M004雷射钻孔教材

1、Version : 011001-本文件為景碩科技內部教育訓練專用-2021/12/13-1-機台廠商機台廠商型式型式軸軸 vs 床台床台數量數量MitsubishiCO21/14CO22/14CO22/211HitachiCO22/23CO24/24SiemensCO21/13UV1/18Kinsus現有雷射機台數量及型式：現有雷射機台數量及型式：Comment：CO2機台共6種型式29台，UV機台共2種型式8台Version : 011001-本文件為景碩科技內部教育訓練專用-2021/12/13-2-機台光路設計的差異機台光路設計的差異YXGalvano scannerF lensYXW

2、orkLaser beamResonatorTop-hat optic systemImproved energy efficiencyDevelopment of high power resonatorDoubled energyYXEnergy at the processing point is similar to the single machine Beam splitSingle machine2-work machineMaskResonatorGaussian optic systemVersion : 011001-本文件為景碩科技內部教育訓練專用-2021/12/13-

3、3-Hole shape by top hat beamHole shape by gaussian beamAcrylic barn patternResult of energy distribution simulationResinDamage on the internal copperNo damage on the internal copperGaussian beamCopperResinResinCopperTop hat beamVersion : 011001-本文件為景碩科技內部教育訓練專用-2021/12/13-4- tableXYGalvano scannerF

4、lensVision sensorVision sensorGalvano scannerF lensXY tableXYF lensXY tableVision sensorGalvano scannerXY機台型式設計原理比較機台型式設計原理比較Version : 011001-本文件為景碩科技內部教育訓練專用-2021/12/13-5-雷射共振腔Collimation lensMask Laser beamScanning areaf lensGalvano mirrorProtect lensCollimation lens：決定雷射光能量分佈：決定雷射光能量分佈Mask：決定：決定L

5、aser Beam的大小的大小Galvano mirror：決定雷射定位精度：決定雷射定位精度(20um)f lens：使雷射光垂直於工件使雷射光垂直於工件Protect lens：保護：保護f lens主要部品的名稱及功能簡介主要部品的名稱及功能簡介Version : 011001-本文件為景碩科技內部教育訓練專用-2021/12/13-6-Work piece distance flensGalvano mirror決定加工速度的因素有二：Galvano mirror 的定位速度 現有規格：1000Hz/1200Hz/1400HzGalvano mirror 涵蓋的區塊面積 可用規格：10

6、701070mm 現在生產：50mm50mm Area大小對加工有何影響?Version : 011001-本文件為景碩科技內部教育訓練專用-2021/12/13-7-In case of CO2 laser, result of a processing changes by the surface treatment condition of copper foil.Imaging Copper direct BVHConformalProcess 350400450500Diameter (m) Resin Thickness: 50mCopper film : 59mPossible

7、Via-hole Diameter501001502503007002000CO2 laser UV-YAG laser 雷射鑽孔加工方式雷射鑽孔加工方式Version : 011001-本文件為景碩科技內部教育訓練專用-2021/12/13-8-雷射鑽孔加工流程雷射鑽孔加工流程入料取隔紙及板面檢查有無參數通知工程師設定參數測試並新增機台參數是否有程式程式轉檔設定該料號參數檔校正能量設定自動排程生產首件檢驗品質是否正常繼續生產通知工程師處理出貨有無無有是不是PS：1能量校正1次/4HR2精度校正1次/4HR11/10 pnl/pnls2 量測上下孔徑Version : 011001-本文件為景

8、碩科技內部教育訓練專用-2021/12/13-9-Mis-alingmentResin residue on stop padStop pad damageOverhang too big雷射品質項目簡介雷射品質項目簡介Version : 011001-本文件為景碩科技內部教育訓練專用-2021/12/13-10-Optical SystemCameraLaserShutterBeam ExpanderDichroicMirrorMirrorSurfaceDeflection HeadF-ThetaObjectiveQuarter Wave PlateAchromatIlluminationR

9、ingImage section 4.3*2.8 mm. Resolution: 5.5/pixel. Illumination: vertical and 60o, 30o angle diodes lighting. Wavelength:= 880nm. High resolution CCD camera with a PROFIBUS vision sensor model SIMATIC-VS710 from Siemens is used as a processing system. Version : 011001-本文件為景碩科技內部教育訓練專用-2021/12/13-11

10、-X, Y-axes Linear motor with linear scale system to travel the vacuum plate is on the transport unit. Version : 011001-本文件為景碩科技內部教育訓練專用-2021/12/13-12-The 3nd step :Cleaned the bottom side of hole ( Out of Focus ) Resin removeThe 2st step : Copper and fiber cutting process to make the hole shape ( In

11、 Focus )The 1st step : Copper opening and fiber cutting process to make the hole shape ( In Focus )UV雷射鑽孔加工方式雷射鑽孔加工方式Version : 011001-本文件為景碩科技內部教育訓練專用-2021/12/13-13-Theorem9080706050403020100355355106494009400Absorption (%)Wavelength in NanometersCopperDielectricGlassCO2LaserUVLaser10600PS：利用UV Lase

12、r和CO2 Laser的不同波長及其波長對Copper、Glass及Dielectric的不同吸收率，來達到開銅窗及除膠的目的。Version : 011001-本文件為景碩科技內部教育訓練專用-2021/12/13-14-UV和和CO2加工方式比較加工方式比較Version : 011001-本文件為景碩科技內部教育訓練專用-2021/12/13-15-UV和和CO2加工孔徑的比較加工孔徑的比較Throughput V is not including XY-table positioning time, alignment time and L/UL time.01002003004000305080100150UV-YAGCO2Epoxy-resin ： ： 3060mCopper foil : t69mHole diameter (m)Throughput V (holes/sec)200Version : 011001-本文件為景碩科技內部教育訓練專用-2021/12/13-16-1CO2雷射鑽