PCB工程咨询中英文对照总结

1、常见工程咨询中英文对照问题：客户未告知采用什么标准进行制作与检查。建议： 我们按 IPC-6012B Class2与 IPC-A-600G Class2 做。Question 1: Customer doesn ' t tell us what standards we should take to manufacture and inspect. Suggestio n: We will follow IPC-6012B Class2 & IPC-A-600G Class2.问题：客户未告知板料类型。建议：我们将使用FR4.Question: Customer doesn&#

2、39; t tell us material type.Suggestio n: We will use FR4.问题：客户要求成品厚度为1.60+/-0.10mm,此公差对六层板而言太紧，难以控制。建议：将公差放松到+/-0.15mm.Question: Customer requires-0.1.0m+=/” finished board thickness, the toleranee is too tighirsix - layer board., it ' s hard to eontrol for us.Suggestio n: Relax the tolera nee t

3、o be +/-0.15mm.问题：客户未规定使用何种类型的阻焊油及颜色。建议：我们采用普通感光绿色湿油.Question: Customer doesn' t specify solder mask type and color.Suggestio n: We use no rmal gree n LPI.问题：客户未指定UL标记与Date code加于何处及以何种方式显示。建议：见下图，我们将其加于 TOP面，以白字显示。Question: Customer doesn' t specify where and by what display form we should

4、add UL logoand date code.Suggesti on: See below picture, we add them on top side and display them by silk letters.问题：客户要求线路表面油厚为30um min,线路拐角位为20um min,此要求太高。 建议：线路油表面厚与线路拐角位油厚分别放松到15um min与10um min.Question: Solder mask is required to be 30um min over line and 20um min at corners, itSuggestion: Rel

5、ax it to be 15um min over line and 10um min at corners,问题：客户未规定镍金厚度要求。建议： 我们按镍厚2.54um min金厚0.030.08um制作.Question: Customer doesn' t specify thickness of Ni and gold.Suggestion: Ni: 2.54um min and gold: 0.03-0.08um.问题：客户未清楚指明层序。建议：层序为：Question: Customer doesn' t indicate layer sequenee.Sugges

6、tio n: Layer seque nee is问题：客户未规定压板结构。建议：按下图所示做。Question: Customer doesn' t specifp Istyucture.Suggestio n: Follow below picture to do.bring scratchingwidth+0.08mm，问题：客户未规定如何对电测试0K的板加注标记。建议：A)板边划一条黑线。B)板内盖白色的T印。Question: Customer doesn' t specify how to take a mark Test OK ” bo“E.Suggestio n

7、: A) Mark a black line at edge-board.B) Take a white stamp on board.问题：客户未指定V-CUT标准。建议： V-CUT 角度为 30° 土 5°,余厚为 0.40+/-0.10mm。Question: Customer doesn' t spedystandard.Suggestion: V-cut angle: 30 ± 5° , residue thickness: 0.40+/-0.10mm问题：客户未指明斜边标准。建议：按下图所示制作。Question: Customer

8、 doesn' t specify bevel standard.Suggestio n: Follow below picture to do.问题：请看下图，成品板四个角为直角，运输与包装过程中易造成板间擦伤。 建议：A)将直角改成R1.0mm的圆角。B) 不能更改。Question: See below picture, four outer corners are rectangular, sharp corners will betwee n boards duri ng tran sportati on and packagi ng.Suggestion: A) Chang

9、e the rectangular corners into R1.0mm ones.B) Take no cha nge.问题： 板上P/N为ABCD，但客户资料上为 EFG。建议：A )将板上的P/N改为EFG.B) 将文件资料上的 P/N改为ABCD。C) 不予理会。Question: Part number is ABCD on board, but EFG in documents. Suggestio n: A) cha nge ABCD into EFG on board.B) cha nge EFG into ABCD in docume nts.C) Let them be.

