表面粘著技术检验标准

1、2004.1.29MFG-00061文件編號 / MFG-0006製作單位 / 製造處訓練中心製作日期 / 2004.1.29製 作 / Canjian.zhang2004.1.29MFG-000621、基板加工之檢驗標準可以確保產品規格和產品可靠度。2、制定檢驗標準方能使產品品質，維持一定的水準並提高 產品之競爭力。3、各相關單位有一致性之檢驗標準，使作業標準有依循的 準則。4、確保產品品質方能獲得客戶的信賴與商品的競爭力。5、從檢驗中能及早發現各個潛藏之問題. (一) 設計狀況 (二) 原物料狀況 (三) 機器設備狀況 (四) 人員 / 管理狀況6、發現任何異常，須立即提報，並做統計分析與

2、追蹤改善。2004.1.29MFG-00063 理想標準佳況 允收標準允收 拒收標準拒收(一) 理想標準：幾乎是完美無暇，提供給設計者和製 造者參考，如能在第一次的設計和製 造做得到，往後的工作就容易了。(二) 允收標準：為維持我們的產品在使用環境下的完 整和可靠度，必須執行的條件。(三) 拒收標準：不能確保我們的產品在使用環境下的 可靠度。2004.1.29MFG-00064理想狀況（Target Condition）配帶乾淨手套與配合良好靜電防護措施 Handling with clean gloves and full ESD protection允收狀況（Accept Conditio

3、n）配帶良好靜電防護措施，握持PCB板邊或板角執行檢驗 Handling with full ESD protection by board edges to inspect拒收狀況Reject Condition未有任何靜電防護措施，並直接接觸及導體、金手指與錫點表面(MA)(Handling without anyESD protection , and direct touching of the parts of conductor , golden finger , and MA.)2004.1.29MFG-00065 理想狀況(Target Condition) ww3301. 晶

4、片狀零件恰能座落在焊墊的 中央且未發生偏出，所有各金 屬封頭都能完全與焊墊接觸。 No side overhang and chips can be set and jointed onto the center of solder fillet 2004.1.29MFG-00066 X1/4W X1/4W 允收狀況(Accept Condition)3301.零件橫向超出焊墊以外，但尚未大於 其零件寬度的25%(X1/4W) Side overhang is less than or equal to 25% width of component termination area. 允收狀況

5、(Accept Condition)Y2 5milY1 1/5W3301.零件縱向偏移，但焊墊尚保有其零件寬 度的20%以上End overhang in Y axis but the width of solder fillet is less or equal to 1/5 of component(Y1 1/5W)2.金屬封頭縱向滑出焊墊，但仍蓋住焊墊5mil 以上1mil=0.0254mm 5x0.0254=0.127mm Metel termination is end overhang inY axis , but 5mil larger or equal to the width

6、 of compoent termination (Y2 5mil)2004.1.29MFG-00067 拒收狀況(Reject Condition)330X1/4WX1/4W1.零件已橫向超出焊墊，大於零件寬度25% (X1/4W) Side overhang is greater than 25% width of component termination area 拒收狀況(Reject Condition)Y1 1/5WY2 5mil3301.零件縱向偏移，焊墊未保有其零件寬度的 20%。(Y11/5W) (End overhang in Y axis and the width o

7、f solder fillet is less than 1/5 width of component ) .(Y11/5W)2.金屬封頭縱向滑出焊墊，蓋住焊墊不足 5mil。(Y25mil) End overhang in Y axis and the solder fillet is less than 5mil .3.無論何者均拒收 ( Each of them is rejected 2004.1.29MFG-00068 理想狀況(Target Condition) D組件的接觸點在焊墊中心 (No side overhang . ) 允收狀況(Accept Condition)Y1/

