基于嵌入式处理器的vlsi芯片的温度自动控制英文翻译毕业论文

天津职业技术师范大学2015届本科毕业设计EMBEDDEDPROCESSORBASEDAUTOMATICTEMPERATURECONTROLOFVLSICHIPSABSTRACTTHISPAPERPRESENTSEMBEDDEDPROCESSORBASEDAUTOMATICTEMPERATURECONTROLOFVLSICHIPS,USINGTEMPERATURESENSORLM35ANDARMPROCESSORLPC2378DUETOTHEVERYHIGHPACKINGDENSITY,VLSICHIPSGETHEATEDVERYSOONANDIFNOTCOOLEDPROPERLY,THEPERFORMANCEISVERYMUCHAFFECTEDINTHEPRESENTWORK,THESENSORWHICHISKEPTVERYNEARPROXIMITYTOTHEICWILLSENSETHETEMPERATUREANDTHESPEEDOFTHEFANARRANGEDNEARTOTHEICISCONTROLLEDBASEDONTHEPWMSIGNALGENERATEDBYTHEARMPROCESSORABUZZERISALSOPROVIDEDWITHTHEHARDWARE,TOINDICATEEITHERTHEFAILUREOFTHEFANOROVERHEATINGOFTHEICTHEENTIREPROCESSISACHIEVEDBYDEVELOPINGASUITABLEEMBEDDEDCPROGRAMKEYWORDSTEMPERATURESENSOR,ARMPROCESSOR,VLSICHIPS,BRUSHLESSDCMOTOR天津职业技术师范大学2015届本科毕业设计1INTRODUCTIONWITHTHEPHENOMENALDEVELOPMENTSINVLSITECHNOLOGY,THEAMBITIOUSICDESIGNERSARETRYINGTOPUTMORETRANSISTORSINTOSMALLERPACKAGESSO,THEICSRUNATHIGHERSPEEDSANDPRODUCELARGEAMOUNTOFHEATWHICHCREATESTHEPROBLEMOFTHERMALMANAGEMENTFOREXAMPLE,NOWADAYSTHECPUCHIPSAREBECOMINGSMALLERANDSMALLERWITHALMOSTNOROOMFORTHEHEATTOESCAPETHETOTALPOWERDISSIPATIONLEVELSNOWRESIDEONTHEORDEROF100WWITHAPEAKPOWERDENSITYOF400500W/CM2,ANDARESTILLSTEADILYCLIMBINGASTHECHIPTEMPERATUREINCREASESITSPERFORMANCEISVERYMUCHDEGRADEDBYPARAMETERSSHIFT,DECREASEINOPERATINGFREQUENCIESANDOUTOFSPECIFICATIONOFTIMINGSSOTHEHIGHSPEEDCHIPSMUSTBECOOLEDTOMAINTAINGOODPERFORMANCEFORTHELONGESTPOSSIBLEOPERATINGTIMEANDOVERTHEWIDESTPOSSIBLERANGEOFENVIRONMENTALCONDITIONSTHEMAXIMUMALLOWABLETEMPERATUREFORAHIGHSPEEDCHIPTOMEETITSPARAMETRICSPECIFICATIONSDEPENDSONTHEPROCESSANDHOWTHECHIPISDESIGNEDAMONGTHEVARIOUSCOOLINGTECHNIQUES,HEATSINKS,HEATPIPES,FANSANDCLOCKTHROTTLINGAREUSUALLYEMPLOYEDAMONGTHESETECHNIQUES,FANSCANDRAMATICALLYREDUCETHETEMPERATUREOFAHIGHSPEEDCHIP,BUTTHEYALSOGENERATEAGREATDEALOFACOUSTICNOISETHISNOISECANBEREDUCEDSIGNIFICANTLYBYVARYING,THEFANSSPEEDBASEDONTEMPERATUREIETHEFANCANTURNSLOWLYWHENTHETEMPERATUREISLOWANDCANSPEEDUPASTHETEMPERATUREINCREASESTHEOTHERPROMINENTMETHODISCLOCKTHROTTLINGIEREDUCINGTHECLOCKSPEEDTOREDUCEPOWERDISSIPATIONBUTITALSOREDUCESTHESYSTEMPERFORMANCEANDTHESYSTEMSFUNCTIONALITYISLOSTSO,THEOBJECTIVEOFTHEPRESENTWORKIS,TODESIGNAHARDWARESYSTEMCONSISTINGOFABRUSHLESSDCMOTORFANWHOSESPEEDISCONTROLLEDBASEDONTHE天津职业技术师范大学2015届本科毕业设计TEMPERATUREOFTHECHIP,SENSEDBYTHESENSORLM35THELM35SERIESAREPRECISIONINTEGRATEDCIRCUITTEMPERATURESENSORS,WHOSEOUTPUTVOLTAGEISLINEARLYPROPORTIONALTOTHECELSIUSCENTIGRADETEMPERATURETHELM35THUSHASANADVANTAGEOVERLINEARTEMPERATURESENSORSCALIBRATEDINKELVIN,ASTHEUSERISNOTREQUIREDTOSUBTRACTALARGECONSTANTVOLTAGEFROMITSOUTPUTTOOBTAINCONVENIENTCENTIGRADESCALINGTHELM35DOESNOTREQUIREANYEXTERNALCALIBRATIONORTRIMMINGTOPROVIDETYPICALACCURACIESOF14CATROOMTEMPERATUREAND34COVERAFULL55TO150CTEMPERATURERANGELOWCOSTISASSUREDBYTRIMMINGANDCALIBRATIONATTHEWAFERLEVELTHELM35SLOWOUTPUTIMPEDANCE,LINEAROUTPUT,ANDPRECISEINHERENTCALIBRATIONMAKEINTERFACINGTOREADOUTORCONTROLCIRCUITRYESPECIALLYEASYITCANBEUSEDWITHSINGLEPOWERSUPPLIES,ORWITHPLUSANDMINUSSUPPLIESASITDRAWSONLY60AFROMITSSUPPLY,ITHASVERYLOWSELFHEATING,LESSTHAN01CINSTILLAIRTHELM35ISRATEDTOOPERATEOVERA55TO150CTEMPERATURERANGE,WHILETHELM35CISRATEDFORA40TO110CRANGE10WITHIMPROVEDACCURACYTHELM35SERIESISAVAILABLEPACKAGEDINHERMETICTO46TRANSISTORPACKAGES,WHILETHELM35C,LM35CA,ANDLM35DAREALSOAVAILABLEINTHEPLASTICTO92TRANSISTORPACKAGETHELM35DISALSOAVAILABLEINAN8LEADSURFACEMOUNTSMALLOUTLINEPACKAGEANDAPLASTICTO220PACKAGETOMONITORTHEVOLTAGEATTHETERMINALSOFTHEDCMOTORFAN,THEPWMSIGNALISGENERATEDBYTHEARM7TDMIPROCESSORTHISPWMSIGNALISCHANGEDINACCORDANCETOTHEOUTPUTOFTHELM35TEMPERATURESENSORSOTHEIMPORTANTCOMPONENTOFTHISENTIREPROJECTISTHETEMPERATURESENSOR2DESCRIPTIONINARMPROCESSORBASEDAUTOMATICTEMPERATURECONTROLSYSTEM,THE天津职业技术师范大学2015届本科毕业设计OUTPUTOFTHETEMPERATURESENSORISFEDTOTHEONCHIPADCANDTHEOUTPUTOFTHEADCISGIVENTOTHEL293DDRIVERICWHICHINTURNISFEDTODCMOTORFANASSHOWNINTHEBLOCKDIAGRAMINFIG1AGRAPHICLCD128X64PIXELSISINTERFACEDTOTHEARMLPC2378PROCESSORTODISPLAYTHETEMPERATUREOFTHEICANDTHESPEEDOFTHEFANABUZZERISALSOCONNECTEDTOTHEPROCESSORWHICHGIVESANINDICATION,INCASEOFTHEFAILUREOFTHEFANOROVERHEATINGOFTHECHIPBEYONDSOMELEVELTHEENTIRECIRCUITDIAGRAMISSHOWNINFIG2FIG1BLOCKDIAGRAM天津职业技术师范大学2015届本科毕业设计FIG2CIRCUITDIAGRAM3SOFTWAREDESCRIPTIONTHEPRESENTWORKISIMPLEMENTEDUSINGARMIARWORKBENCHIDEANDTHENECESSARYEMBEDDEDCPROGRAMISDEVELOPEDANDDUMPEDINTOTHEEMBEDDEDPROCESSORUSINGFLASHMAGICISPUTILITYTHEARMIARWORKBENCHIDEISAVERYPOWERFULINTEGRATEDDEVELOPMENTENVIRONMENTIDETHATALLOWSYOUTODEVELOPANDMANAGECOMPLETEEMBEDDEDAPPLICATIONPROJECTSINSYSTEMPROGRAMMINGISPROGRAMMINGORREPROGRAMMINGTHEONCHIPFLASHMEMORY,USINGTHEBOOTLOADER天津职业技术师范大学2015届本科毕业设计SOFTWAREANDASERIALPORTTHELPC2387MICROCONTROLLERISBASEDONA16BIT/32BITARM7TDMISCPUWITHREALTIMEEMULATIONTHATCOMBINESTHEMICROCONTROLLERWITH512KBOFEMBEDDEDHIGHSPEEDFLASHMEMORYA128BITWIDEMEMORYINTERFACEANDUNIQUEACCELERATORARCHITECTUREENABLE32BITCODEEXECUTIONATTHEMAXIMUMCLOCKRATEFORCRITICALPERFORMANCEININTERRUPTSERVICEROUTINESANDDSPALGORITHMS,THISINCREASESPERFORMANCEUPTO30OVERTHUMBMODEFORCRITICALCODESIZEAPPLICATIONS,THEALTERNATIVE16BITTHUMBMODEREDUCESCODEBYMORETHAN30WITHMINIMALPERFORMANCEPENALTYTHELPC2387ISIDEALFORMULTIPURPOSESERIALCOMMUNICATIONAPPLICATIONSITINCORPORATESA10/100ETHERNETMEDIAACCESSCONTROLLERMAC,USBFULLSPEEDDEVICEWITH4KBOFENDPOINTRAM,FOURUARTS,TWOCANCHANNELS,ANSPIINTERFACE,TWOSYNCHRONOUSSERIALPORTSSSP,THREEI2CINTERFACES,ANDANI2SINTERFACETHISBLENDOFSERIALCOMMUNICATIONSINTERFACESCOMBINEDWITHANONCHIP4MHZINTERNALOSCILLATOR,64KBSRAM,16KBSRAMFORETHERNET,16KBSRAMFORUSBANDGENERALPURPOSEUSE,TOGETHERWITH2KBBATTERYPOWEREDSRAMMAKESTHISDEVICEVERYWELLSUITEDFORCOMMUNICATIONGATEWAYSANDPROTOCOLCONVERTERSVARIOUS32BITTIMERS,ANIMPROVED10BITADC,10BITDAC,ONEPWMUNIT,ACANCONTROLUNIT,ANDUPTO70FASTGPIOLINESWITHUPTO12EDGEORLEVELSENSITIVEEXTERNALINTERRUPTPINSMAKETHISMICROCONTROLLERPARTICULARLYSUITABLEFORINDUSTRIALCONTROLANDMEDICALSYSTEMSTHELPC2378MICROCONTROLLERPROVIDESONCHIPBOOTLOADERSOFTWARETHATALLOWSPROGRAMMINGOFTHEINTERNALFLASHMEMORYOVERTHESERIALCHANNELPHILIPSPROVIDESAUTILITYPROGRAMFORINSYSTEMPROGRAMMINGCALLEDFLASHMAGICSOFTWARE4RESULTSANDCONCLUSIONSEMBEDDEDARMPROCESSORBASEDAUTOMATICSPEEDCONTROLDCMOTORFAN天津职业技术