefilmcheck:ProtectivefilmmustntbebrokenwithCuexposure.C、厚度检查：按流程卡要求检测板厚、铜厚。Thicknesscheck:CheckboardthicknessandCuthicknessaccordingtolotcard.,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,2.2一次冲/钻孔One-timeHole-punching/drillingA、一次冲/钻孔主要冲管位孔和工艺孔，孔位和孔徑均要符合图纸要求；One-timehole-punching/drillingismainlytopunchorientation-holeandtechnicalhole.Thehole-positionandhole-diametermustbeconsistentwithdrawingrequirement.B、冲/钻板方向为从铜面到铝面，可有效避免铝面擦花；Punching/drillingdirectionisfromCusurfacetoAlsurface,whichcaneffectivelyavoidscratchesofAlsurface.,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,2.3、图形转移ImageTransferA、磨板Scrubbinga、为提高干膜和保护膜面的结合力，防止保护膜面干膜、脱落，可轻磨保护膜面；InordertoimprovethecombinationofdryfilmIfetchingwasnotwelldone,re-etchisneededquickly.,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,2.7蚀刻检查EtchingCheckA、绝缘层上的任何地方都不允许用刀片来刮；Usingknifetoscratchanypartoftheinsulatedlayerisnotallowed.B、主要检查短路、缺口、开路，报废单元不能钻孔，只能用黑油笔打“”；Mainlycheckshortcircuit,gap,opencircuit.Abandonedunitmustntbedrilledandcanonlybemarkedwith“X”byblackoil-pen.,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,2、8阻焊制作SolderMaskMakingA、单面磨板（线路面），不允许板面有氧化和胶渍现象；Single-sidescrubbing(circuitside).Oxidationandgluestainsontheboardsurfacearenotallowed.B、待板子冷却至室温后印阻焊Printsoldermaskaftertheboardiscooledintoroomtemperature.C、待铝基板冷却至室温后，方可对位曝光；RegisterandexposealuminousPCBafteritiscooledintoroomtemperature.a、对位前应认真检查板面是否有感光油堆积及不均匀，如有且多则应及时返工；Beforeregistration,itisnecessarytoseriouslycheckifthesensitizationoilaccumulatesontheboardsurfaceorisuneven.Ifthereisalotofsensitizationoilontheboardsurface,itmustre-processsuchboardsintime.b、对位时应注意菲林与板面MARK点的同心度；Duringregistration,itisnecessarytopayattentiontotheconcentricityofthefilmandmarkpoint.,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,D、曝光：ExposingE、顯影：DevelopingF、檢查：重點檢查顯影不淨和綠肥油上焊盤；Check:MainlycheckuncleandevelopingandsoldermaskonthePAD.G、無特殊要求的板在顯影后須撕掉鋁面保護膜，鋁面不能有膠漬和保護膜殘留；ItmustripofftheprotectivefilmontheAlsurfaceafterdevelopingforunspecializedboards.GluestainsandprotectivefilmleftoverontheAlsurfacearenotallowed.注：若有特殊要求，則在顯影后及全制程都不可撕掉鋁面保護膜；Remark:Ifthecustomerhasspecialrequirements,theprotectivefilmmustntberippedoffafterdevelopingevenduringthewholeproduction.H、返洗绿油板返洗绿油前不能撕掉铝面保护膜，并检查有无破损，如有必须用皱纹胶纸贴好。Theprotectivefilmcannotberippedoffbeforewashingoffsoldermaskforre-processandshouldbecheckedifisbroken.Iftheprotectivefilmisbroken,itmustbemendedwithadhesivetape.,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,如下工序为打定位孔工序必须先固化阻焊后在送板下工序。2.9打定位孔Orientation-holePunchingA、用层压打靶在做好的线路相应靶位图上打靶。Punchorientation-holeatcorrespondingpositionoftheboardwithfinishedcircuitsbylayerpressingpunching,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,2.10字符制作(根据MI要求而定)ComponentMarkMaking(basedontherequirementofMI)A、每印一块工作板后都需认真自检，合格后再继续印刷，不合格板需分开及时返工；Conductself-checkforeveryprintedworkingboardandcontinueprintingwhenthepreviousoneisconfirmedtobequalified.Unqualifiedboardsmustbeseparatedfromqualifiedonesandbere-processedintime.B、字符不允许有模糊、重影、残缺、渗油等现象；Componentmarkmustntbeambiguous,broken,oilseepedorwithghostimage.,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,2.11喷锡HALSA、锡炉温度控制在*；TheTin-oventemperatureiscontrolledwithin*.B、喷锡后要充分冷却后方可进行后处理；Conductpost-treatingwhentheboardisfullycooledafterHALS.C、后处理的热水洗段要将板面充分清洗干净，防止板面哑色；Completelycleantheboardsurfaceatthehot-waterwashingsectionofthepost-treatingtoavoiddimcoloroftheboardsurface.,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,2.12喷锡检查HALSCheckA、锡面平整，无锡堆、锡高等现象；TheTinsurfacemustbesmoothwithoutTin-pilingandhighTin.B、所有焊点不允许有不上锡现象；AssureallsolderpointsarecoveredwithTin.C、MARK.