8、4DY1/4X25mil X1 1/5D1.組件端寬(短邊)突出焊墊端部份是組件端 直徑25%以下(Y1/4D)Side overhang is less than 25% diameter of component width 2.零件橫向偏移，但焊墊尚保有其零件直徑 的20%以上(X11/5D) End overhang but the width of solder fillet is greater than 20% diameter of component 3.金屬封頭橫向滑出焊墊，但仍蓋住焊墊 5mil(0.13mm)以上(X25mil) End overhang of comp

9、onent metal head and it is still fixed on over 5mil length of solder fillet 2004.1.29MFG-00069 Y1/4D Y1/4D X25mil X1 1/5D拒收狀況(Reject Condition)1.組件端寬(短邊)突出焊墊端部份是 組件端直徑25%以上(MI)。 (Y1/4D) Side overhang is greater than 25% diameter of component width. 2.零件橫向偏移，但焊墊未保有其零件直徑的20%以上(MI) (X11/5D) End overhan

10、g but the width of solder fillet is less than 20% diameter of component . 3.金屬封頭橫向滑出焊墊，但仍蓋住焊墊不足5mil(0.13mm)以 上 (MI)。(X25mil) End overhnag of component metal head but it is fixed on less than 5mil length of solder fillet .4.無論何者均拒收 Each of them is rejected .2004.1.29MFG-000610理想狀況(Target Condition)SW

11、各接腳都能座落在各焊墊的中央，而未發生偏滑No toe overhang and it is fixed onto right center of solder fillet W W 理想狀況(Target Condition)2004.1.29MFG-000611X1/4W . S8mil 允收狀況(Accept Condition)各接腳已發生偏滑，所偏出焊墊以外的接腳，尚未超過接腳本身寬度的1/4WSide overhang is less than 1/4 width of gull-wing component .允收狀況(Accept Condition)各接腳已發生偏滑，所偏出焊

12、墊以外的接腳，尚未超過焊墊前端外緣Toe overhang does not violate minimum heel fillet requirements .2004.1.29MFG-000612拒收狀況(Reject Condition)S1/4W1.各接腳已發生偏滑，所偏出焊墊以外 的接腳，已超過接腳本身寬度的 1/4W (X1/4W ) Side overhang is greater than 1/4 width of gullwing component 2.無論何者均拒收 (Each one of them is rejected . )拒收狀況(Reject Conditio

13、n)已超過焊墊側端外緣1.各接腳側端外緣，已超過焊墊前端外 緣。 Toe overhang violate heel fillet requirement , and component fixed is over front edge of fillet .2004.1.29MFG-000613 w 理想狀況(Target Condition)各接腳都能座落在焊墊的中央，未發生偏滑。No side overhang . X1/4W 允收狀況(Accept Condition)S8mil各接腳已發生偏滑，所偏出焊墊以外的接腳，尚未超過接腳本身寬度的1/4W。(X1/4W ) Side over

14、hang equal to or less than 1/ 4 width of J shape component .2004.1.29MFG-000614 X 1/4W 拒收狀況(Reject Condition)S8mil1.各接腳已發生偏滑，所偏出焊墊以 外的接腳，已超過接腳本身寬度的 1/4W(X1/4W ) Side overhang greater than 1/4 width of J shape component . 2.無論何者均拒收 Whichever is rejected . 2004.1.29MFG-000615理想狀況(Target Condition)1.引線

15、腳的側面,腳跟銲點表面皆吃 錫良好。Side joint is properly wetted along full length of lead . 2.引線腳與板子焊墊間呈現凹面焊 錫帶。 Heel fillet extends above lead thickness but does not fill upper lead bend . 3.引線腳的輪廓清楚可見。 A properly wetted heel fillet is evident . 2004.1.29MFG-000616允收狀況(Accept Condition)1.引線腳與板子焊墊間的焊錫，連 接很好且呈一凹面焊錫帶

16、Devices with high lead configuration , solder may extend to , but must not touch the package body or end seal.2.錫少，連接很好且呈一凹面焊錫帶。 Devices with low lead configuration may have solder extend to the package or under the body .3.引線腳的底邊與板子焊墊間的銲錫帶至少涵蓋引線腳 的80%以上。 Minimum side joint length is at least 80% le

