IGBT导热硅脂的涂抹及表面粗糙度要求

Thermal grease forInfineon modulesWhat should be the behavior and how agrease has to look likeBaginskiIFAG AIM PMD ID AE2007-06-01ConsiderationsInfineon modules with baseplate: Roughness of baseplateRZmax. = 16 m;RZtyp. = 4 6 mInfineon modules without baseplate: Roughness of ceramicRZmax. = 9 m; RZtyp. = 3 4 mHeatsink: Specification of roughness regarding Application NoteModules with and without baseplate: RZmax. = 10 mThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 2ConsiderationsExample of roughness of baseplate and heatsinkBaseplateRZtyp. = 6 mRZmax. = 10 mHeatsinkThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 3ConsiderationsThermal conductivity:Copper: 390 W / mKAluminium: 237 W / mKThermal compound: 1 W / mKCopperTIMAluminium= Thermal barrierThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 4ConsiderationsRth CH metall Rth CH thermal grease0.004 mK/W 1 mK/W Rth CH air Metal to Metal contact essential= Thermal grease that fills only the gapes is preferedThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 5Diagram with thermal greaseDiagram with thermal greaseRth JCRth CHthermalgreaseRth HAR Rth greaseRth JCRth CH Rth CHthermalmetallgreaseRth HA| Rmetall th greaseConsiderationsThermal grease consists of different componentsOily partsOnly needed to adjust the viscosity of the greaseThermal conducting partsNecessary to conduct baseplate and heatsink togetherBaseplateRZtyp. = 6 mRZmax. = 10 mHeatsinkThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 6ConsiderationsThermal interface material: Example for better understandingGrain size: Up to 70 mThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 7ConsiderationsExample: Thermal grease with 40 m size in applicationTemperaturedrop390 W/mKSmalltemp. dropBaseplateNo chance to moveOilypart1 W/mKBigtemp. dropHeat conductingpart237 W/mKSmalltemp. dropHeatsinkThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 8ConsiderationsExample of grains of 40 m sizeGrease workslike distancespacersBaseplateHeatsink= RthCH = badThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 9ConsiderationsExample: Thermal grease with 5 m size in applicationTemperaturedropBaseplateHeatsinkThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 10ConsiderationsExample of grains of 5 m sizeHole to fix module with the heatsinkBaseplateHeatsinkMetal to metal contact possible= RthCH = goodThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 11ConsiderationsViscosity of thermal grease: High viscosity (hard)BaseplateHeatsinkBaseplateHeatsinkDots ofgreasePermanentgapBaseplateThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 12HeatsinkConsiderationsViscosity of thermal grease: Low viscosity (fluid)BaseplateHeatsinkBaseplateHeatsinkDots ofgreaseGreasecomesoutBaseplateThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 13HeatsinkConsiderationsRoughness of heatsinkBaseplateRZtyp. = 6 mRZmax. = 1 mHeatsinkPermanent distanceThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 14ConsiderationsRoughness of heatsinkBaseplateRZtyp. = 6 mRZmax. = 10 mHeatsinkCrossover possibleThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description of warranty of a certainfunctionality, conditions or quality of the Infineon Technologies components. The statements contained in this communication, including any recommendation or suggestion or methodology, are to beverified by the user before implementation, as operating conditions and environmental factors may differ. The recipient of this presentation must verify any function described herein in the realapplication. Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind (including without limitation warranties of non-infringement of intellectual property rights of anythird party) with respect to any and all information given in this presentation.6-Mar-08BaginskiCopyright Infineon Technologies 2006. All rights reserved.Page 15Considerations of thermal foilFoil workslike distancekeeperBaseplateHeatsinkPermanent air- bad RthThe information given in this presentation is given as a hint for the implementation of the Infineon Technologies components only and shall not be regarded as any description o