一定要平整，不允許錫面凸出或錫面不均勻；AllMARKpointsmustbesmooth.ItisnotallowedthattheTinsurfaceisprotrudedoruneven.D、錫面顏色一致，光亮度要好，不允許有啞色；ThecolorofTinsurfacemustbeunifiedwithgoodbrightnessandnodimcolor.,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,2.13单面磨板（视客户要求而定）Single-sideScrubbing(accordingtocustomersrequirements)A、磨板前要彻底洗机、换水，水洗缸；Completelycleanthemachineandchangedirtywaterbeforescrubbingandtheremustbe*B、磨刷使用毡辘，前磨刷为*#，后磨刷为*#，磨痕试验宽度为*mm；Usingfelttackleforscrubbing.Thetypeofformerscrubbingbrushis*#andthelatteris*#.Thetestedwidthofscrubbingtraceiswithin*mm.C、磨板前要注意清洗烘干段行辘；Payattentiontocleaningtransportingtackleatthebakingsectionbeforescrubbing.D、磨板时只使用一对上磨刷，线路面向下，注意下磨刷要关闭；Useapairofupperscrubbingbrushforscrubbing.Putthecircuitsideadownandturnoffthenetherscrubbingbrush.,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,E、铝面如有擦花，须用*#砂纸打磨平整后再磨板IftherearescratchesontheAlsurface,itisnecessarytouse*#sandpapertosmooththeboardandthenconductscrubbing.F、不能污染锡面，不能有哑色现象；TheTinsurfacemustntbepollutedandshouldnthasdimcolor.G、铝面磨板要均匀，不能有没磨到的地方；AllpartsoftheAlsurfacemustbescrubbedevenly.H、在铝面、锡面检查合格后，铝面须贴透明专用保护薄膜；PastespecialcolorlessprotectivefilmontheAlsurfaceaftertheAlandTinsurfacesareconfirmedtobequalified.,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,2.14V-CUTA、使用电脑V-CUT；Applycomputer-assistantV-CUT.B、在V-CUT过程中不能撕掉或揭开胶纸，更不能用手去摸铝面；DuringthecourseofV-CUT,itmustntripofforuncoverthegummedpaperandtouchtheAlsurfacebyhand,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,2.15成型MouldingA、在冲压过程中全程都不能撕掉或揭开胶纸，更不能用手去摸铝面；Duringthewholeproduction,itmustntripofforuncoverthegummedpaperandtouchtheAlsurfacebyhand.B、冲压过程要从线路面冲到铝面；Thepunching&pressingdirectionisfromcircuitsidesurfaceto.AlC、铝面不能有明显的披锋；TheremustntbeobviousbursontheAlsurface.D、不能被压伤，线路面不能有任何污染；Theboardmustntbebrokenwhenpressingandthecircuitsidemustntbepolluted.E、不能有绝缘层脱落现象；Theinsulatedlayermustntbefallenoff.F、外形及管位要符合设计的公差要求；Thetoleranceofoutlineandcontrollingpositionshouldbeconsistentwithdesignrequirement.G、在冲压过程中要注意模具上、下模的清洁，任何的金属屑存在都会导致绝缘层的破坏，从而影响其电气性能；Payattentiontocleaningtheupperandnethermoldsduringpunching&pressingforanymetalcrumbmayresultinthedamageofinsulatedlayerandinfluencetheelectricalcapacityofPCB.,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,2.16高压测试High-pressureTestA、为了保证铝基板有足够的绝缘强度，需按客户要求100%作耐高压测试；InordertoassuresufficientinsulatedintensityforthealuminousPCB,thehigh-pressuretestmustbeoperatedaccordingtocustomersrequirements.B、耐压测试电压为*KV（DC），漏电电流为*mA/PCS；Thepressureofhigh-pressuretestis*KV（DC）andthecreepagecurrentis*mA/PCS.C、耐压测试时如有漏电现象则需逐片测试，找出漏电单元；Ifthereiscreepageofhigh-pressuretest,itmusttestboardonebyonetofindoutthecreepageunit.D、测试者要穿绝缘胶鞋，戴绝缘手套，以免觸电；Testersmustwearinsulatedrubberovershoesandinsulatedglovestoavoidelectricalhurt.,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,2.17OSPA、OSP膜厚在要求范圍內；TheOSPfilmthicknessmustbeintherequiredscope.B、OSP膜均勻；TheOSPfilmshouldbeeven.C、鋁面不能有變色及划傷。ThecolorofAlsurfacecannotbechangedandtheAlsurfacemustntbescratched.,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,2.18FQC、FQA检查FQCandFQACheckA、按下列铝基板品质标准结合客供标准进行检查ChecktheboardaccordingtothecombinationofaluminousPCBstandardbelowandcustomerstandard.B、在检查过程中将铝面胶纸揭去，用白纸隔开存放；UncoverthegummedpaperontheAlsurfaceduringcheckingandseparatetheboardswithwhitepaper.C、在检查过程中不能污染铝面和线路面；TheAlsurfaceandcircuitsidecannotbepollutedduringchecking.,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,2.19包装入库Packing,競華電子(深圳)有限公司,A+PCBElectorics(ShenZhen)Co.,LTD,三、注意事項Notice3.1各工序必须生产严格按要求操作；Allprocessesmustbestrictlyoperatedinaccordancewithrequirements.3.2生产全程中的运输，必须插猪笼架，或者垫纸或胶片隔开，避免擦花；Putboardsinthecage-shelforseparatet