17、ad length .2004.1.29MFG-000617 允收狀況(Accept Condition)1. 引線腳與板子焊墊間的焊錫連接 很好且呈一凹面焊錫帶。 Side joint with high lead configuration , solder may extend to , but must not touch the package body or end seal . 2.引線腳的側端與焊墊間呈現稍凸的焊錫帶。 Side joint with high lead configuration , solder may extend to the package body

18、or end seal . 3.引線腳的輪廓可見。Properly wetted fillet evident . 2004.1.29MFG-000618拒收狀況(Reject Condition)1. 引線腳的底邊和焊墊間未呈現凹 面銲錫帶。 Minimum side joint length is less than the lead width . 2.引線腳的底邊和板子焊墊間的焊錫帶未涵蓋引線腳的80% 以下。 Minimum side joint length is less than 80% lead length . 3. 無論何者均拒收Whichever is rejected

19、 .2004.1.29MFG-000619拒收狀況(Reject Condition)1.焊錫帶延伸過引線腳的頂部。 Side joint length is over the height of lead top . 2.引線腳的輪廓模糊不清。 Lead heel is not quite evident . 3.錫突出銲墊周圍 Solder is extended to fillet surroundings . 4.無論何者均拒收 Whichever is rejected . 2004.1.29MFG-000620 理想狀況(Target Condition)ABDC1.腳跟的焊錫帶延

20、伸到引線上彎曲處 底部(B)與下彎曲處頂部(C)間的中 心點。 Heel solder joint extends to the mid- point of ( B ) and ( C ) .註：引線上彎頂部(upper top of lead bend )：引線上彎底部(upper bottom of lead bend )：引線下彎頂部(lower top of lead bend )：引線下彎底部(lower bottom of lead bend 理想狀況(Target Condition)ABDC2004.1.29MFG-000621 允收狀況(Accept Condition)1.

21、腳跟的焊錫帶已延伸到引線上彎 曲處的底部(B)但是未接觸到組件 本體。Heel solder joint extends to the upper bottom of lead bend but does not touch the body . 允收狀況(Accept Condition)1.腳跟的焊錫帶已延伸到引線下彎 曲處的頂部。 Heel solder joint extends to the lower top of lead bend . 2004.1.29MFG-000622 拒收狀況(Reject Condition)1.腳跟的焊錫帶延伸到引線上彎曲處 的底部(B)，延伸過高，

22、且接觸到組 件本體，才拒收。 Heel solder joint extend s to ( B ) but over the lead bend too much . 拒收狀況(Reject Condition)1.腳跟的焊錫帶未延伸到引線下彎曲 處的頂部。 Minimum heel solder joint is not extended to the lower top of lead bend 2.未能清楚看到吃錫狀況。Properly wetted fillet is not evident . 2004.1.29MFG-000623理想狀況(Target Condition)AB

23、1.凹面焊錫帶存在於引線的四側。 A concave solder joint length extends around lead . 2.焊錫帶延伸到引線彎曲處兩側 的頂部(A,B)。 Solder joint extends to both top (A , B )of lead bend . 3.引線的輪廓清楚可見。 Leads are visual clearly . 4.所有的錫點表面皆吃錫良好。 Properly wetted fillet is evident . 理想狀況(Target Condition)A T B2004.1.29MFG-000624允收狀況(Accept

24、 Condition)允收狀況(Accept Condition)1.凹面焊錫帶延伸到引線彎曲處的上 方,但在組件本體的下方。Solder joint extends to lead bend but not touches component body . 2.引線頂部的輪廓清楚可見。 Upper part of lead is visual clearly .1.焊錫帶均勻覆蓋於引線的三側 Solder joint evenly extends to three sides around lead . 2.焊錫帶涵蓋引線彎曲處兩側的80% 以上。Solder joint extends t