10、问题：客户资料上版本为 REV. A，但板上为REV.B。 建议：A)将板上版本改为REV. AoB) 将资料上版本改为REV. B.C) 不需做任何更改，允许版本不一致。Question: Reversion No. is A in documents, but B on board.Suggesti on: A) Change A into B on board.B) Change B into A in docume nts.C) Not take any cha nge, let them be.钻孔部分 问题：客户未规定孔径公差。建议： VIA Hole : +0.08/-0.40m

11、m PTH: +/-0.08mm，NPTH : +/-0.05mm，Slot： len gth+/-0.10mm。Question: Customer doesn' t specify tolerances for holes.Suggestion: VIA Hole：+0.08/-0.40mm PTH：+/-0.08mm，NPTH：+/-0.05mm，Slot：width+0.08mm ， length+/-0.10mm。问题：客供图纸上“ A”处数据与“ B”处数据相矛盾，请看下图。 建议：a)按“ A ”处数据做。b)按“B”处数据做。Question: See below pi

12、cture, the data marked“ A” is conflict with“ B” on the mechanicaSuggestion: a) Follow the data marked“ A” to do.b) Follow the data marked“ B” to do.问题：见下图，图纸上“ A”处数据公差+/-0.05mm,超我司能力。建议： 将其放松到 +/-0.10mm。Question: See below picture, the tolerance(+/0-.05mm) marked“A” is out of our capab.ilitySuggesti

13、on: Relax it to be +/-0.10MM.问题：图纸上“ A”处数据为100.25mm (请看下图)，Gerber中此处实测数据为100.34mm。 建议：a)按图纸做。b)按 Gerber做。Question: See below picture, the data marked “A” is 100.25mm on drawing, but the factual value is 100.34mm in Gerber.Suggestion: a) Follow drawing to do.b) Follow Gerber to do.问题：请看下图，红色圆圈圈住的Slot

14、宽度为0.65mm，长度为12mm。由于长度比较长，不宜钻出。如果锣出，其宽度又比最小锣刀的直径(0.8mm)还小，也无法锣出。建议：将Slot宽度改为0.80mm以便锣出。Question: See below picture, the slot (which is marked with red circle) size is 0.65mmX12mm. As the slot is very long, we have to rout it out, but our smallest rout bti is 0.8mm, it's impossible to rout the sl

15、ot out yet.Suggestion: Change the slot width into 0.8mm.问题：请看下图，一个0.86mm的孔与一个1.23mm的孔相互重叠。建议：A)删去0.86mm的孔。B)删去1.23mm的孔。Question: See below picture, one 0.86mm hole overlaps another 1.23mm hole.Suggestion: A) Delete 0.86mm hole.B) Delete 1.23mm hole.问题：请看下图，两个相同大小的孔部分重叠。建议： 为避免钻板时易断钻嘴，我们将其改作成Slot。Que

16、stion: See below picture, part of one hole overlaps part of another with same size.Suggestion: Change the two holes into a slot to avoid easy disjunction of drill bit during drilling process.问题：图纸中有一类孔为3.20mm,但钻带中却为3.25mm。建议：A)做成3.20mmB)做成 3.25mm Question: The hole size is 3.20mm on drawing, but 3.2

17、5mm in Gerber.Suggestion: A) Make it as 3.20mmB) Make it as 3.25mm.问题：客户要求3.0mmPTH孔完成公差为+0.05/-0mm,此公差超出我司工艺能力建议：将公差放松到+0.10/-0mm。Questi on: Customer requires +0.05/-0mm for 3.0mm PTH, the tolera nee is out of capability Suggestion: Relax it to be +0.10/-0mm.问题：客户没有规定哪些孔为 PTH，哪些孔为NPTH。建议：3.0mm，4.10m

18、m孑L做成NPTH，其余做成PTH。Question: Customer doesn' t indieate which holes are PTH and which holes are NPTH.Suggestio n: 3.0mm,4.10mm holes are made into NPTH, others are made into PTH.问题： 请看下图，“a”处PTH (1.0mm)与“ b”处PTH (2.10mm)的距离只有10mil(我司工艺能力为14mil)，电镀时易渗镀造成两孔短路。建议：A)将两孔分别往相反方向移动 2mil。B)将两孑L Size分别缩小0

