a在连接器分析中的应用

1、Simwe公开课系列之 Abaqus 在电子连接器分析中的应用主讲人(ID号)：江冰韵2013年01月24日0. Contents1 连接器介绍2 工程分析(CAE)价值和能力3 力学基础4 模型设置及结果判读5 工程案例展示6 致谢page 21. 连接器介绍概述电子连接器（Connector）借助于电信号和机械力作用，使电路导通或换接，主要用于传输电信号或电磁能量。应用在电子等。、笔记本电脑、数码相机、数字电视和汽车塑件(Housing)决定空间，同时对端子接触件等导体零件绝缘。（PBT,PCT,LCP)端子件(Contact/Terminal)是连接器中实现电讯号传送的桥梁，常采用的材料

2、有黄铜、青铜、磷铜和铍铜行业讨论中国连接器page 31. 连接器介绍常见连接器中国:中航光电、永达通讯、航天电器、华丰、富士康科技:JAE、Hirose,美国:3M、Tyco Electronics、Molex、Amphenol、page 4欧洲：ERNI、Harting、Lemo、ODU、1. 连接器介绍设计制造与分析流程制造流程page 51. 连接器介绍设计制造与分析流程FEA works here!Analysis/ simulationFAE/designCustomersMETestingFAE是 Field Application Engineer分析合作流程page 6ass

3、emblyassemblyplatingplatingmoldingmoldingstampingstamping2.工程分析(CAE)价值和能力工程分析(CAE)价值基于design feed forward path, 组织已有设计智慧, 开发战性的通用设计知识与技术开发标准分析手法,增强分析设计效与准确执各项常规验证分析工作，协助PD快速有效开发，低后续可发生的品质风险TECHNICAL SUPPORT.Design concept feasibility .Design optimization . Design check. Design verification . Design

4、trouble shooting . Design improvement.Customers complaint . Improvement of HVM . Knowledge Cenptaegre 7短期高价值工作长期高价值工作2.工程分析(CAE)价值和能力工程分析(CAE)能力 Efficient, computerized, optimized function in the early design stage.FEAVirtual PrototypingBKM based optimizationTestingF電性分析+电磁分析Signal integrity analysi

5、s (SI)+Electromagnetic analysis (EM)page 8Concurrent ProcessTraditional ProcessBKM based designExperimental study冲压+模流分析Stamping Forming (SF) + Housing integrity analysis (HI)Analytical studySimulation based analysis結構分析Structure strengthanalysis (SS)ProductionPrototypeProduct Design2. 工程分析(CAE)价值和能

6、力Structural Analysis Tolerance Analysis Contact Problems (Normal Force) Mating Force & Unmating Force Retention Force Assembly Analysis Plastic Housing Strength Buckling Analysis Kinematics Analysis Vibration/Modal Analysis Dynamic - Drop, Impact Temperature rise Analysis/CFD Analysis Thermal St

7、ress Analysis工程分析(CAE)具体事项Abaqus / Ansys, I-DEAS,CFdesign / FloEFD, Dynaformpage 93.力学基础正向力P(NF)Normal Force正向力P(NF)page 10最大表面应力Smax3.力学基础Normal ForceNFdtSimply supportedLw表明悬臂有降服page 11最大表面应力（Smax)和正向力(NF)求解DimensionNom.E (杨氏模量)kg/mm219700d (量）mm0.36w (悬臂梁宽度）mm0.40t（厚度）mm0.45L （长度）mm6.00ResultsSma

8、x(表面应力）kg/mm2=3dEt/(2L2)133yNF(正向力）kg=dEWt3/4L30.303.力学基础Mating Forcepage 123.力学基础Mating ForceMFYNP480MFXX 方向：MF = N* Cos(A) + m * Cos(90 - A) Y方向:P = N* Cos(90 - A) - m * Cos(A)式1m = N * f式2其中：P _ 正向力；N _ 接触反作用力；力；m _ 摩擦力= N * f；fMF _ 摩擦系数式2中的N 代入式1PCosA + f *Cos(90 - A)CosA + f * SinA求得：MF = Cos(9