25、o at least 80% of both sides of lead bend . 2004.1.29MFG-000625 拒收狀況(Reject Condition)1.焊錫帶均勻覆蓋於引線的三側以下。 Solder joint does not properly wetted around three sides of lead . 2.焊錫帶涵蓋引線彎曲處兩側的80% 以下。Solder joint extends less than 80% of both sides of lead bend . )3.無論何者均拒收Whichever is rejected 拒收狀況(Rejec

26、t Condition)1.焊錫帶接觸到組件本體。Solder joint extends to component body . 2.引線頂部的輪廓不清楚。Upper part of lead is not visual clearly . 3.錫突出焊墊邊。Solder joint extends too much of fillet . )4.無論何者均拒收Whichever is rejected 2004.1.29MFG-000626 2/3H 理想狀況(Target Condition) 理想狀況(Target Condition)H1.焊錫帶是凹面並且從晶片端電極 底部延伸到頂部

27、的2/3H。 Rectangular chip component mounted on its side from the bottom electrode to 2/3 H on top of it , and solder joint is concave . )2.錫皆良好地附著於所有可焊接面。 Complete wetting at land or end cap metallization .2004.1.29MFG-000627允收狀況(Accept Condition)Y1/4H1.焊錫帶延伸到晶片端電極高度 的25%以上.(Y1/4H) Solder joint extend

28、s to 25% height of chip component electrode . 允收狀況(Accept Condition)1.焊錫帶稍呈凹面並且從晶片端電極底部延 伸到頂部 。(Solder joint extends from bottom to top of electrode is a slightly concave . 2.錫未延伸到晶片端電極頂部的上方。 Solder joint does not extend to the top of electrode of chip coomponent . 3.錫未延伸出焊墊端與接觸到組件本體。 Solder does no

29、t extend to fillet to touch component body . 4.可看出晶片頂部的輪廓The top of chip is clear 2004.1.29MFG-000628拒收狀況(Reject Condition)1.錫已超越到晶片頂部的上方。Solder joint extends over to the upper top of component . 2.錫延伸出焊墊端與接觸到組件本體。 Solder joint extends over to the top of fillet and touch component body . 3.看不到晶片頂部的輪

30、廓。Top of chip is not visible . 無論何者均拒收 Whichever is rejected . 拒收狀況(Reject Condition)Y0.8 mm傾斜Wh0.8 mm1.量測零件基座與PCB零件面之最 大距離0.8mm(MI)。 Components required to be mounted above the board surface are larger than 0.8mm . 2.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。 Component required to be mounted off the board is lead be

31、nt . Lead is misarranged to holes . Component lacking . 3.無論何者均拒收 Whichever is rejected .2004.1.29MFG-000636理想狀況(Target Condition)1000F 6.3F-1016 +1.零件平貼於機板表面。The component body is flat in contact with and perpendicular to the board 2.浮高與傾斜之判定量測應以PCB零件面與 零件基座之最低點為量測依據。 Component lifted and tilted is

32、 measured at minimum of component base and PCB surface 0.8mm允收狀況(Accept Condition) 10006.3F-1016 +121.零件傾斜與PCB垂直之夾角12 The angle () of tilted component and the line perpendicular to PCB board is equal or less than 12. 2.傾斜不得觸及其他零件或造成組裝性之干涉。 Component tilt does not cause installation interference of o

33、ther parts . 3.零件傾斜間距離差0.8mm The space of tilted component and other parts is equal or less than 0.8mm .2004.1.29MFG-000637 0.8mm拒收狀況(Reject Condition) 1000F 6.3F-1016 +121.零件傾斜與PCB垂直之夾角12 The angle () of tilted component and the line perpendicular to PCB board is greater than 122.傾斜已觸及其他零件或造成組裝性 之干