师范大学2015届本科毕业设计ISDESIGNEDANDIMPLEMENTEDTOTESTTHEVALIDITYOFTHEDESIGN,THETEMPERATURESENSORISKEPTINSIDEASMALLOVENANDITSTEMPERATUREISINCREASEDBEYONDTHEROOMTEMPERATURENOWTHEFANISOPERATEDTORUNWITHFULLSPEEDANDTHETEMPERATUREISFOUNDTOCOMEBACKTONORMALTEMPERATURETHISISREPEATEDWITHVARIOUSVLSICHIPSLIKEPENTIUMPROCESSOR,FPGACHIPSETCNOWTHETEMPERATURESENSORISKEPTVERYNEARTOTHEPENTIUMPROCESSOROFTHECOMPUTERANDITISOBSERVEDTHAT,ASTHETIMELAPSESTHESPEEDOFTHEFANISAUTOMATICALLYINCREASEDANDTHETEMPERATUREOFTHECHIPISFOUNDTOBECONTROLLEDTHESERESULTSAREDISPLAYEDONLCDPANELTHOUGHTHEPRESENTSYSTEMISWORKINGWELLINTHEGIVENENVIRONMENT,STILLITISWORTHWHILETOHIGHLIGHTTHEFOLLOWINGCONCLUSIONSNORMALLY,CONTROLLINGFANSPEEDORCLOCKTHROTTLINGBASEDONTEMPERATUREREQUIRESTHATTHETEMPERATUREOFTHEHIGHSPEEDCHIPSHOULDBEFIRSTMEASUREDTHISISDONEBYPLACINGATEMPERATURESENSORCLOSETOTHETARGETCHIPEITHERDIRECTLYNEXTTOITORINSOMECASES,UNDERITORONTHEHEATSINKTHETEMPERATUREMEASUREDINTHISWAYCORRESPONDSTOTHATOFTHEHIGHSPEEDCHIP,BUTCANBESIGNIFICANTLYLOWERANDTHEDIFFERENCEBETWEENMEASUREDTEMPERATUREANDTHEACTUALDIETEMPERATUREINCREASESASTHEPOWERDISSIPATIONINCREASESSO,THETEMPERATUREOFTHECIRCUITBOARDORHEATSINKMUSTBECORRELATEDTOTHEDIETEMPERATUREOFTHEHIGHSPEEDCHIPOFCOURSEABETTERALTERNATIVEISPOSSIBLEWITHANUMBEROFHIGHSPEEDCHIPSMANYCPUS,FPGASANDOTHERHIGHSPEEDICSINCLUDEATHERMALDIODEWHICHISACTUALLYADIODECONNECTEDBIPOLARTRANSISTOR,ONTHEDIEUSINGAREMOTEDIODETEMPERATURESENSORCONNECTEDTOTHISTHERMALDIODE,THETEMPERATUREOFTHEHIGHSPEEDICSDIECANBEMEASUREDDIRECTLYWITHANEXCELLENTACCURACYTHISNOTONLYELIMINATESTHELARGETEMPERATUREGRADIENTSINVOLVEDINMEASURINGTEMPERATUREOUTSIDETHETARGETICSPACKAGE,BUTITALSOELIMINATES天津职业技术师范大学2015届本科毕业设计THELONGTHERMALTIMECONSTANTS,FROMSEVERALSECONDSTOMINUTES,THATCAUSEDELAYSINRESPONDINGTODIETEMPERATURECHANGESTHEREISALSOADRAWBACKINFANSPEEDCONTROLNORMALLYTHEFANSPEEDISCONTROLLEDBYADJUSTINGTHEPOWERSUPPLYVOLTAGEOFTHEFANTHISISDONEBYALOWFREQUENCYPWMSIGNAL,USUALLYINTHERANGEOFABOUT50HZ,WHOSEDUTYCYCLEISVARIEDTOADJUSTTHEFANSSPEEDTHISISINEXPENSIVEANDALSOEFFICIENTBUTTHEDISADVANTAGEOFTHISMETHODISTHATITMAKESTHEFANSOMEWHATNOSIERBECAUSEOFTHEPULSEDNATUREOFTHEPOWERSUPPLYTHEPWMWAVEFORMSFASTEDGESCAUSETHEFANSMECHANICALSTRUCTURETOMOVE,WHICHISEASILYAUDIBLEINSOMESYSTEMS,ITISALSOIMPORTANTTOLIMITTHERATEOFCHANGEOFTHEFANSPEEDTHISISCRITICALWHENTHESYSTEMISINCLOSEPROXIMITYTOUSERSSIMPLYSWITCHINGAFANONANDOFFORCHANGINGSPEEDIMMEDIATELYASTEMPERATURECHANGESISACCEPTABLEINSOMEENVIRONMENTSBUTWHENUSERSAREINNEARBY,THESUDDENCHANGESINFANSNOISEAREHIGHLYANNOYINGSOTOAVOIDTHESEEFFECTSTHEFANSDRIVESIGNALMUSTBELIMITEDTOANACCEPTABLELEVEL5FUTURESCOPEOFTHEWORKINTHEPRESENTWORKTEMPERATUREISSENSEDUSINGTHETEMPERATURESENSORLM35ANDTHESPEEDOFTHEMOTORISCONTROLLEDBYVARYINGTHEWIDTHOFPWMGENERATEDBYTHEPROCESSORBUTTHETEMPERATURESENSEDBYTHEICLM35ISNOTVERYACCURATEEVENTHOUGHWEKEEPTHEICVERYNEARTOTHEPROCESSORORVLSICHIPSO,WECANUSEAREMOTEDIODETEMPERATURESENSORCONNECTEDTOTHETHERMALDIODEWHICHMEASURESTHETEMPERATUREOFTHEHIGHSPEEDICSDIRECTLYWITHEXCELLENTACCURACYANOTHERIMPORTANTASPECTISAVARIETYOFREMOTETEMPERATURESENSORSWITHUPTOFIVESENSINGCHANNELSISAVAILABLETHATCANDETECTTHEDIETEMPERATUREOFTHEHIGHSPEEDCHIPANDTRANSMITTEMPERATUREDATATOAMICROCONTROLLERFANSPEEDREGULATORSWITHMULTIPLECHANNELS天津职业技术师范大学2015届本科毕业设计OFFANTACHOMETERMONITORINGCANPROVIDERELIABLECONTROLOFFANRPMORSUPPLYVOLTAGEBASEDONCOMMANDSFROMANEXTERNALMICROCONTROLLERFORTHISSIMPLEICSAREPROVIDEDBYMAXIMMAX6660ANDMAX6653THEFIRSTICCANSENSETHEREMOTETEMPERATUREANDCONTROLSTHEFANSPEEDBASEDONTHATTEMPERATUREITPRODUCESADCSUPPLYVOLTAGEFORTHEFANTHROUGHANINTERNALPOWERTRANSISTORTHESECONDICALSOPERFORMSASIMILARFUNCTIONBUTDRIVESTHEFANWITHAPWMWAVEFORMTHROUGHANEXTERNALPASSTRANSISTORBOTHINCLUDECOMPLETETHERMALFAULTMONITORINGWITHOVERTEMPERATUREOUTPUTS,WHICHCANBEUSEDTOSHUTDOWNTHESYSTEMIFTHEHIGHSPEEDCHIPSGETTOOHOTSO,THEPRESENTWORKCANBEIMPROVEDFURTHERBYUSINGTHEABOVEMENTIONEDTECHNIQUES天津职业技术师范大学2015届本科毕业设计基于嵌入式处理器的VLSI芯片的温度自动控制摘要本文介绍了基于嵌入式处理器的VLSI芯片的温度自动控制，同时利用温度传感器LM35和ARM处理器LPC2378来完成设计。由于VLSI芯片密度非常高，同时芯片在工作时很快得到加热，如果不能研制出能是它快速冷却的方法，芯片的性能将会受到很大影响。在目前的工作中，将传感器放置在非常接近接近到IC集成电路的位置来采集芯片的温度，通过由ARM处理器产生的PWM信号来控制集成电路旁风扇的转速。在硬件电路中也提供了一个蜂鸣器，在无法控制风扇或者IC集成电路的过热的情况下都会发出警报。