9、0 - A) - f *Cos( A) = P * SinA - f *CosA= 1.342 * P» 0.4kgpage 13A=3.力学基础UnMating ForceUMFYNPUMF B=300XX 方向：UMF = N* CosB + m *SinB Y方向:P = N*SinB - m * CosB式1PN =式2SinB - f * CosB其中：P _ 正向力；N _ 接触反作用力； UMF _ 拔出力；m _ 摩擦力= N * f； f _ 摩擦系数式2中的N 代入式1求得：UMF = P* CosB +f *SinB = 2.9PSinB - f * CosBp

10、age 144.模型设置及结果判读材料设置page 154.模型设置及结果判读材料设置International System of units (SI)1.2.3.4.5.6.7.8.9.Mass Force Length Time Stress Density Gkg kg*force(=kg*9.81*103*mm/s2) mms(second) kgf/mm21/9.81*10(-12) KGF SEC2/mm4(=kg/m 9.81N/kg=1kg*force/1kg=9.81*103mm/sResistivityp0=1.7241E-5ohm*mmELECTRICALCONDUCT

11、IVITYICAS%/p0page 164.模型设置及结果判读Normal Force analysisSIM card固定端子倒刺假设刚性面无摩擦page 174.模型设置及结果判读Normal Force analysisA contacts group:Has two pairs of contacts which was staggered each other;Staggered distance = 0.5mmØ Analysis contacts spring rate so that contact deflections could be allocated bet

12、ween upper and lower contacts by their spring rate.Ø No contact sequence analysis because memory card would contact upper and lower contact at the same time. Deciding analysis strategy4.模型设置及结果判读Normal Force analysis1.000.36mmAllocated the deflection averagely to upper and lower contact to do N

13、F analysis.K=296.6gf/mmK=277gf/mmUpper contactLower contact FEM ms and results Contact NF analysisDiscriptionValueGap between upper and lower contacts (mm)0.36Thickness of memory card (mm)1 00Total deflection of uppler and lower contacts (mm)0.64mmMemory card Contact deflection TA4.模型设置及结果判读Normal F

14、orce analysisK1D1D2K2Memory cardDiscriptionValueTotal deflection of uppler and lower contacts (mm)0.64Upper contact spring rate: K1 (gf/mm)296.60Lower contact spring rate: K2 (gf/mm)277.00Upper contact deflection: D1 (mm)0.31Lower contact deflection: D2 (mm)0.33Total deflection = 0.65mm K1=296.6gf/m

15、m K2=277gf/mm-D1+D2 = Total deflection = 0.64mm K1·D1 = K2·D2 Deflection allocated by spring rate4.模型设置及结果判读Mating Force analysis是不是P 和C 越大越容易收敛？page 214.模型设置及结果判读Mating Force analysisCPU time (s)CPU time (s)p0c0Key message: 固定 C0, P0 值越大,越接近hard contact, 收敛速度越慢； 固定 P0, 需选择合適的 C0 值才能加快收敛速度

16、。MF/UF analysis mc0 and p0 are the values for this surface behaviors parameter, we can tune these values to solve convergence problem or get a more efficiency analysisParameter settingPRESSURE-OVERCLOSURE parameterCPU Time (s)HARDEXPONENTIALc0P0Case1V937Case20.00251000634Case30.0025500588Case40.0025

17、2000777Case50.0051000734Case60.0011000638Ø 1. PRESSURE-OVERCLOSURE=EXPONENTIAL parameter effect4.模型设置及结果判读Mating Force analysis 分別加 Type=surface to surface 和 Stabilize 進行模擬分析Key message: 增加 Type=surface to surface 参数会大大增加計算時間(2.65倍)，且計算結果不合理: 纯摩擦阶段与拔出行程的力量不相等; 增加 Stabilize 参数后，计算时间是原來的1.22倍，且在收