34、涉。 Component tilt does cause installation interference of other parts . 3.零件傾斜間距離差 0.8mm The space of tilted component and other parts is greater than 0.8mm . 4.無論何者均拒收 Whichever is rejected . 2004.1.29MFG-000638理想狀況(Target Condition)1.單獨跳線須平貼於機板表面。 Individual route connection is flat in contact wit

35、h board surface . 2.固定用跳線不得浮高,跳線需平貼零 件。 Immobile route connection change cannot be lifted and should be flat in contact with component .2004.1.29MFG-000639允收狀況(Accept Condition)Lh0.8 mmWh0.8 mmX1.0mmY1.0mm1.單獨跳線Lh,Wh0.8mm。 Lh of individual route connection is equal or less than 0.8mm 2.固定用跳線須觸及於被固定零

36、件。 Immobile route connection change shoul be touched and fixed to component fastened . 3.被固定零件浮高0.8mm。(Y0.8mm) The component lifted is equal or less than 0.8m4.固定用跳線投影於PCB後左右偏移量零件孔邊緣1.0mm (X1.0mm)Immobile route connection deflection is 1.0mm equal or less than the edge of supported holes . than edge

37、 of supportied holes .2004.1.29MFG-000640y1.0mmLh0.8 mm Wh0.8 mmX1.0mm拒收狀況(Reject Condition)1.單獨跳線Lh,Wh0.8mm(MI) Lh of individual route connection is greater than 0.8mm . 2.固定用跳線未觸及於被固定零件(MI) Immobile routeconnection does not touch component fastened . 3.被固定零件浮高0.8mm(MI)。(Y0.8mm) The component lifte

38、d is greater than 0.8mm . 4.固定用跳線投影於PCB後左右偏移量零件孔邊緣 1.0mm (MI)。(X1.0mm)2004.1.29MFG-000641理想狀況(Target Condition)1000F 6.3F-1016 +允收狀況(Accept Condition)Lh 0.8mmLh0.8mm 1000F 6.3F-1016+ +1.浮高0.8mm。(Lh0.8mm) Component lifted less than 0.8mm . 2.錫面可見零件腳出孔。 Lead is discernible out of holes on solder surfa

39、ce . 3.無短路。No bridging .1.零件平貼於機板表面。Component is flat in contact with board surface . 2.浮高與傾斜之判定量測應以PCB零 件面與零件基座之最低點為量測依 據。Component lifted and tilted is measured at minimum of component base and PCB surface .2004.1.29MFG-000642拒收狀況(Reject Condition) 1000F 6.3F-1016 + +Lh 0.8mmLh0.8mm1.浮高0.8mm(MI)。(

40、Lh0.8mm) Component lifted greater than 0.8mm 2.零件腳折腳、未入孔、缺件等缺 點影響功能(MA)。 Component required to be mounted off the board is lead bent . Lead is fixed to holes . Component lacking . 3.短路(MA)。Bridging . 4.無論何者均拒收 Whichever is rejected . 2004.1.29MFG-000643理想狀況(Target Condition)CARDabcdLh0.5mm允收狀況(Accep

41、t Condition)CARDabcd1.浮高與傾斜之判定量測應以PCB零件面與零件 基座之最低點為量測依據。Component lifted and tilted is measured at minimum of component base and PCB surface . 2.機構零件基座平貼PCB零件面，無浮高傾斜。 (a,b,c,d四點平貼於PCB）。Mechanical parts base is flat in contact with PCB surface and have no lifted or tilted case .1.短軸a,b兩點平貼PCB或垂直上浮,但c

42、,d兩點浮 高 0.5mm。(Both points a and b on short axis are flat in contact wth PCB or vertically uplifted , but both points c and d are lifted equal or less than 0.5mm . 2.錫面可見零件腳出孔Lead is discernible out of holes on solder surface . 3.無短路。No bridging . 2004.1.29MFG-000644 拒收狀況(Reject Condition)Lh0.3mmCAR

43、Dacdb1.短軸a,b兩點平貼PCB或垂直 上浮, 但c,d兩點浮高0.5mm (Both points a and b on short axis are flat in contact with PCB or vertically uplifted , but both points c and d are lifted greater than 0.5mm . 2.零件腳折腳、未入孔、缺件等缺點影響功能。 Component required to be mounted off the board is lead bent . Lead is not fixed to holes .

