SMTCBA全制程简介

1、生產技術教育訓練教材,SMT PCBA,(Surface Mounting Technology),製程簡介,楊合卿,SMT,(Surface Mounting Technology),製程簡介,-,流程,:,-,IPQC First Article Audit,-,Temperature Profile,-,LCR measurement/Date code record,-,100% ICT TEST,-,ICT Control p-Chart,MATERIAL,INCOMING,SMT,REPAIR,NG,-,Key parts LRR tracing,-,Key parts Cpk,-

2、,X-R chart for key parts,-,Sampling Plan AQL Ma:0.25/Mi:1.5,( PCB AQL Ma: 0.1/ Mi: 1.5 ),RETURN TO VENDOR,ICT,TEST,NG,IQC,MANUAL INSERTION,WA,VE SOLDERING,OK,OK,-,Control u-Chart,IPQC,VISUAL INSPECTION,-,Sampling Plan AQL Ma:0.1/Mi:0.4,NG,-,Solder paste thickness control X-R chart,-,Critical paramet

3、er control,-,Flux density X-Rm Chart,-,Pre-Heat Temp. X-Rm Chart,-,Wave Solder Temp. X-Rm Chart,REWORK,WAREHOUSE,-,U-chart,OK,OK,OK,OK,OK,OK,OK,SMT,(Surface Mounting Technology),製程簡介,-,流程,:,WAREHOUSE,-,100% Function test,-,Function test P-Chart,SHIPPING,FUNCTION,TEST,NG,REPAIR,CASE ASSEMBLY,END,PACK

4、ING,OK,NG,OQC,OK,(For external Product),-,OQC First article audit,-,AQL,(According to customers requirements),Ma: 0.065 / Mi: 0.25,-,1st run production 100% OQC check,-,P-chart,OK,NG,Rework,-,Torque control,-,Visual inspection u-Chart,ICT,TEST,REPAIR,TOUCH-UP,-,100% ICT TEST,-,ICT Control P-Chart,-,

5、Visual inspection u-Chart,-,Iron temperature control,OK,OK,OK,OK,SMT,(Surface Mounting Technology),製程簡介,-,設備,SMT Line,Loaded-in,MPM Print,(Dispenser),FUJI CP-643,FUJI QP-242E,Re-flow,Loaded-out,T/U,ICT,IPQC T/U,Repairing,SMT,(Surface Mounting Technology),製程簡介,-,設備,Coordinate X,Y,Tape / M,Solder Past

6、e,Thickness Tester,Solid Magnifier 40X,SMT,(Surface Mounting Technology),製程簡介,-,設備,DIP Line,Solder / M,ICT,Function Tester,Scan Computer,H/I,Packing,T/U,PCB V-Cut / M,SMT,(Surface Mounting Technology),製程簡介,-,設備,EE-PROM Flash / M,Bar-code Print,Lead Cutting M/C,Pre-heat Plate,Router,Temperature Tracker / M,SMT,(Surface Mounting Technology),製程簡介,-,設備,Granite Flat Roof,IR Tester,LCR Meter,Oscillograph,Vacuum Packing / M,Projective Mirror / M,SMT,(Surface Mounting Technology),製程簡介,-,設備,Vibration T