各种IC封装形式图片大全

1、各种IC封装形式图片BGABall Grid ArrayEBGA 680L详细规格LBGA 160L详细规格PBGA 217LPlastic Ball Grid Array详细规格 SBGA 192L详细规格 TSBGA 680L详细规格CLCC详细规格CNRCommunication and Networking Riser Specification Revision 1.2 详细规格CPGACeramic Pin Grid ArrayDIPDual Inline Package 详细规格DIP-tabDual Inline Package with Metal HeatsinkFBGAF

2、DIPFTO220Flat PackHSOP28ITO220ITO3pJLCCLCCLDCCLGALQFPPCDIPPGAPlastic Pin Grid Array 详细规格PLCC详细规格PQFPPSDIPLQFP 100L详细规格 METAL QUAD 100L详细规格PQFP 100L详细规格QFPQuad Flat PackageSOT143SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89Socket 603FosterLAMINATE TCSP 20LChip Scal

3、e Package详细规格TO252TO263/TO268SO DIMMSmall Outline Dual In-line Memory ModuleSOCKET 370For intel 370 pin PGA Pentium III & Celeron CPUSOCKET 423For intel 423 pin PGA Pentium 4 CPUSOCKET 462/SOCKET AFor PGA AMD Athlon & Duron CPUSOCKET 7For intel Pentium & MMX Pentium CPUQFPQuad Flat PackageTQFP 100L详

4、细规格SBGASC-70 5L详细规格SDIPSIPSingle Inline PackageSOSmall Outline PackageSOJ 32L详细规格SOJSOP EIAJ TYPE II 14L详细规格SOT220SSOP 16L详细规格 SSOPTO18TO220TO247TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOPThin Small Outline PackageTSSOP or TSOP IIThin Shrink Outline PackageuBGAMicro Ball Grid ArrayuBGAMicro Ball

5、Grid ArrayZIPZig-Zag Inline PackageBQFP132TEPBGA 288LTEPBGA 288L详细规格C-Bend Lead CERQUADCeramic Quad Flat Pack详细规格Ceramic CaseLAMINATE CSP 112LChip Scale Package详细规格Gull Wing Leads J-STDJ-STDJoint IPC / JEDEC StandardsJEPJEPJEDEC PublicationsJESDJESDJEDEC StandardsLLP 8La详细规格PCI 32bit 5VPeripheral Component Interconnect详细规格PCI 64bit 3.3VPeripheral Component Interconnect详细规格PCMCIAPDIPPLCC详细规格PS/2PS/2mouse port pinout详细规格SIMM30SIMM30Pinout详细规格SIMM30Single In-line Memory ModuleSIMM72SIMM72Pinout详细规格SIMM72Single In-line Memory ModuleSIMM72Single In-line Memory ModuleSLOT