44、Component lacking . 3.短路。 Bridging 4.無論何者均拒收 Whichever is rejected .2004.1.29MFG-000645理想狀況(Target Condition)1.零件平貼於PCB零件面Component is properly seated onto PCB surface .2.無傾斜浮件現象。No tilted or lifted case . 3.浮高與傾斜之判定量測應以PCB零件面與零件 基座之最低點為量測依據。Component lifted and tilted is measured at minimum of comp

45、onent base and PCB surface 0.5mm允收狀況(Accept Condition)1.浮高未干涉到組裝且0.5mm Component lifted does not cause installation and is equal or less than 0.5mm . 2.錫面可見零件腳出孔且無短路。 Lead is discernible out of holes on solder surface and no bridging . 2004.1.29MFG-000646 0.5mm拒收狀況(Reject Condition)1.浮高已干涉到組裝0.5mm。

46、Component lifted is greater than 0.5mm and does cause installation interference of other parts . 2.零件腳折腳、未入孔、缺件等缺 點影響功能。 Component required to be mounted off the board is lead bent . Lead is not fixed to holes . Component lacking . 2004.1.29MFG-000647理想狀況(Target Condition) 1000F 6.3F-允收狀況(Accept Con

47、dition) 1000F 6.3F-12120.8mm1.零件平貼 PCB 零件面。Component is properly seated onto PCB surface . 2.無傾斜浮件現象。No tilted or lifted case . 3.浮高與傾斜之判定量測應以PCB零件 面與零件基座之最低點為量測依據。 Component lifted and tilted is measured at minimum of component base and PCB surface 1.零件傾斜與PCB垂直之夾角 12。 The angle () of tilted compone

48、nt and the line perpendicular to PCB is equal or less than 122.傾斜不得觸及其他零件或造成組裝性之干涉 Component tilt does not cause installation interference of other parts . 3.排針頂端最大傾斜不得超過PCB板邊邊緣 The tilt tolerance to the top of pins cannot exceed to the edge of PCB . 2004.1.29MFG-000648拒收狀況(Reject Condition) 1000F 6

49、.3F-120.8mm1.零件傾斜與PCB垂直之夾角 12 The angle () of tilted component and the line perpendicular to PCB is greater than 122.傾斜觸及其他零件或造成組裝性之 干涉。Component tilt does cause installation interference of other parts . 3.排針頂端最大傾斜超過PCB板邊邊緣。 The tilt tolerance to the top of pins exceeds to the edge of PCB . 4.無論何者均

50、拒收 Whichever is rejected .2004.1.29MFG-000649理想狀況(Target Condition)浮高 Lh浮高 Lh1.浮高與傾斜之判定量測應以PCB零件面 與零件基座之最低點為量測依據。 Component lifted and tilted is measured at minimum of component base and PCB surface . 2.CPU Socket平貼於PCB零件面 CPU Socket is flat in contact with PCB urface 傾斜Wh0.5mm浮件Lh0.5mm允收狀況(Accept C

51、ondition)1.量測零件基座與PCB零件面之最大距離 0.5mm. Lifted space between component base and PCB surface is equal or less than 0.5mm .2.錫面可見零件腳出孔。Lead is discernible out of holes on solder surface .3.無短路。(No bridging . )2004.1.29MFG-000650傾斜Wh0.5mm拒收狀況(Reject Condition)1.量測零件基座與PCB零件面之最大 距離0.5mm。Lifted space betwee

52、n component base and PCB surface is greater than 0.5mm . 2.零件腳折腳、未入孔、缺件等缺點 影響功能。Component required to be mounted off the board is lead bent . Lead is not fixed to holes . Component lacking . 3.短路。(Bridging . )4.無論何者均拒收Whichever is rejected . 2004.1.29MFG-000651理想狀況(Target Condition)1.USB,D-SUB,PS/2,