整个过程的实现需要制定一个合适的嵌入式C程序。关键词温度传感器，ARM处理器，超大规模集成电路芯片，无刷直流电动机天津职业技术师范大学2015届本科毕业设计1介绍随着VLSI超大规模集成电路技术的惊人发展，雄心勃勃的IC设计师正试图将更多的晶体管用更小的体积实现更多的功能。因此，该集成电路运行速度更快，产生更多的热量而造成的新的问题。举例来说，现在世界上的的CPU芯片变得越来越小，几乎没有空间散热。若消耗100W的功率的话，峰值功率密度为400500W/CM2，并可能持续上升。随着芯片温度的升高会影响性能的参数变化，从而减少芯片的工作频率和影响时序的规范。因此，在允许的条件范围内，为了让高速芯片能得到最好的工作效率和最长的运行时间，必须要让芯片在短时间内冷却下来。高速芯片所能允许的最高温度，取决于程序的参数规格，以及芯片的设计。在各种不同的冷却技术中，人们通常使用散热片，热管，风扇以及时钟节流。在这些技术中，风扇可以快速高效的降低高速芯片的温度，但它们也产生大量的噪音。这种噪声可以通过不同的方法来降低，根据风扇转速是由温度来控制，当温度低时，风扇的转速降低；随着温度的提高，风扇的速度会随着提升。另一个有效地的方法是时钟节流，即减少了时钟速度，降低功耗。但它也降低了系统性能和系统运行速度。本工作的目标是，设计一个硬件系统能控制直流无刷电机风扇的转速，芯片的温度则由传感器LM35进行采集。LM35系列是精密的集成电路温度传感器，其输出电压与采集到的摄氏的温度成线性比。因此，LM35系列比一般的传感器拥有优势，因为我们可以直接通过电压值来确定摄氏温度值。LM35不需要校准或微调，便可以提供提供在室温025精度和55150温度范围。由于LM35系列不需要校准，所以该传感器比较经济，低成本。LM35的低输出阻抗，线性输出和精确的校准的特点使固有接口的读数和控制电路特别容易。它同时可用于单电源输出和多电天津职业技术师范大学2015届本科毕业设计源输出。由于它只需要60微安的电流供应，所以它自身产生的热量较低，在真空中约升温01。LM35在55150温度范围内可以正常的工作，而LM35C可工作的温度范围为40110。LM35系列可封装在密封的TO46晶体管内，而LM35C，LM35CA和LM35D也可用塑胶TO92晶体管封装。LM35D也可以用8引脚小型封装和塑料的TO220封装。由ARM7TDMI处理器所产生的PWM信号来控制直流风扇电动机两端的电压。PWM信号的变化与LM35温度传感器的电压输出同步。因此，这整个项目的重要组成部分是温度传感器。2描述在ARM处理器为基础的温度自动控制系统，温度传感器输出是由芯ADC来控制。而ADC的输出是与IC相连，ICL293D的驱动信号直接送到直流风扇电机中，系统框图如图1所示。LCD图形液晶显示器（128X64像素）的接口与ARMLPC2378处理器相连，来显示该集成电路的温度和风扇转速。蜂鸣器同样是连接ARM处理器，在无法控制风扇和芯片过热的情况下会发出警报，整个电路图如图2所示。图1系统框图天津职业技术师范大学2015届本科毕业设计图2电路图3软件介绍目前的工作是使用ARMIAR工作台IDE，嵌入式C程序和使用FLASHISP天津职业技术师范大学2015届本科毕业设计工具处理器进行嵌入式开发。ARMIAR的工作台IDE是一个非常强大的集成开发环境（IDE），允许开发和管理完整的嵌入式应用项目。在系统编程这一环境下我们可以采用引导加载器软件和使用一个串行端口进行编程或重新编程闪存记忆体中的程序。LPC2387单片机是基于16/32位的ARM7TDMISCPU的实时仿真，它同时结合了512KB嵌入式闪存单片机的特点。128位宽度的存储器接口和独特的加速结构使32位代码执行在最大时钟频率下运行。在THUMB模式下，中断服务程序和DSP算法的关键性能能提高30以上。对于重要代码应用，其他16位代码在THUMB模式性能损失可减少超过30。LPC2387是多用途串行通信应用的理想选择。它由一10/100以太网媒体访问控制器（MAC），4个端点的USB全速设备内存，4个UART，两个CAN通道，一个SPI接口，两个同步串行端口（SSP）的，3个I2C接口，和一个I2S接口组成。这种融合了串行通信接口与频率为4MHZ内部振荡器，64KB的SRAM记忆体，16个以太网，16KB的USB，连同2KB的电池供电SRAM的功能非常适合于协议转换器的转换。32位定时器，10位DAC，一个PWM单元，一个CAN控制装置，以及多达70个的GPIO线路和12个外部中断引脚使这个单片机特别适合应用在工业控制和医疗系统等。LPC2378单片机提供芯片的引导加载器软件，允许在串行通道的内部快闪记忆体内编程。飞利浦提供了一个在系统实用程序即所谓闪光魔术软件编程。4结果与结论基于嵌入式ARM处理器的温度控制系统的设计和实