19、.05mm,即做成0.95mm与2.05mm。Question: See below picture, the distanee is only 10mil between 1.00mm hole marked “aand 2.10mm hole marked “ b'(it '14mil min distancefor our normal workmanship), the close distancewill easily cause shorts betwee n the two holes in plati ng process.Suggesti on: A) shi

20、ft the two hole 2mil away in dividually towards coun ter-directio ns.B) Reduce 0.05mm for hole sizes, i.e. make them as 0.95mm and 2.05mm.问题：板上没有NPTH,用PTH做锣板定位孔时易损伤孔壁铜。建议：A)请看下图，我们于无铜区补加 3个2.5mm的NPTH做锣板定位孔。B)不允许加NPTH，接受PTH孔铜擦花。Question: There are no NPTHs in board. Hole copper will be easily hurt if

21、 we use PTH as tooling holes in rout ing process.Suggestio n: A) See below picture, we will add three 2.5mm NPTH in copper-free area and use them as tooli ng holes.B) Not permit to add extra NPTH and accept copper wall being hurt.问题：请看下图，两个3.0mm的PTH离板边的距离只有10mil。 建议：A )按Gerber做，允许锣板时破孔。B)将孔往内移动10mil

22、，以免破孔。Questio n: See below picture, two 3.0mm PTH are on ly 10mil away from edge board.Suggestio n: A) Follow Gerber to do and allow broke n holes.B) Shift holes 10mil away towards in side.内层线路部分问题：客户要求的底铜厚为20Z,但最小线宽线距只有5/5mil (我司能力是8/6mil)。 建议：A)将底铜厚改为10 Z。B) 请更改GERBER并重新提供给我们。C) 取消此定单。Question: Cu

23、stomer requires 2OZ base copper, but the minimum line width/spacing in Gerber is5/5mil (It ' s 8/6mil for out capability)Suggestio n: A) Change base copper into 1OZ.B) Please take cha nges for patter ns and send new Gerber to us.C) Can cel this order.问题：见下图，板边一处线路离 Outline只有4mil，锣板时会伤线。建议：将线路内移至

24、离板边12mil。Question: See below picture, there is a line which is only 4mil way from edge board, it will be hurt during routi ng process.Suggestio n: Shift it towards in side 12mil away from edge board.问题：请看下图，3.0mm NPTH钻在铜面上。建议：A )削铜离孔10 12mil，以保证钻后不露铜。B)按原装做，允许钻后露铜。Questio n: See below picture, there

25、 is a 3.0mm NPTH lyi ng in copper pla ne.Suggestion: A) Cut suitable copper and keep copper 10 12mil far away from hole to ensure no copper exposure.B). Follow Gerber and copper exposure is allowable.问题：内层L2与L5完全相同。建议：A)L2与L5完全相同是正确的，依原装做即可。B)L2与L5完全相同是正确的，请提供新GERBER。Question: We find out layer2 is

26、as same as layer5 entirelySuggestio n: A) They are right, just follow Gerber to do.B) They are wrong, please provide us new modified Gerber.问题:POWER层与GROUND层于红圈处短路，请看下图。建议：A）正确，依原装做即可B）错误，请提供新 GERBERoQuesti on: The copper with red circle is short betwee n POWER and GND pla nes, Suggestion: A) It'

27、; s right, just follow Gerber.B) It ' rong, please provide new Gerber.问题：内层上有许多孤立 PAD。建议：A)删孤立PAD，以方便我司生产。B)不可以删，要按 GERBER做。Questio n: There many isolated pads on inner layers.Suggestio n: A) Delete them to ben efit our producti on process.B) Not delete, just follow Gerber.问题：工艺边无铜。建议：A)为平衡压板时的板