53、K/B Jack,Printer Port,COM Port 平貼於PCB零件面。 USB , D-SUB , PS/2 , K/B Jack , Printer Port ,COM Port is flat in contact with PCB surface .浮高Lh0.5mm允收狀況(Accept Condition)傾斜Wh0.5mm1.量測零件基座與PCB零件面之最大 距離0.5mm。 Lifted space between component base and PCB surface is equal or less than 0.5mm . 2.錫面可見零件腳出孔。 Lea

54、d is discernible out of holes on solder surface .3.無短路。No bridging . 2004.1.29MFG-000652浮高浮高Lh0.5mm傾斜Wh0.5mm拒收狀況(Reject Condition)1.量測零件基座與PCB零件面之最 大距離0.5mm。 Lifted space between component base and PCB surface is greater than 0.5mm . 2.零件腳折腳、未入孔、缺件等缺點影響功能。 Component required to be mounted off the bo

55、ard is lead bent . Lead is not fixed to holes . Component lacking . 3.短路。Bridging . 4.無論何者均拒收 Whichever is rejected .2004.1.29MFG-000653理想狀況(Target Condition)允收狀況(Accept Condition)浮高Lh0.5mm傾斜Wh0.5mm1.Power Connector 平貼於PCB零件 面。 Power Connector is flush with board 1.量測零件基座與PCB零件面之最大 距離0.5mm。 Amount o

56、f tilt and lifted space is not more than 0.5mm . 2.錫面可見零件腳出孔。 Lead is discernible out of holes on solder surface .2004.1.29MFG-000654拒收狀況(Reject Condition)浮高浮高 Lh0.5mm傾斜Wh0.5mm1.量測零件基座與PCB零件面之最大 距離0.5mm。 Amount of tilt and lifted space is greater than 0.5mm . 2.零件腳折腳、未入孔、缺件等缺 點影響功能 Lead is discernib

57、le out of holes on solder surface .3.短路。Bridging . 4.無論何者均拒收 Whichever is rejected . 2004.1.29MFG-000655理想狀況(Target Condition)D1. PIN排列直立 Pins are straight and properly seated . 2.無PIN歪與變形不良。 Pins are not bent . No discernible damage . 允收狀況(Accept Condition)PIN高低誤差0.5mmPIN歪程度 X D1.PIN(撞)歪程度1PIN的厚度(X

58、D) Pins are slightly bent off center by 1 pin thickness or less . 2.PIN高低誤差0.5mm。 Pin height varies within tolerance by 0.5mm or less .2004.1.29MFG-000656拒收狀況(Reject Condition)1.PIN(撞)歪與PIN的高低程度導致排 線無法順利插入且影響測試組裝。 Pin is bent out of alignment and pin height is out of tolerance as to hinder parts ins

59、ertion , testing , and installation . 2.無論何者均拒收 Whichever is rejected . 2004.1.29MFG-000657允收狀況(Accept Condition)1.PIN排列直立無扭轉、扭曲不良 現象。 Pins are straight and not twisted . 2.PIN表面光亮電鍍良好、無毛邊 扭曲不良現象。 Pin surface is well plating . No discernible burr or visibly twisted damage . 2004.1.29MFG-000658拒收狀況(R

60、eject Condition)PIN扭轉.扭曲不良現象1.由目視可見PIN有明顯扭轉、扭 曲不良現象但是不影響測試組裝. Pin visibly twisted but not hinder parts insertion , testing , and installation . 拒收狀況(Reject Condition) PIN有毛邊、表層電鍍不良現象PIN變形、上端成蕈狀不良現象1.連接區域PIN有毛邊、表層電鍍不 良現象.Connecting area burr gotten , and surface is bad plating . 2.PIN變形、無法順利插入Damaged