18、敛计算结果与原来的偏差很大。的区域Parameter settingAdditional parametersPRESSURE-OVERCLOSURE para.CPU Time (s)Increment (times)HARDEXPONENTIALc0P0Case30.0025500588type=surface to surface0.002550015562.65Stabilize0.00255007171.22Ø 2. Effect of “Type=surface to surface” and “Stabilize”使用Hard 或 Exponential 時，计算结果相

19、近: 在纯摩擦阶段数值相等，其它情況下 Exponential 计算结果稍大。Ø 1. PRESSURE-OVERCLOSURE=EXPONENTIAL parameter effect4.模型设置及结果判读结果处理RF1,2,3U1,2,3Combine( )Smooth ()+ , Xpage 244.模型设置及结果判读结果处理CNT 3(Ground)CNT 3(Right)CNT 2(Left)Start position: 0mmCNT4(Detect)CNT 1(Mic)End position: 13mmDummy PinCNT1作用区域 CNT3 作用区域CNT4 作

20、用区域Dummy pin 作用区域CNT2 作用区域Touch CNT 2Touch dummy pinTouch CNT3(Right)Touch CNT3(Ground)Touch CNT1Stroke (mm)0Insertion/Withdraw Stroke Sketch-Map Insertion strokes sequence analysis4.模型设置及结果判读结果处理FEM min ABAQUSDummy pinCNT 2(Left)CNT 3CNT 1(Mic)Dummy pinCNT 1(Mic)CNT 2(Left)CNT 3MF/UF Stroke curves

21、FEM ms Simulation results4.模型设置及结果判读结果处理CNT1接触起点CNT3接触起点CNT4接触起点Dummy pin接触起点CNT2接触起点Start positionEnd positionStroke (mm)0Combination method:Align the MF/UF curves according their strokes sequence, and add allMF/UF values in same stroke positions. Total MF/UF combination4.模型设置及结果判读结果处理Total Force S

22、troke CurveStart positionEnd positionStroke (mm)013 Total MF/UF combination5. 工程案例展示cableMF&UMF for the Latchpage 295. 工程案例展示 DC JACKMF&UMF Evaluation大圆弧折弯端子件冲压成形对钣金材料性能有影响吗?Page: 1/7page 305. 工程案例展示冲压成形对端子机械性能的影响NF分析準確度探討Page:15. 工程案例展示Electrical-thermal coupled simulaPower transfer connect

23、orMesh of the connection contacts1.of the contacts will transfer electrical energy intoheat.I=0.5 AT=24.3o CElement Type:DC3D8EV=0.0 T=25.3o C2. Material Properties:Conductivity（热传导系数）, Electrical Conductivity（电传导系数）,热容（瞬态求解时）Joule Heat Fraction, Film Property.Transient Temp. ContourSteady State Tem

24、p. ContourHighest 35.6o C23.3o C25.3o Cheat transferpage 323D 单元: DC3D8 Et连io接n单元: DC1D2E5. 工程案例展示Electrical-thermal coupled simulationElectric properties导电系数是材料电阻率的倒数:1rKe =常用IACS%表示金属材料的导电能力，即该材料导电 率与退火纯铜导电率58000/(ohm*mm)的比值百分比。举例:C5191R-H的 IACS%=14%， Ke = 0.14*58000=8120 /(ohm*mm)C2680RH的 IACS%=29%， Ke=0.29*58000= 16820/(ohm*mm) Joule Heat Fraction 电转热比例page 335. 工程案例展示Electrical-thermal coupled simulation1.把网格从几何体上分离出来，单独成为Part.举例2.建立连接单元，并量测其长度L L由公式:3.Beam 连接单元类型:DC1D2E, 并设定其截面积A mm2和可以計算得到 Ke = 785(1/Wmm)4.计算beam电传导系