28、厚，我们于工艺边加Dummy copper，并将避开外层各种标记。B)不可以加。Questio n: No copper on breakawaySuggesti on: A) To bala nee board thick ness duri ng press ing process, we add dummy copper, the copper will keep away from markings on outer layers.B) Not permit to add extra dummy copper.外层线路问题：客户要求的底铜厚为2OZ,但最小线宽线距只有5/5mil (我

29、司能力是6/6mil)。 建议：A)将底铜厚改为1O Z。B) 请更改GERBER并重新提供给我们。C) 取消此定单。Question: Customer requires 2OZ base copper, but the minimum line width/spacing in Gerber is5/5mil (It s'8/6mil for out capability)Suggestion: A) Change base copper into 1OZ.B) Please take changes and send new Gerber to us.C) Cancel this

30、 order.:问题：板边一处线路离 Outline只有4mil，锣板时会伤线。 建议：将线路内移至离板边 810mil。Question: See below picture, there is a line which is only 4mil way from edge board, it will be hurt during routing process.Suggestion: Shift it towards inside 8-10mil away from edge board.问题：请看下图， 3.0mm NPTH 钻在铜面上。建议：A )削铜离孔8-10mil，以保证干膜圭

31、寸孔。B)依依原装做，允许钻后露铜。Question: See below picture, there is a 3.0mm NPTH lying in copper plane.Suggestion: A) Cut suitable copper and keep copper 8-10mil far away from hole to ensure dry film tenting.B). Follow Gerber and take 2nd drill process, copper exposure is allowable.问题：请看下图， 3.0mm NPTH 离旁边的线路只有

32、4.5mil。建议：移线离孔8mil,以保证干膜封孔及避免伤线。Question: See below picture, 3.0mm NPTH is only 4.5mil far away from adjacent line.Suggestion: Shift the line aside 8mil away from hole to ensure dry film tenting and to avoid line being hurt.问题：请看下图，3.0mm NPTH离旁边的SMD之PAD只有5mil。建议：A)削PAD 2mil以保证干膜封孔。B)依原装做，允许钻后PAD边露铜。

33、Question: See below picture, 3.0mm NPTH is only 5mil far away adjacent pads of SMD. Suggestion: A) Cut 2mil copper of edg-pad to ensure dry film tenting.B) Follow Gerber to do and allow copper exposure of edge-pad.问题： 3.0mm NPTH 上的 PAD 单边比孔大 6mil 。建议：A )删PAD，以保证干膜封孔。B)将PAD加大到单边比孔大12mil，以免二钻时PAD剥离板面。

34、Question: The pad over 3.0MM NPTH is 6mil bigger than hole in all directions. Suggestion: A) Delete the pad to ensure dry film tenting.B) Extend the pad to be 12mil bigger than hole in all directions to avoid pad peeling off board during 2nd drilling process.问题：请看下图，多处 SMD之PAD间距小于7mil，无法印制绿油桥，喷锡时严重将

35、严重短路。 建议：A)适当削PAD将间距加大到8mil，以免喷锡时严重短路。B)将表面处理由喷锡改为沉金。Question: See below picture,the spacings between many pads of SMDs are less than 7mil, it's ito print solder mask between pads, thus serious shorts occur during HASL process.Suggestion: A)Cut suitable copper of pads and extend the spacings to

36、be 8mil.B) Change HASL into immersio n gold.问题：请看下图，KEY PAD要求印碳油，但PAD间间距只有20mil,无法印制。 建议：适当削PAD，将间距加大到26mil.Questi on: See below picture, customer requires us to print carb on oil on key pads, but the spac ings are only 20mil between pads, it ' s hard to achieve.Suggestio n: Cut a little copper

37、of key pad and exte nd the spac ings to be 26mil.问题：此板表面处理为沉金，但板上有KEY PAD。 KEY PAD是不需要焊接的。建议：A)KEY PAD上加印蓝胶。B)不需加印蓝胶。Question: The surface finish is immersion gold, but there are many key pads. Key pads will not be welded duri ng assembly process.Suggestio n: A) Print peelable solder mask on key pad

