封装工艺介绍PPT课件

Packageprocessintroduction,Presenter:GanJunLuo2019/08/15,Page2,PurposeandOutline,Purpose:SharepackageprocessintroductionOutline:ThepurposeofchippackagingProcessflow,Page3,Thepurposeofchippackaging,Thepurposeofchippackaging:TheICdiesonthewaferareseparatedfordieattach,connectexternalpinsbywirebonding,thendomoldingtoprotectelectronicpackagingdevicesfromenvironmentalpollution(moisture,temperature,pollutants,etc.);protectthechipfrommechanicalimpact;providestructuralsupport;provideelectricalinsulationsupport.ItiseasilyconnectedtothePCBboard.,Page4,Processflow,WaferSaw,DieAttach,WaferMount,WaferGrinding,EpoxyCure,Pre-Moldingplasma,PostMoldCure,Plating,Trim/Form,Test,De-junk,LaserMarking,Before,After,LaserMarking,Pre-WBplasma,WireBond,FOL(FrontofLine),EOL(EndofLine),Molding,De-flash,Packing,Page5,WaferGrinding,Purpose:Makethewafertosuitablethicknessforthepackage,Page6,WaferMount,Purpose:CombinethewaferwithDicingtapeontotheframefordiesawing,Page7,WaferSaw,Purpose:Makethewafertounitcanpickupbydiebonder,Page8,WaferSaw,ProcessdifferencebetweenBDandSD:SDBG:,Refertohttp:/www.disco.co.jp/cn_s,Page9,WaferSaw,QualityControl,切偏,正崩,划片宽度量测,Page10,DieAttach,Purpose:Pickupthedieandattachitontheleadframebyepoxy,Pickuptool:247X479mil,Collect,Needle,Page11,DieAttach,DieattachmethodEutectic,Epoxy,softsolder,DAF,Page12,DieAttach,粘着剂的工艺流程,Page13,DieAttach,QualityControl,DieShear,EpoxyThickness2Hrs,LaserMarking,LaserMarking,load,unload,unload,Platingline,电镀两种类型：PbFree：无铅电镀，锡（Tin）的纯度99.95%,符合Rohs的要求；Tin-Lead：铅锡合金。Tin占85%，Lead占15%，由于不符合Rohs，目前基本被淘汰。,晶须（Whisker），是指锡在长时间的潮湿环境和温度变化的环境下生长出的一种须状晶体，可能导致产品引脚的短路。,Page26,Planting,QualityControl,外观检查,Solderabilitytest,镀层厚度量测,Preconditioning:Steamaging93+3/-5,8hrsSolderdip:SnAgCu2455,50.5ssoldercoverage95%,Page27,TrimForm,Purpose:Removethetie-barandlead-frameandformproductstounitsfromstrips,fillthemintotubesandthenpasstonextprocess.,LaserMarking,LaserMarking,load,unload,Platingline,load,unload,Platingline,Sawworkarea,unload,Workingarea,unload,Lasermarking,Trimming,Forming,Page28,TrimForm,QualityControl,毛刺,脚偏,漏底材,长短脚,脚弯,异物附着,外观检查,外形尺寸量测,连筋,压伤,共面性不良：同一产品不同管脚站立高度大于0.1mm,Page29,Packing,Purpose:Protecttheproductinthecirculationprocess,convenientstorageandtransportation,LaserMarking,LaserMarking,load,unload,Plati