38、s.B) Not n eed to print solder mask on key pads.问题：客户要求做V-CUT。建议：请看下图，为防止漏 V-CUT，我们补加V-CUT测试线。Questio n: Customer requires us to take V-cut.Suggestio n: See below picture, to avoid V-cut skip we add E-Test patter ns.绿油部分问题：VIA孔两面都没有开窗。 建议：A )依原装做，允许绿油入孔或塞孔。B)补加单边大孔4mil的开窗，不允许绿油入孔。Questi on: Via hole

39、s have no solder mask ope nings on both sides.Suggesti on: A) Follow Gerber and allow solder mask to en ter into or to plug holes.B) Add solder mask ope nings which are 4mil bigger tha n holes in all direct ions and not allow solder mask to en ter into holes.问题：部分VIA孔只有一面开窗。建议：A )依原装做，允许绿油入孔但不塞孔。B)于

40、无开窗的一面补加单边大孔 4mil的开窗，不允许绿油入孔。Questio n: Some via holes only have solder mask ope nings on one side.Suggestio n: A) Follow Gerber to do and allow solder mask to en ter into but not to plug holes.B) Not allow solder mask to enter into holes and add openings which are 4mil bigger than holes in all dire

41、cti ons.问题：VIA孔两面开窗单边大孔只有2mil。建议：A)依原装做，允许绿油入孔但不塞孔B)将开窗加大到加单边大孔 4mil，不允许绿油入孔。Questio n: Solder mask ope nings are only 2mil bigger tha n via holes in all directi ons on both sides. Suggestio n: A) Follow Gerber and allow solder mask to en ter into but not to plug holes.B) Not allow solder mask to en

42、 ter into holes and exte nd ope nings to be 4mil bigger tha n holes in all direct ions.问题：部分插件孔只有一面开窗建议：A)按GERBER做，允许绿油入孔。B)于无开窗的一面补加单边大孔4mil的开窗，不允许绿油入孔。Question: There are solder mask openings over component holes only on one side.Suggestion: A) Follow Gerber and allow solder mask to enter into but

43、 not to plug holes.B) Not allow solder mask to enter into holes and add openings to be 4mil bigger than holes in all directions on another side.问题：客户要求绿油塞孔，但有部分VIA孔离MD之PAD不足6mil，易爆油上PAD。建议：A)接受些许绿油上PAD。B)不接受绿油上PAD，将这些过于靠近SMD PAD的VIA孔补加单边大孔4mil的开窗， 取消塞孔要求。Question: Customer requires us to plug all vi

44、a holes with solder mask, but there are some holes which are only 6mil away from adjacent pads used for welding. Solder mask will splash onto the pads because of high temperature during curing process.Suggestion: A) Follow Gerber and accept solder mask splashing onto pads.B) Not permit solder mask t

45、o splash onto pads and add solder mask openings over the via holes which are less than 6mil far away from adjacent pads.问题：客户提供了 PASTE GERBER，但有一处PASTE缺绿油窗，请看下图。建议：A)此处PASTE补加绿油窗。B)不需补加绿油窗。Question: Customer has provided us paste Gerber, but we find out one of paste have no solder mask opening. See

46、below picture.Suggestion: A) Add solder mask openings for this paste.B) Just follow Gerber and not need to add solder mask opening for this paste.问题：客户提供了 PASTE GERBER，但有一处PASTE形状与对应的绿油窗不一致，请看下图。 建议：A)将绿油窗的形状改做成与 PASTE 一致。B)不需修改绿油窗，按原装做。Question: Customer has provided us paste Gerber, but we find ou

47、t the figure of one paste is different from the corresponding solder mask opening there. See below picture.Suggestion: A) Change the figure of solder mask opening into as that of paste.B) Just follow Gerber and not need to take any change.问题：请看下图，密集蚀刻字开有绿油窗，喷锡后易发生锡堆积，造成字符不清。建议：A)取消绿油窗。B)按GERBER做，允许喷锡后字符不清。Question: